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1. 发明授权

US11335509B2 Multilayer ceramic capacitor 有权
公开(公告)号：US11335509B2
公开(公告)日：2022-05-17
申请号：US16788345
申请日：2020-02-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Takehisa Sasabayashi , Akitaka Doi , Kotaro Shimizu , Yoko Okabe
IPC分类号： H01G4/30 , H01G4/02 , H01G4/12 , H01G4/012
摘要： A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 μm or more and about 1.5 μm or less, and having a maximum diameter of about 5.0 μm or less.

2. 发明授权

US09530565B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US09530565B2
公开(公告)日：2016-12-27
申请号：US14517957
申请日：2014-10-20
申请人： Murata Manufacturing Co., Ltd.
发明人： Takayuki Kayatani , Yoshikazu Sasaoka , Kotaro Shimizu , Yasunori Taseda , Shinichiro Kuroiwa
IPC分类号： H01G4/232 , H01G4/30 , H01C7/00
CPC分类号： H01G4/232 , H01C7/008 , H01G4/30
摘要： An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μm2 or larger.
摘要翻译：电子部件具有约0.6mm至约1.0mm×约0.3mm至约0.5mm×约0.07mm至约0.15mm的尺寸（长×宽×厚）。由第一假想直线限定的三角形区域与位于宽度方向中心并沿长度方向延伸的第一主表面的外部电极的一部分的顶部接触，第二假想直线与位于宽度方向中心的第一端面的外部电极的一部分的顶部接触，并且在厚度方向上延伸，并且第三假想直线与中心的外部电极接触宽度方向相对于第一和第二假想直线倾斜约45°，为约450μm2以上。

3. 发明授权

US09478369B2 Aligning device 有权
标题翻译：对齐设备
公开(公告)号：US09478369B2
公开(公告)日：2016-10-25
申请号：US14488448
申请日：2014-09-17
申请人： Murata Manufacturing Co., Ltd.
发明人： Kotaro Shimizu , Masaharu Sano
IPC分类号： B23P19/00 , H01G13/00
CPC分类号： H01G4/30 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/49002 , Y10T29/49778
摘要： In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. The alignment object is transferred from the cavity of said first jig to a cavity of said second jig.
摘要翻译：在对准装置中，在平面图中，第一传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域以预定间隔位于第一传送夹具的第一凹部内。第二传送夹具的第一凹部允许第二传送夹具的第二凹部的整个区域以预定间隔位于第二传送夹具的第一凹部内。当第一传送夹具和第二传送夹具彼此重叠时，第二传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域位于第二传送夹具的第一凹部内预定的间隔。对准物体从所述第一夹具的空腔传送到所述第二夹具的空腔。

4. 发明授权

US09520232B2 Multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US09520232B2
公开(公告)日：2016-12-13
申请号：US14674373
申请日：2015-03-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Kotaro Shimizu
IPC分类号： H01G4/248 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/30 , H01G4/232
CPC分类号： H01G4/008 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1245 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.
摘要翻译：一种多层陶瓷电子部件，其具有外部电极，每个外部电极包括设置在陶瓷多层体的端面上的端面外部电极和通过溅射法形成在所述陶瓷多层体的侧面上的侧面外部电极，并且电连接到端面外电极。与陶瓷多层体接触的每个侧面外电极的溅射电极层由含有3质量％以上的标准氧化还原电位为-2.36〜-0.74V的金属的材料构成，并且作为每个侧面外电极的最外层的最外溅射电极层由Sn和Bi中的至少一种或含有5质量％以上的Sn和Bi中的至少一种的合金构成。

5. 发明申请

US20150279567A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：单晶陶瓷电子元件
公开(公告)号：US20150279567A1
公开(公告)日：2015-10-01
申请号：US14674283
申请日：2015-03-31
申请人： Murata Manufacturing Co., Ltd.
发明人： YASUHIRO NISHISAKA , Kotaro Shimizu
IPC分类号： H01G4/248 , H01G4/012 , H01G4/12 , H01G4/30
CPC分类号： H01G4/248 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1245 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about −2.36 V to about −0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.
摘要翻译：外电极包括布置在陶瓷多层体的端面上的端面外电极和陶瓷多层体的侧面的侧面外电极，侧面外电极与端面外电极电连接。与陶瓷多层体接触的侧面外电极的溅射电极层由含有约-2.36V至约-0.74V的标准氧化还原电位的金属的材料构成，材料中金属的比例为约3质量％以上。用作侧面外电极的最外层的溅射的最外电极层由氢溶液的热量约为23.8kJ / molH以上的金属或合金构成。

6. 发明授权

US10418190B2 Electronic component manufacturing method and film forming apparatus 有权
公开(公告)号：US10418190B2
公开(公告)日：2019-09-17
申请号：US14825013
申请日：2015-08-12
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Kotaro Shimizu , Toshiki Miyazaki
IPC分类号： H01G13/00 , H01G4/12 , H01G4/30
摘要： An electronic component manufacturing method includes inserting an electronic component base body, which has a substantially rectangular parallelepiped shape and paired opposing end surfaces, paired opposing lateral surfaces connecting the end surfaces, and paired opposing principal surfaces perpendicular to the end surfaces and the lateral surfaces and connecting the end surfaces, in a receiving portion of a component holder. The receiving portion defining an accommodation space that is capable of receiving the electronic component base body, forming an oleophobic film over the surfaces of the electronic component base body by exposing the surfaces of the electronic component base body inserted in the receiving portion to gas containing an oleophobic material, taking out the electronic component base body, which includes the oleophobic film formed thereon, from the receiving portion, and forming outer electrodes on the electronic component base body having been taken out.

7. 发明授权

US09131625B2 Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件，存储在磁带中的一系列电子部件以及多层陶瓷电子部件的制造方法
公开(公告)号：US09131625B2
公开(公告)日：2015-09-08
申请号：US14520388
申请日：2014-10-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Kotaro Shimizu
IPC分类号： H05K1/18 , H01G4/30 , H01G4/012 , H01G4/12 , H01G4/248 , H01F27/28 , H01L41/047 , H01C7/00 , H01C1/148 , H01C17/00 , H01L41/22 , H01F41/32 , H01G13/00 , H01F5/00
CPC分类号： H05K1/185 , H01C1/148 , H01C7/008 , H01C17/00 , H01F5/00 , H01F17/0013 , H01F27/2804 , H01F27/292 , H01F41/32 , H01F2027/2809 , H01G4/012 , H01G4/1209 , H01G4/232 , H01G4/248 , H01G4/30 , H01G13/00 , H01L41/0472 , H01L41/0477 , H01L41/22 , H01L41/293
摘要： In a multilayer ceramic electronic component, a size of a step portion on a first main surface and a size of a step portion on a second main surface are different from each other. A first outer electrode includes a plating film containing Cu. A length of a portion of the plating film containing Cu that is positioned on the first main surface in a length direction and a length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other.
摘要翻译：在多层陶瓷电子部件中，第一主表面上的阶梯部的尺寸和第二主面上的台阶部的尺寸彼此不同。第一外电极包括含有Cu的镀膜。包含位于长度方向上的第一主表面上的Cu的电镀膜的一部分长度方向上的含有位于第二主表面上的含有Cu的部分的电镀膜的长度不同于彼此。

8. 发明授权

US09934908B2 Aligning device and method for producing electronic component using the aligning device 有权
公开(公告)号：US09934908B2
公开(公告)日：2018-04-03
申请号：US15267555
申请日：2016-09-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Kotaro Shimizu , Masaharu Sano
IPC分类号： B23Q17/00 , H01G4/30 , H01G13/00 , H01G4/12
CPC分类号： H01G4/30 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/49002 , Y10T29/49778
摘要： In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig.

9. 发明授权

US09520237B2 Monolithic ceramic electronic component 有权
标题翻译：单片陶瓷电子元件
公开(公告)号：US09520237B2
公开(公告)日：2016-12-13
申请号：US14674283
申请日：2015-03-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Kotaro Shimizu
IPC分类号： H01G4/248 , H01G4/012 , H01G4/12 , H01G4/30 , H01G4/232
CPC分类号： H01G4/248 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1245 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about −2.36 V to about −0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.
摘要翻译：外电极包括布置在陶瓷多层体的端面上的端面外电极和陶瓷多层体的侧面的侧面外电极，侧面外电极与端面外电极电连接。与陶瓷多层体接触的侧面外电极的溅射电极层由含有约-2.36V至约-0.74V的标准氧化还原电位的金属的材料构成，材料中金属的比例为约3质量％以上。用作侧面外电极的最外层的溅射的最外电极层由氢溶液的热量约为23.8kJ / molH以上的金属或合金构成。

10. 发明申请

US20150279562A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US20150279562A1
公开(公告)日：2015-10-01
申请号：US14674373
申请日：2015-03-31
申请人： Murata Manufacturing Co., Ltd.
发明人： YASUHIRO NISHISAKA , Kotaro Shimizu
IPC分类号： H01G4/008 , H01G4/248 , H01G4/012 , H01G4/30 , H01G4/12
CPC分类号： H01G4/008 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1245 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.
摘要翻译：一种多层陶瓷电子部件，其具有外部电极，每个外部电极包括设置在陶瓷多层体的端面上的端面外部电极和通过溅射法形成在所述陶瓷多层体的侧面上的侧面外部电极，并且电连接到端面外电极。与陶瓷多层体接触的每个侧面外电极的溅射电极层由含有3质量％以上的标准氧化还原电位为-2.36〜-0.74V的金属的材料构成，并且作为每个侧面外电极的最外层的最外溅射电极层由Sn和Bi中的至少一种或含有5质量％以上的Sn和Bi中的至少一种的合金构成。

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