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1. 发明申请

US20210387923A1 BONDED SUBSTRATE 有权
公开(公告)号：US20210387923A1
公开(公告)日：2021-12-16
申请号：US17460694
申请日：2021-08-30
申请人： NGK INSULATORS, LTD.
发明人： Takashi EBIGASE , Izumi MASUDA
IPC分类号： C04B37/02 , B23K1/19 , B23K1/20 , B23K35/00 , B23K35/02
摘要： Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented. A bonded substrate includes a silicon nitride ceramic substrate, a copper plate, and a bonding layer. The copper plate and the bonding layer are disposed on the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the silicon nitride ceramic substrate. The bonding layer includes: an interplate portion between the silicon nitride ceramic substrate and the copper plate; and a protruding portion protruding from between the silicon nitride ceramic substrate and the copper plate. Exposure of the silicon nitride ceramic substrate is prevented at a position where the protruding portion is disposed.

2. 发明申请

US20220285238A1 BONDED SUBSTRATE AND BONDED SUBSTRATE MANUFACTURING METHOD 有权
公开(公告)号：US20220285238A1
公开(公告)日：2022-09-08
申请号：US17752937
申请日：2022-05-25
申请人： NGK INSULATORS, LTD.
发明人： Takashi EBIGASE , Izumi MASUDA , Takeshi KAKU
IPC分类号： H01L23/15 , H01L23/373 , H05K1/03 , C04B35/584
摘要： The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 μm or more and 20 μm or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.

3. 发明申请

US20140292158A1 LAMINATED BODY AND PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT 有权
标题翻译：层压体和压电/电化学元件
公开(公告)号：US20140292158A1
公开(公告)日：2014-10-02
申请号：US14225909
申请日：2014-03-26
申请人： NGK Insulators, Ltd.
发明人： Izumi MASUDA , Naoki OGAWA , Takaaki KOIZUMI
IPC分类号： H01L41/047 , B32B3/26
CPC分类号： H01L41/047 , B32B3/26 , B32B3/263 , B32B15/08 , B32B27/30 , B32B2255/00 , B32B2457/00 , H01L41/081 , H01L41/0973 , H01L41/29 , Y10T428/24545
摘要： A laminated body has a substrate and a metallic layer. The substrate is composed of an inorganic material. The metallic layer is disposed on the substrate. One of the substrate and the metallic layer has a main body portion and a plurality of protruding portions. The protruding portions are formed on the main body portion. The protruding portions are embedded in the other of the substrate and the metallic layer. An outer diameter of each of the protruding portions is configured to decrease towards the main body portion.
摘要翻译：层叠体具有基板和金属层。基材由无机材料构成。金属层设置在基板上。基板和金属层中的一个具有主体部分和多个突出部分。突出部分形成在主体部分上。突出部分嵌入基板和金属层的另一个中。每个突出部分的外径被构造成朝向主体部分减小。

4. 发明申请

US20220030708A1 BONDED SUBSTRATE AND MANUFACTURING METHOD OF BONDED SUBSTRATE 有权
公开(公告)号：US20220030708A1
公开(公告)日：2022-01-27
申请号：US17494891
申请日：2021-10-06
申请人： NGK INSULATORS, LTD.
发明人： Takashi EBIGASE , Izumi MASUDA , Takeshi KAKU
IPC分类号： H05K1/03 , C04B37/02 , H01L23/15 , H01L23/373 , H05K3/38
摘要： A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 μm. The second main surface extends beyond the extended plane of the first portion by a distance of 10 μm or more.

5. 发明申请

US20160099400A1 CERAMIC DEVICE AND PIEZOELECTRIC DEVICE 有权
标题翻译：陶瓷器件和压电器件
公开(公告)号：US20160099400A1
公开(公告)日：2016-04-07
申请号：US14969313
申请日：2015-12-15
申请人： NGK INSULATORS, LTD.
发明人： Masayuki UETANI , Takaaki KOIZUMI , Izumi MASUDA , Takeshi KAKU
IPC分类号： H01L41/047 , H01L41/083
CPC分类号： H01L41/0472 , H01L41/0477 , H01L41/083 , H01L41/273
摘要： A piezoelectric device is a fired body including a body part 10 and external electrodes 21 and 22. A surface of the side electrode 22 is comprised only of a material for the side electrode 22. On a surface of the surface electrode 21 or a surface of a connection portion where the surface electrode 21 and the side electrode 22 are connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrode 21 is provided. A region, on the surface of the surface electrode 21, farther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrode 21 is exposed.
摘要翻译：压电装置是包括主体部分10和外部电极21和22的烧制体。侧面电极22的表面仅由侧面电极22的材料构成。在表面电极21的表面或设置表面电极21和侧面电极22彼此连接的连接部，沿着连接部沿着表面电极21的厚度方向延伸并伸出的方向延伸的突起h。表面电极21的表面电极21的表面比突起h更远离连接部分的区域散布有多个暴露部分，每个露出部分具有比表面电极材料低的焊料润湿性的陶瓷材料的表面 21暴露。

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