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1. 发明授权

US11581699B2 Semiconductor device and method of manufacturing the semiconductor device 有权
公开(公告)号：US11581699B2
公开(公告)日：2023-02-14
申请号：US17319678
申请日：2021-05-13
申请人： NICHIA CORPORATION
发明人： Shohei Itonaga , Eiichiro Okahisa
IPC分类号： H01S5/022 , H01S5/0237 , B41M3/00 , B23K1/00 , H01S5/02216 , B23K101/40
摘要： A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.

2. 发明授权

US10833473B2 Semiconductor device, semiconductor device package, and manufacturing methods thereof 有权
公开(公告)号：US10833473B2
公开(公告)日：2020-11-10
申请号：US16365580
申请日：2019-03-26
申请人： NICHIA CORPORATION , SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
IPC分类号： H01S5/022 , H01S5/40 , H01S5/024
摘要： A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

3. 发明授权

US10522969B2 Light-emitting device and lid body used in light-emitting device 有权
公开(公告)号：US10522969B2
公开(公告)日：2019-12-31
申请号：US16164588
申请日：2018-10-18
申请人： NICHIA CORPORATION , SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takuya Hashimoto , Kazuma Kozuru , Eiichiro Okahisa , Katsuya Nakazawa , Makoto Kubota
IPC分类号： H01S5/40 , H01S5/022 , H01S5/042
摘要： A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.

4. 发明授权

US09318871B2 Semiconductor laser device and manufacturing method thereof, and submount manufacturing method 有权
公开(公告)号：US09318871B2
公开(公告)日：2016-04-19
申请号：US14261520
申请日：2014-04-25
申请人： NICHIA CORPORATION
发明人： Hiroki Sakata , Hiroaki Yuto , Eiichiro Okahisa , Kazuma Kozuru
IPC分类号： H01S3/04 , H01S5/024 , H01S5/022 , H01S5/323
CPC分类号： H01S5/02469 , H01L2224/48091 , H01L2924/12044 , H01S5/02212 , H01S5/02236 , H01S5/02256 , H01S5/02276 , H01S5/02476 , H01S5/32341 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

5. 发明授权

US11428382B2 Light-emitting device 有权
公开(公告)号：US11428382B2
公开(公告)日：2022-08-30
申请号：US17185640
申请日：2021-02-25
申请人： NICHIA CORPORATION
发明人： Seiji Kiyota , Kazuma Kozuru , Eiichiro Okahisa
IPC分类号： F21V5/00 , F21V5/04 , G02B19/00 , G02B3/00 , H01S5/40 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/02345
摘要： A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements disposed in a row direction and in a column direction on an upper surface of the base; a plurality of pairs of wires that penetrate the side wall in the row direction; and a lens array fixed to the substrate, the lens array comprising a plurality of lens sections disposed in the row direction and in the column direction above the plurality of semiconductor laser elements. Each laser beam that is emitted from the semiconductor laser elements and is incident on a light incident surface of the lens array has a beam shape with a greater width in the column direction than in the row direction.

6. 发明授权

US10608406B2 Light emitting device 有权
公开(公告)号：US10608406B2
公开(公告)日：2020-03-31
申请号：US16203477
申请日：2018-11-28
申请人： NICHIA CORPORATION
发明人： Takuya Hashimoto , Eiichiro Okahisa
IPC分类号： H01L23/00 , H01S5/022 , H01S5/024 , H01S5/00 , H01L33/58 , H01L27/146 , H01L33/48
摘要： A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.

7. 发明授权

US10215362B2 Light source apparatus with lens array 有权
公开(公告)号：US10215362B2
公开(公告)日：2019-02-26
申请号：US14979832
申请日：2015-12-28
申请人： NICHIA CORPORATION
发明人： Seiji Nagahara , Eiichiro Okahisa
IPC分类号： F21K9/64 , F21V5/00 , F21V5/04 , F21Y103/10 , F21Y115/30
摘要： A light source apparatus includes two or more light sources placed in one direction, and an array lens having two or more lenses, which corresponds to each of the light sources. In order to condense a light emitted from each of the lenses into one position, in a first lens in each of the lenses, an optical axis of the light source which corresponds to the first lens is shifted from an optical axis of said first lens in said one direction. The first lens is formed such that a length from the optical axis to one end of said first lens in the one direction is longer than a length from the optical axis to another end of the first lens in a direction which is opposite to the one direction.

8. 发明授权

US09459520B2 Light source unit and optical engine 有权
公开(公告)号：US09459520B2
公开(公告)日：2016-10-04
申请号：US14449085
申请日：2014-07-31
申请人： Nichia Corporation
发明人： Seiji Nagahara , Takashi Sasamuro , Eiichiro Okahisa
IPC分类号： G03B21/20 , G02B27/10 , H04N9/31 , G03B33/08 , H01S5/022 , H01S5/40 , F21V8/00 , G02B26/00 , H01S5/00
CPC分类号： G03B21/204 , G02B6/0096 , G02B26/008 , G02B27/102 , G03B21/208 , G03B33/08 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02276 , H01S5/4012 , H01S5/4018 , H01S5/4025 , H01S5/4056 , H04N9/3114 , H04N9/3158 , H04N9/3161
摘要： Provided is a light source unit that includes: one or more kinds of phosphor; a substrate, on which the one or more kinds of phosphor is applied; a plurality of semiconductor laser elements arrayed at a predetermined interval in a package, wherein each of the semiconductor laser elements emits a laser light beam through a light emission region; and a first optical system that comprises a first lens system, a multiplexing optical member having a light entering surface and a light exiting surface, and a second lens system, wherein the first optical system directs the laser light beams emitted from the respective semiconductor laser elements toward the substrate, the first lens system receives the laser light beams emitted from the respective semiconductor laser elements directly without substantial parallelization of the respective received laser light beams, and condenses the received laser light beams on the light entering surface of the multiplexing optical member, the multiplexing optical member multiplexes the laser light beams condensed by the first lens system, into a multiplexed laser light beam having a spatially-uniform intensity distribution, and the second lens system condenses the multiplexed laser light beam that has exited from the light exiting surface of the multiplexing optical member onto the one or more kinds of phosphor.

9. 发明授权

US09077138B2 Semiconductor laser device 有权
标题翻译：半导体激光器件
公开(公告)号：US09077138B2
公开(公告)日：2015-07-07
申请号：US13748194
申请日：2013-01-23
申请人： NICHIA CORPORATION
发明人： Eiichiro Okahisa
IPC分类号： H01S3/04 , H01S5/022 , H01S5/024
CPC分类号： H01S5/02236 , H01L2224/48091 , H01S5/02212 , H01S5/024 , H01S5/02469 , H01S5/02476 , H01S5/32341 , H01L2924/00014
摘要： A semiconductor laser device having stable heat dissipation property is provided. The semiconductor laser device includes a semiconductor laser element, a mounting body on which the semiconductor laser element is mounted, and a base body connected to the mounting body. The base body has a recess configured to engage with the mounting body and a through portion penetrating through a part of a bottom of the recess. In the specification, the remainder, which is a part of the bottom of the recess except for the through portion has a thickness equal or less than half of the largest thickness of the base body. The lowermost surface of the mounting body is spaced apart from the lowermost surface of the base body through the remainder.
摘要翻译：提供具有稳定散热性能的半导体激光器件。半导体激光装置包括半导体激光元件，安装有半导体激光元件的安装体以及与安装体连接的基体。基体具有凹部，该凹部构造成与安装体接合并穿过贯穿凹部的底部的一部分的贯穿部。在说明书中，作为除了贯通部以外的凹部的一部分的其余部分的厚度等于或小于基体的最大厚度的一半。安装体的最下表面通过其余部分与基体的最下表面间隔开。

10. 发明授权

US11149917B2 Light-emitting device 有权
公开(公告)号：US11149917B2
公开(公告)日：2021-10-19
申请号：US16297415
申请日：2019-03-08
申请人： NICHIA CORPORATION
发明人： Seiji Kiyota , Kazuma Kozuru , Eiichiro Okahisa
IPC分类号： F21V5/00 , F21V5/04 , G02B19/00 , G02B3/00 , H01S5/40 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/02345
摘要： A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

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