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1. 发明授权

US11749777B2 Method for manufacturing light-emitting module 有权
公开(公告)号：US11749777B2
公开(公告)日：2023-09-05
申请号：US16859039
申请日：2020-04-27
申请人： NICHIA CORPORATION
发明人： So Sakamaki
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L33/0095 , H01L25/0753 , H01L2933/0058 , H01L2933/0066
摘要： A method for manufacturing a light-emitting module, includes placing a light-emitting element on a support member with an electrode formation surface of the light-emitting element facing upward; forming a pair of first conductive members respectively on the element electrodes; forming a first light-reflective resin layer on the support member and around the light-emitting element and the first conductive members; forming a pair of second conductive members on the first light-reflective resin layer and respectively on the first conductive members, the second conductive member being wider than the first conductive member; forming a second light-reflective resin layer on the first light-reflective resin layer and around the second conductive members; forming wiring electrodes over the second light-reflective resin layer from the second conductive members; and removing the support member.

2. 发明授权

US11640957B2 Light emitting module 有权
公开(公告)号：US11640957B2
公开(公告)日：2023-05-02
申请号：US17116531
申请日：2020-12-09
申请人： NICHIA CORPORATION
发明人： So Sakamaki , Yasunori Nagahama , Masahiko Sano , Katsuyoshi Kadan
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/60 , H01L33/00
摘要： A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.

3. 发明授权

US10892255B2 Method of manufacturing light emitting module 有权
公开(公告)号：US10892255B2
公开(公告)日：2021-01-12
申请号：US16454906
申请日：2019-06-27
申请人： NICHIA CORPORATION
发明人： So Sakamaki , Yasunori Nagahama , Masahiko Sano , Katsuyoshi Kadan
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/60 , H01L33/00
摘要： A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.

4. 发明授权

US12027501B2 Surface light source and method of manufacturing surface light source 有权
公开(公告)号：US12027501B2
公开(公告)日：2024-07-02
申请号：US17219221
申请日：2021-03-31
申请人： NICHIA CORPORATION
发明人： Katsuyoshi Kadan , So Sakamaki , Masayuki Eguchi
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/62 , H01L2933/0066
摘要： A method of manufacturing a surface light source includes providing an intermediate structure body that includes a composite board including a supporting member and a wiring layer disposed on the supporting member and includes a plurality of light-emitting elements disposed apart from each other on the wiring layer of the composite board, disposing a plurality of covering members apart from each other to cover upper surfaces and lateral surfaces of the light-emitting elements and portions of the composite board around the light-emitting elements, disposing a light-shielding member such that a gap between the covering members is filled, removing the covering members to form a plurality of hole portions, and disposing a light-transmissive member in the hole portions.

5. 发明授权

US11777069B2 Light-emitting module 有权
公开(公告)号：US11777069B2
公开(公告)日：2023-10-03
申请号：US18048404
申请日：2022-10-20
申请人： NICHIA CORPORATION
发明人： So Sakamaki
IPC分类号： H01L33/62 , H01L33/50
CPC分类号： H01L33/62 , H01L33/502
摘要： A light emitting module includes a board, light sources, first and second wirings, and an insulating member. Each of the light sources includes first and second electrodes exposed from an upper side. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The insulating member covers the first wiring and the second extending portions of the second wiring while a portion of each of the second extending portions of the second wiring is exposed from the insulating member through a corresponding one of the openings. The second connecting portions of the second wiring are arranged on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring. The second connecting portions of the second wiring are respectively connected to the second extending portions at the openings.

6. 发明授权

US11508891B2 Method of manufacturing light-emitting module 有权
公开(公告)号：US11508891B2
公开(公告)日：2022-11-22
申请号：US17161402
申请日：2021-01-28
申请人： NICHIA CORPORATION
发明人： So Sakamaki
IPC分类号： H01L33/62 , H01L33/50
摘要： A method of manufacturing a light-emitting module according includes providing an intermediate structure, the intermediate structure including a board, and a plurality of light sources, and forming first and second wirings on an upper surface of the intermediate structure. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The forming of the first and second wirings includes forming the first extending portions and the first connecting portions and the second extending portions, forming an insulating member covering at least the first connecting portions while at least a portion of each of the second extending portions is exposed from the insulating member, and forming the second connecting portions on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring.

7. 发明申请

US20200006296A1 METHOD OF MANUFACTURING LIGHT EMITTING MODULE 审中-公开
公开(公告)号：US20200006296A1
公开(公告)日：2020-01-02
申请号：US16454906
申请日：2019-06-27
申请人： NICHIA CORPORATION
发明人： So Sakamaki , Yasunori Nagahama , Masahiko Sano , Katsuyoshi Kadan
IPC分类号： H01L25/075 , H01L33/00 , H01L33/50 , H01L33/60 , H01L33/62
摘要： A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element, on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.

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