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1. 发明授权

US11131433B2 Fluorescent module and illumination device 有权
公开(公告)号：US11131433B2
公开(公告)日：2021-09-28
申请号：US16536005
申请日：2019-08-08
申请人： NICHIA CORPORATION
发明人： Takafumi Sugiyama , Toshiyuki Hirai , Masahiko Sano , Toru Takasone
IPC分类号： F21K9/64 , F21V29/505 , F21V9/30 , F21V9/08 , F21Y115/30
摘要： A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.

2. 发明申请

US20200266326A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE 审中-公开
公开(公告)号：US20200266326A1
公开(公告)日：2020-08-20
申请号：US16796221
申请日：2020-02-20
申请人： Nichia Corporation
发明人： Kinya Ichikawa , Katsuyoshi Kadan , Masahiko Sano , Ryohei Hirose , Hiroshi Yoneda
IPC分类号： H01L33/62 , H01L25/075 , H01L33/38
摘要： A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.

3. 发明授权

US10510934B2 Light emitting device 有权
公开(公告)号：US10510934B2
公开(公告)日：2019-12-17
申请号：US15364657
申请日：2016-11-30
申请人： NICHIA CORPORATION
发明人： Masakatsu Tomonari , Masahiko Sano
IPC分类号： H01L33/54 , H01L33/50 , H01L25/075 , H01L33/46 , H01L33/58 , H01L33/60 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/62 , H01L33/64 , H01L33/48
摘要： A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.

4. 发明授权

US09865773B2 Semiconductor light emitting device 有权
公开(公告)号：US09865773B2
公开(公告)日：2018-01-09
申请号：US15175281
申请日：2016-06-07
申请人： Nichia Corporation
发明人： Isamu Niki , Motokazu Yamada , Masahiko Sano , Shuji Shioji
IPC分类号： H01L33/00 , H01L33/16 , H01L33/20 , H01L33/22 , H01L33/26 , H01L33/32 , H01L21/02 , H01L33/24
CPC分类号： H01L33/16 , H01L21/02378 , H01L21/0254 , H01L21/02647 , H01L33/007 , H01L33/20 , H01L33/22 , H01L33/24 , H01L33/26 , H01L33/32 , H01L2933/0083 , Y10T428/24355 , Y10T428/24479
摘要： A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

5. 发明授权

US11410975B2 Display device and method of manufacturing display device 有权
公开(公告)号：US11410975B2
公开(公告)日：2022-08-09
申请号：US16796083
申请日：2020-02-20
申请人： Nichia Corporation
发明人： Kinya Ichikawa , Katsuyoshi Kadan , Masahiko Sano , Ryohei Hirose , Hiroshi Yoneda
IPC分类号： H01L25/075 , H01L21/66 , H01L33/46 , H01L33/62 , H01L33/22
摘要： A method of manufacturing a display device 1 includes: providing a substrate including at least one sub-pixel defined therein and a first wiring disposed for the sub-pixel, and the light-emitting element that includes a first electrode disposed on a lower surface and a second electrode disposed on at least two lateral surfaces intersecting with each other; mounting the light-emitting element on the substrate and electrically connecting the first electrode to the first wiring; forming a resin member covering the at least one light-emitting element, on the substrate, exposing a portion of the second electrode from an upper surface of the resin member by removing an upper portion of the resin member; and forming a second wiring with a mesh shape on the resin member such that a portion of the second wiring is disposed on the light-emitting element to electrically connect the second wiring to the second electrode.

6. 发明授权

US10944030B2 Light emitting device 有权
公开(公告)号：US10944030B2
公开(公告)日：2021-03-09
申请号：US16683113
申请日：2019-11-13
申请人： NICHIA CORPORATION
发明人： Masakatsu Tomonari , Masahiko Sano
IPC分类号： H01L33/54 , H01L33/60 , H01L33/08 , H01L33/50 , H01L33/52 , H01L33/62 , H01L33/58 , H01L33/46 , H01L25/075 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/64 , H01L33/48
摘要： A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.

7. 发明授权

US10892382B2 Semiconductor light-emitting element 有权
公开(公告)号：US10892382B2
公开(公告)日：2021-01-12
申请号：US15378935
申请日：2016-12-14
申请人： NICHIA CORPORATION
发明人： Masahiko Sano
IPC分类号： H01L33/06 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/40 , H01L33/00 , H01L33/22
摘要： A semiconductor light-emitting element includes a first semiconductor layer of a first conductive type, a second semiconductor layer of a second conductive type, a light-emitting layer formed between the first semiconductor layer and the second semiconductor layer, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The second electrode includes an ohmic electrode contacting the second semiconductor layer, and a semiconductor electrode made of a semiconductor layer contacting the ohmic electrode.

8. 发明授权

US09853194B2 Light emitting apparatus and method for producing the same 有权
公开(公告)号：US09853194B2
公开(公告)日：2017-12-26
申请号：US14688765
申请日：2015-04-16
申请人： Nichia Corporation
发明人： Shunsuke Minato , Masahiko Sano
IPC分类号： H01L33/60 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62 , H01L33/44 , H01L33/54 , H01L25/075
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/44 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05673 , H01L2224/0568 , H01L2224/05684 , H01L2224/14 , H01L2224/16225 , H01L2224/73253 , H01L2924/013 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting apparatus includes at least one light emitting device; a light transparent member that receives incident light emitted from the light emitting device; and a covering member. The light transparent member is a light conversion member that has an externally exposed light emission surface and a side surface contiguous to the light emission surface. The covering member contains a light reflective material, and covers at least the side surface of said light transparent member. A content of said light reflective material is not less than 30 wt %.

9. 发明授权

US09293658B2 Semiconductor light emitting element 有权
公开(公告)号：US09293658B2
公开(公告)日：2016-03-22
申请号：US14804876
申请日：2015-07-21
申请人： Nichia Corporation
发明人： Masahiko Sano
IPC分类号： H01L33/00 , H01L33/42 , H01L33/40 , H01L33/38 , H01L33/44
CPC分类号： H01L33/42 , H01L33/005 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/405 , H01L33/44 , H01L2933/0016
摘要： A semiconductor light emitting element includes a first conductive type semiconductor layer, a light emitting layer, and a second conductive type semiconductor layer disposed in this order. The semiconductor light emitting element includes first and second electrodes, a first insulating film and a translucent electrode. The first electrode is provided on the first conductive type semiconductor layer and includes a first pad portion and a first extending portion. The first insulating film covers the first extending portion. The translucent electrode is connected to an upper surface of the second conductive type semiconductor layer and extends over the first insulating film. The second electrode is connected to the translucent electrode at a position on the first insulating film. The second electrode includes a second pad portion and a second extending portion extending along the first extending portion so as to be superimposed over the first extending portion.

10. 发明授权

US09123865B2 Semiconductor light emitting element 有权
标题翻译：半导体发光元件
公开(公告)号：US09123865B2
公开(公告)日：2015-09-01
申请号：US14575807
申请日：2014-12-18
申请人： Nichia Corporation
发明人： Masahiko Sano
IPC分类号： H01L33/50 , H01L33/42 , H01L33/00 , H01L33/46 , H01L33/38 , H01L33/44 , H01L33/20
CPC分类号： H01L33/42 , H01L33/005 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/405 , H01L33/44 , H01L2933/0016
摘要： A semiconductor light emitting element includes a first conductive type semiconductor layer, a light emitting layer, and a second conductive type semiconductor layer disposed in this order. The semiconductor light emitting element includes first and second electrodes, a first insulating film and a translucent electrode. The first electrode is provided on the first conductive type semiconductor layer and includes a first pad portion and a first extending portion. The first insulating film covers the first extending portion. The translucent electrode is connected to an upper surface of the second conductive type semiconductor layer and extends over the first insulating film. The second electrode is connected to the translucent electrode at a position on the first insulating film. The second electrode includes a second pad portion and a second extending portion extending along the first extending portion so as to be superimposed over the first extending portion.
摘要翻译：半导体发光元件包括依次布置的第一导电类型半导体层，发光层和第二导电类型半导体层。半导体发光元件包括第一和第二电极，第一绝缘膜和透光电极。第一电极设置在第一导电类型半导体层上，并且包括第一焊盘部分和第一延伸部分。第一绝缘膜覆盖第一延伸部分。半透明电极连接到第二导电类型半导体层的上表面并且在第一绝缘膜上延伸。第二电极在第一绝缘膜上的位置与透光性电极连接。第二电极包括第二焊盘部分和沿着第一延伸部分延伸以便重叠在第一延伸部分上的第二延伸部分。

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