专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140322844A1 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20140322844A1
公开(公告)日：2014-10-30
申请号：US14263695
申请日：2014-04-28
申请人： NICHIA CORPORATION
发明人： Masatsuga Ichikawa , Masahiko Sano , Daisuke Sanga , Toru Takasone , Shunsuke Minato
IPC分类号： H01L33/50
CPC分类号： H01L33/0079 , H01L33/505 , H01L2933/0041 , H01L2933/0058
摘要： Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.
摘要翻译：提供一种制造包括发光元件和光学部件的发光器件的方法，所述方法包括以下步骤：（i）在每个发光元件和光学部件的接合表面上形成羟基膜，原子层沉积，和（ii）将发光元件和光学部件的结合面彼此粘合，每个接合表面上形成有羟基膜，其中子步骤在该步骤中重复至少一次（ i），其中第一原料气体和第二原料气体顺序地供应到发光元件和光学部件的接合表面上，并且其中执行步骤（ii）中的接合表面的接合没有加热处理。

2. 发明授权

US11131433B2 Fluorescent module and illumination device 有权
公开(公告)号：US11131433B2
公开(公告)日：2021-09-28
申请号：US16536005
申请日：2019-08-08
申请人： NICHIA CORPORATION
发明人： Takafumi Sugiyama , Toshiyuki Hirai , Masahiko Sano , Toru Takasone
IPC分类号： F21K9/64 , F21V29/505 , F21V9/30 , F21V9/08 , F21Y115/30
摘要： A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.

3. 发明授权

US11585494B2 Fluorescent module and illumination device 有权
公开(公告)号：US11585494B2
公开(公告)日：2023-02-21
申请号：US17410847
申请日：2021-08-24
申请人： NICHIA CORPORATION
发明人： Takafumi Sugiyama , Toshiyuki Hirai , Masahiko Sano , Toru Takasone
IPC分类号： F21K9/64 , F21V29/505 , F21V9/30 , F21V9/08 , F21Y115/30
摘要： A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.

4. 发明授权

US10974492B2 Light emitting device and method of manufacturing light emitting device 有权
公开(公告)号：US10974492B2
公开(公告)日：2021-04-13
申请号：US16795008
申请日：2020-02-19
申请人： NICHIA CORPORATION
发明人： Daisuke Sanga , Masatsugu Ichikawa , Shunsuke Minato , Toru Takasone , Masahiko Sano
IPC分类号： F21V21/00 , B32B38/00 , B32B37/02 , H01L33/58 , H01L33/60 , H01L33/00
摘要： A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

5. 发明授权

US09914288B2 Light emitting device and method of manufacturing light emitting device 有权
公开(公告)号：US09914288B2
公开(公告)日：2018-03-13
申请号：US14534614
申请日：2014-11-06
申请人： NICHIA CORPORATION
发明人： Daisuke Sanga , Masatsugu Ichikawa , Shunsuke Minato , Toru Takasone , Masahiko Sano
IPC分类号： F21V9/00 , B32B38/00 , B32B37/02 , H01L33/00 , H01L33/58 , H01L33/60
CPC分类号： B32B38/0004 , B32B37/02 , B32B2305/55 , B32B2307/412 , B32B2551/00 , H01L33/0079 , H01L33/58 , H01L33/60
摘要： A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

6. 发明授权

US10603889B2 Light emitting device and method of manufacturing light emitting device 有权
公开(公告)号：US10603889B2
公开(公告)日：2020-03-31
申请号：US15883810
申请日：2018-01-30
申请人： NICHIA CORPORATION
发明人： Daisuke Sanga , Masatsugu Ichikawa , Shunsuke Minato , Toru Takasone , Masahiko Sano
IPC分类号： F21V21/00 , B32B38/00 , B32B37/02 , H01L33/00 , H01L33/58 , H01L33/60
摘要： A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

7. 发明授权

US10442987B2 Fluorescent member, optical component, and light emitting device 有权
公开(公告)号：US10442987B2
公开(公告)日：2019-10-15
申请号：US16118209
申请日：2018-08-30
申请人： NICHIA CORPORATION
发明人： Toru Takasone , Masahiko Sano , Hiroyuki Inoue , Shoichi Yamada , Takafumi Sugiyama
IPC分类号： C09K11/02 , F21V29/502 , C09K11/77 , F21V9/30 , F21V13/08 , F21V7/30 , C04B35/115 , C04B35/117 , C04B38/00 , C09D5/22 , H01L33/50 , C04B35/64 , H01L33/64 , C04B111/80
摘要： A fluorescent member includes: a plurality of fluorescent particles; an inorganic binder; and a plurality of pores. An upper surface of the fluorescent member is a light extraction surface of the fluorescent member. The plurality of pores are localized in a vicinity of at least one of the plurality of fluorescent particles in a cross section that is parallel to the upper surface of the fluorescent member and extends through the fluorescent particles and the pores.

8. 发明授权

US10180237B2 Light emitting device and wavelength conversion member 有权
公开(公告)号：US10180237B2
公开(公告)日：2019-01-15
申请号：US15621166
申请日：2017-06-13
申请人： NICHIA CORPORATION
发明人： Masahiko Sano , Hiroaki Yuto , Naoki Eboshi , Toru Takasone
IPC分类号： F21V9/16 , F21V9/30 , F21V29/70 , F21V5/04 , F21V7/00 , F21V13/14 , F21K9/64 , H01S5/00 , H01L33/50 , H05B33/14 , F21Y115/30 , F21V7/26 , F21V9/32 , H01S5/022
摘要： A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.

9. 发明授权

US08980661B2 Method for manufacturing light emitting device 有权
标题翻译：发光装置的制造方法
公开(公告)号：US08980661B2
公开(公告)日：2015-03-17
申请号：US14263695
申请日：2014-04-28
申请人： Nichia Corporation
发明人： Masatsugu Ichikawa , Masahiko Sano , Daisuke Sanga , Toru Takasone , Shunsuke Minato
IPC分类号： H01L21/00 , H01L33/50 , H01L33/00
CPC分类号： H01L33/0079 , H01L33/505 , H01L2933/0041 , H01L2933/0058
摘要： Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.
摘要翻译：提供一种制造包括发光元件和光学部件的发光器件的方法，所述方法包括以下步骤：（i）在每个发光元件和光学部件的接合表面上形成羟基膜，原子层沉积，和（ii）将发光元件和光学部件的结合面彼此粘合，每个接合表面上形成有羟基膜，其中子步骤在该步骤中重复至少一次（ i），其中第一原料气体和第二原料气体顺序地供应到发光元件和光学部件的接合表面上，并且其中执行步骤（ii）中的接合表面的接合没有加热处理。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式