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1. 发明授权

US08162658B2 Injection molding die 失效
标题翻译：注塑模具
公开(公告)号：US08162658B2
公开(公告)日：2012-04-24
申请号：US12598896
申请日：2008-04-23
申请人： Osamu Nakata , Mitsuhiro Takayama
发明人： Osamu Nakata , Mitsuhiro Takayama
IPC分类号： B29C45/32
CPC分类号： B29C45/14434 , B29C45/0025 , B29C45/2669 , B29C2045/0044
摘要： There is provided an injection die characterized in that the injection die is separated into at least two pieces, that a cavity for frame is formed between the separated dies, that the cavity for frame is provided with an additional cavity via a coupling hole, and that the coupling hole communicating with the additional cavity is provided at a confluence point of a resin in melted condition of the cavity for frame, at around a gate, at around a cavity for a fixing component, or at around a cavity for frame of which thickness is deep.
摘要翻译：提供了一种注射模具，其特征在于，注射模具被分成至少两个部件，在分离的模具之间形成用于框架的空腔，框架的空腔通过联接孔设置有附加的空腔，并且在树脂的汇合点处，在框架的空腔，围绕浇口，在用于固定部件的空腔周围，或在框架周围的框架周围设置与附加空腔连通的联接孔很深

2. 发明申请

US20110045123A1 Die for Injection Molding Glass with Frame 审中-公开
标题翻译：模具用于注塑成型玻璃与框架
公开(公告)号：US20110045123A1
公开(公告)日：2011-02-24
申请号：US12936872
申请日：2009-05-01
申请人： Osamu Nakata , Mitsuhiro Takayama
发明人： Osamu Nakata , Mitsuhiro Takayama
IPC分类号： B29C45/14
CPC分类号： B29C45/14434 , B29C45/14262 , B29C45/14311 , B29C45/2708 , B29C2045/0027 , B29K2709/08
摘要： In an injection molding die, there is defined a cavity for a frame or a cavity for the frame and an auxiliary cavity communicating with the cavity for the frame, and into the cavity for the frame or the auxiliary cavity, there is injected a melted resin from a runner through a gate, and a section of the gate has a width of 1 to 5 mm in the direction of a thickness of a plate glass and a width of 10 mm or more in the direction parallel with a side of the plate glass but smaller than a side length of the plate glass. When this die is practically used, a load that would be applied to a peripheral portion of the plate glass during injection molding is reduced, so that when the frame is integrally molded to the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
摘要翻译：在注射成型模具中，限定了用于框架的框架或空腔和用于框架的腔体和与框架或辅助空腔的空腔连通的辅助空腔，注入熔融树脂从浇道通过浇口，并且浇口的一部分在平板玻璃的厚度方向上具有1至5mm的宽度，并且在与平板玻璃的平行方向平行的方向上具有10mm或更大的宽度但小于平板玻璃的边长。当实际使用该模具时，减少了在注射成型期间施加到平板玻璃的周边部分的负荷，使得当框架通过注射成型一体地模制到平板玻璃时，平板玻璃的不期望的破坏是被压制

3. 发明授权

US08992209B2 Metal mold for injection molding of framed glass and manufacturing method for framed glass 有权
标题翻译：框架玻璃注塑用金属模具和框架玻璃制造方法
公开(公告)号：US08992209B2
公开(公告)日：2015-03-31
申请号：US12936479
申请日：2009-05-01
申请人： Osamu Nakata , Mitsuhiro Takayama
发明人： Osamu Nakata , Mitsuhiro Takayama
IPC分类号： B29C39/18 , B29C45/14
CPC分类号： B29C45/14434 , B29C45/14311 , B29C45/14836
摘要： Disclosed herein is an injection molding die used for producing a frame-mounted plate glass by injection molding. The die is characterized in that an auxiliary cavity is provided at a position to exposed a surface of a plate glass and communicated with a cavity for a frame through a communication opening, the cavity for the frame being provided at position facing a vehicle inside surface of the plate glass. When the die is practically used for injection molding, a load applied to a peripheral portion of the plate glass during the injection molding is reduced, so that when the frame is molded onto the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
摘要翻译：这里公开了一种用于通过注射成型制造框架安装的平板玻璃的注塑模具。模具的特征在于，在暴露平板玻璃的表面并通过连通开口与框架的空腔连通的位置处设置辅助空腔，所述框架的空腔设置在面向车辆内表面的位置平板玻璃当模具实际上用于注射成型时，在注射成型期间施加到平板玻璃的周边部分的负载减小，使得当通过注射成型将框架模制到平板玻璃上时，平板玻璃的不期望的破坏是被压制

4. 发明申请

US20110031647A1 Metal Mold for Injection Molding of Framed Glass and Manufacturing Method for Framed Glass 有权
标题翻译：框架玻璃注塑用金属模具和框架玻璃的制造方法
公开(公告)号：US20110031647A1
公开(公告)日：2011-02-10
申请号：US12936479
申请日：2009-05-01
申请人： Osamu Nakata , Mitsuhiro Takayama
发明人： Osamu Nakata , Mitsuhiro Takayama
IPC分类号： B29C45/14 , B29C45/26
CPC分类号： B29C45/14434 , B29C45/14311 , B29C45/14836
摘要： Disclosed herein is an injection molding die used for producing a frame-mounted plate glass by injection molding. The die is characterized in that an auxiliary cavity is provided at a position to exposed a surface of a plate glass and communicated with a cavity for a frame through a communication opening, the cavity for the frame being provided at position facing a vehicle inside surface of the plate glass. When the die is practically used for injection molding, a load applied to a peripheral portion of the plate glass during the injection molding is reduced, so that when the frame is molded onto the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
摘要翻译：这里公开了一种用于通过注射成型制造框架安装的平板玻璃的注塑模具。模具的特征在于，在暴露平板玻璃的表面并通过连通开口与框架的空腔连通的位置处设置辅助空腔，所述框架的空腔设置在面向车辆内表面的位置平板玻璃当模具实际上用于注射成型时，在注射成型期间施加到平板玻璃的周边部分的负载减小，使得当通过注射成型将框架模制到平板玻璃上时，平板玻璃的不期望的破坏是被压制

5. 发明申请

US20100086637A1 Injection Molding Die 失效
标题翻译：注塑模具
公开(公告)号：US20100086637A1
公开(公告)日：2010-04-08
申请号：US12598896
申请日：2008-04-23
申请人： Osamu Nakata , Mitsuhiro Takayama
发明人： Osamu Nakata , Mitsuhiro Takayama
IPC分类号： B29C45/03
CPC分类号： B29C45/14434 , B29C45/0025 , B29C45/2669 , B29C2045/0044
摘要： There is provided an injection die characterized in that the injection die is separated into at least two pieces, that a cavity for frame is formed between the separated dies, that the cavity for frame is provided with an additional cavity via a coupling hole, and that the coupling hole communicating with the additional cavity is provided at a confluence point of a resin in melted condition of the cavity for frame, at around a gate, at around a cavity for a fixing component, or at around a cavity for frame of which thickness is deep.
摘要翻译：提供了一种注射模具，其特征在于，注射模具被分成至少两个部件，在分离的模具之间形成用于框架的空腔，框架的空腔通过联接孔设置有附加的空腔，并且在树脂的汇合点处，在框架的空腔，围绕浇口，在用于固定部件的空腔周围，或在框架周围的框架周围设置与附加空腔连通的联接孔很深

6. 发明授权

US08360499B2 Decorative molding and framed window glass plate for vehicle 失效
标题翻译：装饰成型和框架窗玻璃板车
公开(公告)号：US08360499B2
公开(公告)日：2013-01-29
申请号：US13203906
申请日：2010-02-18
申请人： Takuya Hasegawa , Mitsuhiro Takayama , Teturo Yamada , Koichi Fukuta
发明人： Takuya Hasegawa , Mitsuhiro Takayama , Teturo Yamada , Koichi Fukuta
IPC分类号： B60J1/20
CPC分类号： C25D13/12 , B29C45/14377 , B29C45/14434 , B29C45/14811 , B29C45/1671 , B29K2705/00 , B29K2709/08 , B29K2995/002 , B60J10/265 , C09D5/4465 , C09D5/4488
摘要： A decorative molding that is to be fixed to a frame of a framed window glass plate for a vehicle is provided. The decorative molding is configured such that when the frame is formed around a peripheral portion of a glass plate by injecting a molten resin, the decorative molding is simultaneously fixed to the frame. The body of the decorative molding is made of a metal. A cationically electrodeposited coating film is formed on a surface of the body of the decorative molding and a resinous coating film is formed on the cationically electrodeposited coating film.
摘要翻译：提供了要固定到用于车辆的框式窗玻璃板的框架的装饰性模制品。装饰成形体通过注入熔融树脂而在玻璃板的周边部形成框架时，将装饰成形体同时固定在框架上。装饰成型的主体由金属制成。在装饰性成型体的主体的表面上形成阳离子电沉积涂膜，在阳离子电沉积涂膜上形成树脂涂膜。

7. 发明授权

US07928560B2 Composite multi-layer substrate and module using the substrate 有权
标题翻译：复合多层基板和使用基板的模块
公开(公告)号：US07928560B2
公开(公告)日：2011-04-19
申请号：US12780501
申请日：2010-05-14
申请人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
发明人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
IPC分类号： H01L23/04
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/021 , H05K3/445 , H05K3/4641 , H05K2201/0969 , H05K2201/09745 , H01L2924/00
摘要： A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
摘要翻译：一种复合多层基板，包括由具有优异导电性，优异导热性和高刚性的材料形成的平板状芯体，至少覆盖前后树脂层和后树脂层芯构件的表面和通过芯构件的前后侧形成在芯构件中的无底孔，其中电子部件安装在无底孔中，由此，复合多层基板的强度可以通过芯构件的刚性保证，可以消除传统的现有技术的玻璃布，可以避免由离子迁移引起的电特性的劣化，并且将导致降低生产成本。

8. 发明申请

US20100300736A1 COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE 有权
标题翻译：复合多层基板和使用基板的模块
公开(公告)号：US20100300736A1
公开(公告)日：2010-12-02
申请号：US12780501
申请日：2010-05-14
申请人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
发明人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
IPC分类号： H05K1/00
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/021 , H05K3/445 , H05K3/4641 , H05K2201/0969 , H05K2201/09745 , H01L2924/00
摘要： A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
摘要翻译：一种复合多层基板，包括由具有优异导电性，优异导热性和高刚性的材料形成的平板状芯体，至少覆盖前后树脂层和后树脂层芯构件的表面和通过芯构件的前后侧形成在芯构件中的无底孔，其中电子部件安装在无底孔中，由此，复合多层基板的强度可以通过芯构件的刚性保证，可以消除传统的现有技术的玻璃布，可以避免由离子迁移引起的电特性的劣化，并且将导致降低生产成本。

9. 发明授权

US07348662B2 Composite multi-layer substrate and module using the substrate 有权
标题翻译：复合多层基板和使用基板的模块
公开(公告)号：US07348662B2
公开(公告)日：2008-03-25
申请号：US10515953
申请日：2003-05-27
申请人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
发明人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
IPC分类号： H01L23/02
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/021 , H05K3/445 , H05K3/4641 , H05K2201/0969 , H05K2201/09745 , H01L2924/00
摘要： A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
摘要翻译：一种复合多层基板，包括由具有优异导电性，优异导热性和高刚性的材料形成的平板状芯体，至少覆盖前后树脂层和后树脂层芯构件的表面和通过芯构件的前后侧形成在芯构件中的无底孔，其中电子部件安装在无底孔中，由此，复合多层基板的强度可以通过芯构件的刚性保证，可以消除传统的现有技术的玻璃布，可以避免由离子迁移引起的电特性的劣化，并且将导致降低生产成本。

10. 发明申请

US20060255440A1 Composite multi-layer substrate and module using the substrate 有权
标题翻译：复合多层基板和使用基板的模块
公开(公告)号：US20060255440A1
公开(公告)日：2006-11-16
申请号：US10515953
申请日：2003-05-27
申请人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
发明人： Masashi Miyazaki , Mitsuhiro Takayama , Tatsuro Sawatari
IPC分类号： H01L23/02
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/021 , H05K3/445 , H05K3/4641 , H05K2201/0969 , H05K2201/09745 , H01L2924/00
摘要： A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
摘要翻译：一种复合多层基板，包括由具有优异导电性，优异导热性和高刚性的材料形成的平板状芯体，至少覆盖前后树脂层和后树脂层芯构件的表面和通过芯构件的前后侧形成在芯构件中的无底孔，其中电子部件安装在无底孔中，由此，复合多层基板的强度可以通过芯构件的刚性保证，可以消除传统的现有技术的玻璃布，可以避免由离子迁移引起的电特性的劣化，并且将导致降低生产成本。

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