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1. 发明公开

US20230191671A1 TUBING COUPLER MOLDINGS AND SYSTEMS, AND ASSOCIATED METHODS 审中-公开
公开(公告)号：US20230191671A1
公开(公告)日：2023-06-22
申请号：US18084655
申请日：2022-12-20
申请人： Repligen Corporation
发明人： Stephen Murphy , Christopher Bullock
IPC分类号： B29C45/14 , B29C45/26
CPC分类号： B29C45/14467 , B29C45/2612 , B29C45/2669 , B29L2031/24
摘要： A tubing system with a coupler join positioned between and joining tubing segments. The coupler join is formed to reduce dead legs and hold up volumes within, and/or to reduce materials used to form, and/or to simplify the manufacturing process of the tubing system. The coupler join may be sized, shaped, configured, and/or dimensioned to join tubing segments, such as pre-formed tubing segments, in a streamlined configuration, such as to substantially correspond with the outer and inner diameters of the tubing segments. The tubing system and coupler join may be formed with a mold configured to form a coupler join securely coupling spaced apart ends of tubing segments to be joined together in a configuration which reduces dead legs and hold up volumes within the resulting tubing system.

2. 发明公开

US20230173723A1 HIGH-PRECISION AND HIGH-EFFICIENCY INJECTION MOLD FOR HIGH-ASPECT-RATIO DOUBLE-LAYER CYLINDRICAL PLASTIC PART AND MOLDING METHOD USING THE SAME 审中-公开
公开(公告)号：US20230173723A1
公开(公告)日：2023-06-08
申请号：US18164581
申请日：2023-02-04
申请人： NORTH UNIVERSITY OF CHINA , SHANXI ZHONGBEI NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Yaqing LIU , Ruikui DU , Guizhe ZHAO , Kai WEN
IPC分类号： B29C45/26 , B29C45/73 , B29C45/16
CPC分类号： B29C45/2606 , B29C45/7312 , B29C45/2669 , B29C45/1635 , B29L2009/00
摘要： An injection mold for a high-aspect-ratio double-layer cylindrical plastic part and a molding method using the same. The injection mold includes a support base plate. A movable mold fixing frame and a movable mold base plate are arranged at the middle of a lower surface of the support base plate through positioning screws. A lower core mold is matchingly provided at a center of an upper surface of the support base plate, and is provided with a lower semicircular cavity for accommodating an outer die barrel. One side of the lower semicircular cavity is open, and the other side is provided with a first end wall which is provided with a lower semicircular notch for an inner die rod to pass through. An upper surface of the lower core mold is provided with a positioning protrusion, a lower feeding groove, and a remaining groove.

3. 发明申请

US20170080616A1 MOLD, SYSTEM AND METHOD FOR MANUFACTURING A MOLDED PART 审中-公开
公开(公告)号：US20170080616A1
公开(公告)日：2017-03-23
申请号：US14860201
申请日：2015-09-21
申请人： Honda Motor Co., Ltd.
发明人： Chad Wojniak , Kaoru Tokita , Takeshi Kuriyama , Kazuhisa Fujiwara , Atsushi Ban , Naoki Yoshimura
IPC分类号： B29C45/00 , B29C45/26 , B29C45/16
CPC分类号： B29C45/0055 , B29C45/0081 , B29C45/16 , B29C45/2669 , B29C2793/0009 , B29L2031/3005 , B29L2031/3008
摘要： A mold, system and method for manufacturing a part includes injection molding a substrate in a single injection mold and optionally trimming the panel substrate. The substrate can have a first configuration or a second, different configuration. Trimming of the substrate can occur when the substrate has the first configuration to define an aperture in the substrate.

4. 发明授权

US09524885B2 Apparatus for molding a semiconductor wafer and process therefor 有权
标题翻译：用于模制半导体晶片的设备及其工艺
公开(公告)号：US09524885B2
公开(公告)日：2016-12-20
申请号：US14446194
申请日：2014-07-29
申请人： ADVANCED SYSTEMS AUTOMATION LTD.
发明人： Jimmy Chew Hwee Seng , Dingwei Xia
IPC分类号： H01L23/02 , H01L21/56 , B29C45/26 , B29C45/73 , B29C43/36 , B29C43/50 , H01L21/67 , B29C45/14 , B29C45/38 , B29C45/77 , H01L23/31 , B29L31/34
CPC分类号： H01L21/565 , B29C43/36 , B29C43/50 , B29C45/14655 , B29C45/2669 , B29C45/38 , B29C45/73 , B29C45/77 , B29C2045/7393 , B29L2031/3481 , H01L21/67126 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding, in a relatively short time. Mold piece (105) further comprises a movable cavity bar (115) that can be moved away from mold piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.
摘要翻译：用于在凸起的半导体晶片（118）的互连侧上模制模制化合物层的模具（105和110）包括：主空腔（117）和次级空腔（120），多个模制化合物从初级腔）流。辅助空腔（120）包括柱塞（130），其确定在模制期间等于模具化合物上期望的模具复合压力的预定背压。由于主空腔（117）中的大多数多余的模制化合物被迫流入次级空腔（120），这有利地在半导体晶片（118）上留下相对薄的模制化合物层，然后可以将其去除，例如通过研磨，在相对短的时间内。模具（105）还包括可移动的空腔棒（115），其可以在模制之后移动离开模具（105）并被冷却以分离粘附到空腔棒的模制基底。

5. 发明申请

US20160089823A1 PRODUCING METHOD FOR CABLE WITH RESIN MOLD 审中-公开
标题翻译：生产具有树脂模具的电缆的方法
公开(公告)号：US20160089823A1
公开(公告)日：2016-03-31
申请号：US14866448
申请日：2015-09-25
申请人： Hitachi Metals, Ltd.
发明人： Yukio Ikeda
IPC分类号： B29C45/14 , H01B13/06 , B29C45/00
CPC分类号： B29C45/14549 , B29C45/0053 , B29C45/14639 , B29C45/14811 , B29C45/2669 , B29K2021/003 , B29K2995/0005 , B29K2995/0007 , B29L2031/3462 , H01B13/06
摘要： A method for producing a cable with a resin mold including a cable section comprising an electric wire and a sheath comprising a synthetic resin covering the electric wire, and a resin mold section into which a portion of the sheath is molded by a resin is provided. A portion of the cable section is received in a receiving space in a die formed with a molten resin inlet, an inflow passage, and a resin reservoir therein. A molten resin is injected from the inlet into the receiving space. A portion of the injected molten resin flows through the inflow passage and is retained in the resin reservoir. The portion of the sheath is molten by heat of the molten resin. The molten resin is solidified to thereby form a molded resin product. Its unnecessary portion solidified in the resin reservoir is removed from the molded resin product.
摘要翻译：提供一种具有树脂模具的电缆的制造方法，所述树脂模具包括电缆部分，所述电缆部分包括电线和包含覆盖所述电线的合成树脂的护套，以及树脂模制部分，所述树脂模制部分通过树脂模制成一部分。电缆部分的一部分被容纳在形成有熔融树脂入口，流入通道和树脂储存器的模具的容纳空间中。将熔融树脂从入口注入到容纳空间中。注入的熔融树脂的一部分流过流入通道并保持在树脂储存器中。护套的部分由熔融树脂的热量熔化。将熔融树脂固化，从而形成模制树脂产品。在树脂储存器中固化的不需要的部分从模塑树脂产品中除去。

6. 发明授权

US09299652B2 Device and method of manufacturing the same 有权
标题翻译：装置及其制造方法
公开(公告)号：US09299652B2
公开(公告)日：2016-03-29
申请号：US14422352
申请日：2013-08-20
申请人： PS5 LUXCO S.A.R.L.
发明人： Osamu Kindo
IPC分类号： H01L23/48 , H01L23/498 , H01L23/31 , H01L21/56 , H01L23/00 , H01L25/065 , B29C45/26 , B29C45/34 , B29C45/14
CPC分类号： H01L23/49838 , B29C45/14311 , B29C45/14655 , B29C45/2669 , B29C45/34 , B29C2045/14327 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/3142 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06558 , H01L2225/06562 , H01L2924/00014 , H01L2924/10162 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2924/00011
摘要： A device includes a substrate having a base member and an insulation film formed on a surface of the base member, a first semiconductor chip mounted over a surface of the substrate on which the insulation film are formed, a second semiconductor chip stacked over the first semiconductor chip so that an overhang portion is formed, and a sealing member formed on the substrate so that the first semiconductor chip and the second semiconductor chip are covered with the sealing member. The insulation film has a first opening portion in a first area of the substrate that overlaps the overhang portion. The base member has an air passage communicating with the first opening portion.
摘要翻译：一种器件包括：具有基底构件和形成在基底构件表面上的绝缘膜的基板，安装在其上形成有绝缘膜的基板的表面上的第一半导体芯片，堆叠在第一半导体上的第二半导体芯片形成突出部，以及形成在基板上的密封部件，使得第一半导体芯片和第二半导体芯片被密封部件覆盖。所述绝缘膜具有与所述突出部重叠的所述基板的第一区域中的第一开口部。基座部件具有与第一开口部连通的空气通路。

7. 发明授权

US08858218B2 Tool for a resin transfer moulding method 有权
标题翻译：树脂传递成型法的工具
公开(公告)号：US08858218B2
公开(公告)日：2014-10-14
申请号：US12084727
申请日：2006-11-07
申请人： Ulrich Eberth , Martin Friedrich
发明人： Ulrich Eberth , Martin Friedrich
IPC分类号： B29C70/48 , B29C33/00 , B29C37/00 , B29C45/26 , B29C45/34 , B29C70/44
CPC分类号： B29C70/443 , B29C33/0055 , B29C37/0064 , B29C45/2669 , B29C45/34 , B29C70/48
摘要： A tool for a resin transfer molding method comprises a cavity, a resin trap and a transition region, wherein the cavity is designed such that a component can be accommodated in it. Furthermore, the resin trap is integrated in the tool, and the transition region is designed such that with it a connection between the cavity and the resin trap can be established.
摘要翻译：用于树脂传递模塑方法的工具包括空腔，树脂捕集器和过渡区域，其中空腔被设计成使得可以将部件容纳在其中。此外，树脂捕集器集成在工具中，并且过渡区域被设计成使得其可以建立腔和树脂阱之间的连接。

8. 发明申请

US20130161867A1 Molding Apparatus and a Method for Molding 审中-公开
标题翻译：成型设备和成型方法
公开(公告)号：US20130161867A1
公开(公告)日：2013-06-27
申请号：US13332737
申请日：2011-12-21
申请人： Edward Fuergut , Juergen Hoegerl
发明人： Edward Fuergut , Juergen Hoegerl
IPC分类号： B29C45/14
CPC分类号： H01L21/565 , B29C33/0055 , B29C45/14639 , B29C45/14655 , B29C45/2669 , H01L2924/0002 , H01L2924/00
摘要： An embodiment molding apparatus includes a main cavity and a buffer cavity connected with the main cavity.
摘要翻译：实施例成型装置包括主腔和与主腔相连的缓冲腔。

9. 发明申请

US20130069279A1 Method for producing annular moldings subjected to tensile or pressure loading from plastic 审中-公开
标题翻译：用于制造经受来自塑料的拉伸或加载负载的环形模制品的方法
公开(公告)号：US20130069279A1
公开(公告)日：2013-03-21
申请号：US13640441
申请日：2011-04-08
申请人： Dieter Busch , Mark Frister
发明人： Dieter Busch , Mark Frister
IPC分类号： B29C45/00
CPC分类号： B29C45/0046 , B29C45/0005 , B29C45/0025 , B29C45/2669 , B29C2045/0044
摘要： The invention relates to methods for producing annular moldings subjected to tensile or pressure loading from plastic by using an injection mold having a main cavity, at least one extra cavity is incorporated in the injection mold. The at least one extra cavity is joined to the main cavity by a connecting duct. The main cavity is filled with plastic melt so a flow line is formed in the vicinity of the connecting duct between the at least one extra cavity and the main cavity, wherein the cross section of the connecting duct is dimensioned such that, during the filling of the main cavity, no plastic melt flows into the extra cavity. The filling pressure is increased until plastic melt flows into the extra cavity; flow taking place through the flow line produced during the filling of the main cavity. Subsequently, the injection mold is opened and the molding removed.
摘要翻译：本发明涉及通过使用具有主腔的注射模具来生产经受塑性拉伸或加载负载的环形模制品的方法，至少一个额外的空腔被结合到注模中。至少一个额外的空腔通过连接管连接到主腔。主腔充满塑料熔体，使得在至少一个额外空腔和主腔之间的连接管道附近形成流动线，其中连接管道的横截面的尺寸设定成使得在填充主腔，没有塑料熔体流入额外的空腔。填充压力增加，直到塑料熔体流入额外的空腔; 通过在主腔的填充期间产生的流动线发生流动。随后，打开注射模具并将模具移除。

10. 发明授权

US08088321B2 Method of molding a microneedle 有权
标题翻译：成型微针的方法
公开(公告)号：US08088321B2
公开(公告)日：2012-01-03
申请号：US11720480
申请日：2005-12-07
申请人： Dennis E. Ferguson , Satinder K. Nayar , Donald L. Pochardt
发明人： Dennis E. Ferguson , Satinder K. Nayar , Donald L. Pochardt
IPC分类号： B29C45/56
CPC分类号： B29C45/568 , A61M37/0015 , A61M2037/0053 , B29C45/2669 , B29C45/34 , B29C45/561 , B29C2045/0094 , B29C2791/008 , B29L2031/7544 , B29L2031/756
摘要： A method of molding a microneedle using a mold apparatus that comprises a mold insert (210)having the negative image of at least one microneedle (12), a compression core (240), and a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The mold apparatus has an open position and a closed position. The mold apparatus is placed in the closed position and polymeric material is injected into the closed mold apparatus. The injected polymeric material is compressed between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert. Also, molding methods wherein the mold apparatus has sidewalls having an injection gate (270). Also, molding methods comprising a heated mold insert. Also, molding methods comprising the application of high frequency acoustic energy, such as ultrasonic energy, to the mold apparatus.
摘要翻译：一种使用包括具有至少一个微针（12）的负像的模具插入件（210），压缩芯（240）的模具设备来模制微针的方法，以及模具壳体，其被构造成允许在模具插入件和压缩芯。模具装置具有打开位置和关闭位置。将模具装置放置在关闭位置，将聚合物材料注入封闭的模具装置中。注射的聚合物材料通过压缩芯和模具插入件之间的往复运动在模具插入件和压缩芯之间被压缩。而且，其中模具装置具有具有注射门（270）的侧壁的成型方法。而且，模制方法包括加热的模具插入件。而且，包括将诸如超声波能量的高频声能施加到模具设备的成型方法。

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