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1. 发明授权

US10165677B2 Bare die integration with printed components on flexible substrate without laser cut 有权
公开(公告)号：US10165677B2
公开(公告)日：2018-12-25
申请号：US14965039
申请日：2015-12-10
申请人： Palo Alto Research Center Incorporated
发明人： Ping Mei , Tse Nga Ng , Brent S. Krusor , Gregory L. Whiting , Steven E. Ready , Janos Veres
IPC分类号： H05K1/02 , H05K1/03 , H05K1/18 , H05K3/14 , H01L21/56 , H01L23/00 , H01L23/31
摘要： Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

2. 发明申请

US20170237003A1 SURFACE TREATMENT OF HYDROPHOBIC FERROELECTRIC POLYMERS FOR PRINTING 审中-公开
公开(公告)号：US20170237003A1
公开(公告)日：2017-08-17
申请号：US15583885
申请日：2017-05-01
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Ana Claudia Arias , Jurgen H. Daniel
IPC分类号： H01L51/00 , H01L51/05 , H01L27/28
CPC分类号： H01L51/0005 , H01L27/1292 , H01L27/283 , H01L51/0012 , H01L51/0022 , H01L51/0036 , H01L51/0043 , H01L51/052 , H01L51/0545 , H01L51/0558 , H05K3/1208 , H05K3/125 , H05K3/381 , H05K2203/013 , H05K2203/087 , H05K2203/095 , H05K2203/1173
摘要： An embodiment is a method and apparatus to treat surface of polymer for printing. Surface of a polymer having a surface energy modified for a time period to control a feature characteristic and/or provide a hysteresis behavior. A material is printed on the surface to form a circuit pattern having at least one of the controlled feature characteristic and the hysteresis behavior.

3. 发明授权

US09437804B2 Electroactive polymer structures printed with varying compositions of ions 有权
标题翻译：用不同组成的离子印刷的电活性聚合物结构
公开(公告)号：US09437804B2
公开(公告)日：2016-09-06
申请号：US13966060
申请日：2013-08-13
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Kye-Si Kwon
IPC分类号： H01L41/00 , H02N2/00 , H01L41/09 , H01L41/193
CPC分类号： H01L41/0933 , H01L41/0926 , H01L41/0946 , H01L41/0953 , H01L41/193 , Y10T29/49117
摘要： An electroactive polymer structure includes a first flexible electrode, a second flexible electrode, and a polymer dielectric layer with ionic liquid on top of the first electrode including at least two regions. Each region of the polymer dielectric layer includes a different ionic liquid concentration. The polymer dielectric layer is in between the first flexible electrode and the second flexible electrode.
摘要翻译：电活性聚合物结构包括第一柔性电极，第二柔性电极和在第一电极的顶部上具有至少两个区域的离子液体的聚合物电介质层。聚合物介电层的每个区域包括不同的离子液体浓度。聚合物介电层位于第一柔性电极和第二柔性电极之间。

4. 发明授权

US09406896B2 Pre-fabricated substrate for printed electronic devices 有权
标题翻译：用于印刷电子设备的预制衬底
公开(公告)号：US09406896B2
公开(公告)日：2016-08-02
申请号：US14152183
申请日：2014-01-10
申请人： Palo Alto Research Center Incorporated
发明人： Ping Mei , Janos Veres , Tse Nga Ng
IPC分类号： H01L29/66 , H01L51/05 , H01L51/10 , H01L51/00
CPC分类号： H01L51/0541 , H01L51/0004 , H01L51/102
摘要： A pre-patterned substrate has a supporting material, a plurality of segments on the supporting material, a plurality of interdigitated line structures within each segment to allow formation of features, and an isolation region between the segments.
摘要翻译：预图案化衬底具有支撑材料，支撑材料上的多个段，每个段内的多个叉指线结构，以允许形成特征，以及段之间的隔离区。

5. 发明授权

US09156194B2 Digital 3D fabrication using multi-layered mold 有权
标题翻译：数字3D制作采用多层模具
公开(公告)号：US09156194B2
公开(公告)日：2015-10-13
申请号：US13831358
申请日：2013-03-14
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , JengPing Lu , Eugene M. Chow , Timothy David Stowe , Janos Veres , Philipp H. Schmaelzle
IPC分类号： B29C33/38 , B29C67/00 , B29C33/44 , B29C33/00
CPC分类号： B29C33/3835 , B29C33/005 , B29C33/3842 , B29C33/448 , B29C64/00 , B29C64/106 , B29C67/0051 , B29C67/0055 , B29C2033/385
摘要： A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed.
摘要翻译：复制3D结构通过图案化每个模具层以形成与结构的周边表面的相应横截面相匹配的空隙/开口，并且用结构材料填充每个层的图案化开口（即，在沉积后续的模具材料层之前）。模具材料（例如，光致抗蚀剂或另一种可溶解的牺牲材料）被覆盖沉积（例如，通过狭缝模头，喷涂），然后使用激光或印刷掩模进行图案化。每层建模材料（例如，聚合物，陶瓷或金属或其组合）被电镀或以其他方式沉积在先前形成的建模材料层上。通过使用相对薄的模具层实现高垂直分辨率。重复模层沉积，图案化和建模材料沉积，直到复制3D结构完全形成在多层模具内，然后模具被溶解或以其他方式去除。

6. 发明申请

US20150048714A1 ELECTROACTIVE POLYMER STRUCTURES PRINTED WITH VARYING COMPOSITIONS OF IONS 有权
标题翻译：电离聚合物结构印有不断变化的离子组成
公开(公告)号：US20150048714A1
公开(公告)日：2015-02-19
申请号：US13966060
申请日：2013-08-13
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Kye-Si Kwon
IPC分类号： H02N11/00 , B81B3/00 , B81C1/00
CPC分类号： H01L41/0933 , H01L41/0926 , H01L41/0946 , H01L41/0953 , H01L41/193 , Y10T29/49117
摘要： An electroactive polymer structure includes a first flexible electrode, a second flexible electrode, and a polymer dielectric layer with ionic liquid on top of the first electrode including at least two regions. Each region of the polymer dielectric layer includes a different ionic liquid concentration. The polymer dielectric layer is in between the first flexible electrode and the second flexible electrode.
摘要翻译：电活性聚合物结构包括第一柔性电极，第二柔性电极和在第一电极的顶部上具有至少两个区域的离子液体的聚合物电介质层。聚合物介电层的每个区域包括不同的离子液体浓度。聚合物介电层位于第一柔性电极和第二柔性电极之间。

7. 发明授权

US10427397B2 Structural designs for stretchable, conformal electrical interconnects 有权
公开(公告)号：US10427397B2
公开(公告)日：2019-10-01
申请号：US15007502
申请日：2016-01-27
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Ping Mei , Corie Lynn Cobb , Steven E. Ready , John S. Paschkewitz
IPC分类号： H05K1/11 , H05K3/46 , H05K3/12 , H05K1/02 , B33Y80/00
摘要： Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure.

8. 发明申请

US20190124757A1 BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE WITHOUT LASER CUT 审中-公开
公开(公告)号：US20190124757A1
公开(公告)日：2019-04-25
申请号：US16190324
申请日：2018-11-14
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Ping Mei , Brent S. Krusor , Gregory L. Whiting , Steven E. Ready , Janos Veres
IPC分类号： H05K1/02 , H01L23/00 , H01L21/56 , H05K3/14 , H05K1/03 , H05K1/18
摘要： Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

9. 发明授权

US10245820B2 Forming sacrificial structures using phase-change materials that sublimate 有权
公开(公告)号：US10245820B2
公开(公告)日：2019-04-02
申请号：US15391723
申请日：2016-12-27
申请人： Palo Alto Research Center Incorporated
发明人： Tse Nga Ng , Bing R. Hsieh , Steven E. Ready
IPC分类号： B29C33/44 , B29C33/52 , B33Y10/00 , B29C64/106 , B29C64/118 , B29C64/112 , B29C64/124 , B29C64/40 , B29K75/00
摘要： A structure can include a first layer of a polymer material and a second layer of the polymer material on the first layer, the first and second layers of the polymer material defining a hollow space that was formed by way of a temporary sacrificial structure that was made of a sublimable material.

10. 发明申请

US20180114932A1 ORGANIC SCHOTTKY DIODES 审中-公开
公开(公告)号：US20180114932A1
公开(公告)日：2018-04-26
申请号：US15837843
申请日：2017-12-11
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： BING R. HSIEH , Tse Nga Ng , Gregory Whiting
IPC分类号： H01L51/05
CPC分类号： H01L51/0579 , H01L51/0003
摘要： An organic diode has a substrate, a first conductor layer on the substrate, an organic semiconductor layer on the first conductor layer, and a second conductor layer on the organic substrate layer, wherein one of the conductor layers has an injection enhancement.

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