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    • 5. 发明授权
    • Transistor array with shared body contact and method of manufacturing
    • 具有共享身体接触的晶体管阵列和制造方法
    • US08455955B2
    • 2013-06-04
    • US12306947
    • 2007-06-29
    • Paul Ronald StribleyJohn Nigel Ellis
    • Paul Ronald StribleyJohn Nigel Ellis
    • H01L21/70
    • H01L27/0203H01L21/823425H01L27/0705H01L27/0921H01L29/4238H01L29/78
    • An array of transistors arranged next to each other on a semiconductor material forming a substrate, the substrate comprising p-well or n-well diffusions forming a body, which diffusions are used as the body regions of the transistors, each transistor comprising a source, a drain and a gate, wherein the array of transistors further comprises at least one electrical connection to the body, wherein said electrical connection is shared by at least two transistors of said array. Also disclosed is a semiconductor device comprising at least one source, at least one drain, at least one gate between the at least one source and the at least one drain, and at least one structure of the same material as the at least one gate which does not have a connection means for electrical connection to the at least one gate.
    • 在形成衬底的半导体材料上彼此相邻布置的晶体管阵列,所述衬底包括形成体的p阱或n阱扩散,所述扩散用作晶体管的体区,每个晶体管包括源极, 漏极和栅极,其中所述晶体管阵列还包括与所述主体的至少一个电连接,其中所述电连接由所述阵列的至少两个晶体管共享。 还公开了一种半导体器件,其包括至少一个源极,至少一个漏极,至少一个源极与至少一个漏极之间的至少一个栅极,以及与该至少一个栅极相同的材料的至少一个结构, 没有用于与至少一个门的电连接的连接装置。
    • 7. 发明申请
    • CAPACITOR AND A METHOD OF MANUFACTURING A CAPACITOR
    • 电容器和制造电容器的方法
    • US20100237465A1
    • 2010-09-23
    • US12669733
    • 2008-07-18
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • H01L29/92H01L21/02
    • H01G4/33H01L28/40
    • A device comprises a substrate (22); a first MiM capacitor (10,20,11) disposed over the substrate; and a second MiM capacitor (10′,20′,11) disposed over the first MiM capacitor. The first MiM capacitor and the second MiM capacitor are electrically connected in parallel. The two MiM capacitors are vertically stacked one above the other.Each MiM capacitor comprises an interconnection layer (10,10′) of the CMOS process as one plate and a thinner conductive layer (11,11′) as the second plate, with an insulating layer (20,20′) disposed therebetween. This allows each MiM capacitor to be formed between two CMOS process interconnection layers.The second plate of the second MiM capacitor is substantially co-extensive with the second plate of the first MiM capacitor, and is disposed substantially directly over the second plate of the first MiM capacitor. The same mask may be used to pattern the second plate of the second MiM capacitor and the second plate of the first MiM capacitor. This minimises the number of masks required, and so minimises the mask investment cost.
    • 一种器件包括衬底(22); 设置在所述衬底上的第一MiM电容器(10,20,11) 以及设置在所述第一MiM电容器上的第二MiM电容器(10',20',11)。 第一个MiM电容器和第二个MiM电容器并联电连接。 两个MiM电容器垂直堆叠在一起。 每个MiM电容器包括作为一个板的CMOS工艺的互连层(10,10')和作为第二板的较薄的导电层(11,11'),其间设置绝缘层(20,20')。 这允许在两个CMOS工艺互连层之间形成每个MiM电容器。 第二MiM电容器的第二板与第一MiM电容器的第二板基本上共同扩展,并且基本上直接布置在第一MiM电容器的第二板上。 可以使用相同的掩模来图案化第二MiM电容器的第二板和第一MiM电容器的第二板。 这最大限度地减少了掩模所需的数量,从而最小化掩模投资成本。