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1. 发明申请

US20200168985A1 TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20200168985A1
公开(公告)日：2020-05-28
申请号：US16619440
申请日：2018-06-26
申请人： ROHM CO., LTD.
发明人： Toshikazu MUKAI , Jaeyoung KIM , Tomoichiro TOYAMA
IPC分类号： H01Q1/38 , H01L27/06 , H01L23/00 , H01L23/66 , H01L29/88 , H01Q9/16
摘要： A terahertz element of an aspect of the present disclosure includes a semiconductor substrate, first and second conductive layers, and an active element. The first and second conductive layers are on the substrate and mutually insulated. The active element is on the substrate and electrically connected to the first and second conductive layers. The first conductive layer includes a first antenna part extending along a first direction, a first capacitor part offset from the active element in a second direction as viewed in a thickness direction of the substrate, and a first conductive part connected to the first capacitor part. The second direction is perpendicular to the thickness direction and first direction. The second conductive layer includes a second capacitor part, stacked over and insulated from the first capacitor part. The substrate includes a part exposed from the first and second capacitor parts. The first conductive part has a portion spaced apart from the first antenna part in the second direction with the exposed part therebetween as viewed in the thickness direction.

2. 发明申请

US20150280094A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译：半导体发光器件
公开(公告)号：US20150280094A1
公开(公告)日：2015-10-01
申请号：US14695915
申请日：2015-04-24
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA
IPC分类号： H01L33/64 , H01L33/50 , H01L33/60 , H01L27/15 , H01L33/48 , H01L33/52
CPC分类号： H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/08 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48465
摘要： A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
摘要翻译：半导体发光器件包括LED芯片，其包括层叠在基板上的n型半导体层，有源层和p型半导体层。 LED芯片还包括连接到p型半导体的阳极电极和连接到n型半导体的阴极。阳极和阴极电极面对安装有LED芯片的壳体。壳体包括包括前表面和后表面的基底构件，以及包括在前表面形成有阳极和阴极衬垫的前表面层的布线，在后表面上形成有阳极和阴极安装电极的后表面层，阳极通过布线连接阳极焊盘和阳极安装电极并穿过基底部件的一部分，以及通过连接阴极焊盘和阴极安装电极并穿过基底部件的一部分的布线连接阴极。

3. 发明申请

US20200350478A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开
公开(公告)号：US20200350478A1
公开(公告)日：2020-11-05
申请号：US16933756
申请日：2020-07-20
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA , Hideaki ANZAI , Kenya HASHIMOTO , Ryo YATAGAI
IPC分类号： H01L33/62 , H01L33/48 , H01L33/24
摘要： A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.

4. 发明申请

US20190189878A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开
公开(公告)号：US20190189878A1
公开(公告)日：2019-06-20
申请号：US16214990
申请日：2018-12-10
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA , Hideaki ANZAI , Kenya HASHIMOTO , Ryo YATAGAI
IPC分类号： H01L33/62 , H01L33/24 , H01L33/48
摘要： A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.

5. 发明申请

US20170294567A1 LED MODULE 审中-公开
公开(公告)号：US20170294567A1
公开(公告)日：2017-10-12
申请号：US15634602
申请日：2017-06-27
申请人： ROHM CO., LTD.
发明人： Masahiko KOBAYAKAWA , Tomoichiro TOYAMA
IPC分类号： H01L33/60 , H01L25/075 , H01L33/62
CPC分类号： H01L33/60 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/49113 , H01L2224/73265 , H01L2924/01322 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An LED module according to the present invention includes an LED unit 2 and a case 1, where the LED unit includes an LED chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the LED unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer edge 2a of the LED unit 2 as viewed in plan. These arrangements prevent the light emission amount of the LED module A1 from reducing with time.

6. 发明申请

US20230098414A1 SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20230098414A1
公开(公告)日：2023-03-30
申请号：US17911359
申请日：2021-02-24
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA
IPC分类号： H01L23/495 , H01L23/00 , H01L33/52 , H01L33/62
摘要： A semiconductor device includes: a supporting member having a wiring including a die-pad; a semiconductor element bonded to the die-pad; a wire bonded to the wiring and the semiconductor element; and a bonding layer that has a conductivity and bonds the die-pad and the semiconductor element. When viewed in a thickness direction of the semiconductor element, the die-pad includes a first region included inside a peripheral edge of the semiconductor element and a second region that is connected to the first region and extends farther then the peripheral edge of the semiconductor element. When viewed in the thickness direction, the wire is separated from the second region.

7. 发明申请

US20180269136A1 ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180269136A1
公开(公告)日：2018-09-20
申请号：US15856181
申请日：2017-12-28
申请人： ROHM CO., LTD.
发明人： Yasunobu SHOJI , Tomoichiro TOYAMA
IPC分类号： H01L23/495 , H01L21/48 , H01L33/62 , H01L23/00
CPC分类号： H01L23/49513 , H01L21/4825 , H01L23/13 , H01L23/4952 , H01L23/49805 , H01L24/32 , H01L24/48 , H01L24/73 , H01L33/62 , H01L2224/26175 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/35121 , H01L2933/0066 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： An electronic device includes: a base; a wiring pattern formed on the base; an electronic element disposed on the wiring pattern; and a bonding layer interposed between the electronic element and the wiring pattern, wherein an opening is formed in the wiring pattern and the bonding layer is in contact with a portion of the base exposed by the opening in the wiring pattern

8. 发明申请

US20170309592A1 SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20170309592A1
公开(公告)日：2017-10-26
申请号：US15490458
申请日：2017-04-18
申请人： ROHM CO., LTD.
发明人： Masahiko KOBAYAKAWA , Tomoichiro TOYAMA
IPC分类号： H01L23/00 , H01L43/04
CPC分类号： H01L24/49 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L43/04 , H01L2224/05554 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/4905 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a base member, a wiring portion, a semiconductor element, and a resin package. The base member has an obverse surface, a reverse surface, and a side surface connecting the obverse surface and the reverse surface. The semiconductor element is electrically connected to the wiring portion and arranged on the obverse surface of the base member. The resin package covers the semiconductor element. The wiring portion includes an obverse-surface portion formed on the obverse surface, a reverse-surface portion formed on the reverse surface, and a through portion connecting the obverse-surface portion and the reverse-surface portion. The through portion has an exposed surface exposed from the side surface of the base member and a larger portion. The larger portion is positioned more inward than the exposed surface as viewed in the thickness direction of the base member. The larger portion has a dimension larger than the exposed surface in a first direction that is perpendicular to the thickness direction and parallel to the exposed surface.

9. 发明申请

US20150162456A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150162456A1
公开(公告)日：2015-06-11
申请号：US14566197
申请日：2014-12-10
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA
IPC分类号： H01L31/0203 , H01L31/02 , H01L33/62 , H01L31/0236 , H01L33/56 , H01L33/48
CPC分类号： H01L31/0203 , H01L31/02002 , H01L31/02366 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A semiconductor device includes a base, a semiconductor element disposed on the base, a resist layer formed on the base, and a resin-sealed portion covering the semiconductor element and the resist layer. A plurality of concave portions is formed in the resist layer, and each of the plurality of concave portions is filled with a part of the resin-sealed portion.
摘要翻译：半导体器件包括基底，设置在基底上的半导体元件，形成在基底上的抗蚀剂层和覆盖半导体元件和抗蚀剂层的树脂密封部分。在抗蚀剂层中形成多个凹部，多个凹部中的每一个被树脂密封部分的一部分填充。

10. 发明申请

US20220310889A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20220310889A1
公开(公告)日：2022-09-29
申请号：US17840296
申请日：2022-06-14
申请人： Rohm Co., Ltd.
发明人： Tomoichiro TOYAMA , Ryo KITTAKA
IPC分类号： H01L33/56 , H01L33/62 , H01L33/00 , H01L33/54
摘要： A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.

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