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1. 发明授权

US10717645B2 Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment 有权
公开(公告)号：US10717645B2
公开(公告)日：2020-07-21
申请号：US15535687
申请日：2015-12-17
申请人： Robert Bosch GmbH , Ando Feyh , Gary O'Brien
发明人： Ando Feyh , Gary O'Brien
IPC分类号： H01L31/02 , H01L27/146 , H01L21/56 , B81C1/00 , H01L23/28 , H01L23/31 , H01L23/24 , G01L19/14 , G01L19/00 , B81B7/00
摘要： A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface.

2. 发明授权

US10298858B2 Methods to combine radiation-based temperature sensor and inertial sensor and/or camera output in a handheld/mobile device 有权
公开(公告)号：US10298858B2
公开(公告)日：2019-05-21
申请号：US14092152
申请日：2013-11-27
申请人： Robert Bosch GmbH
发明人： Ando Feyh , Sam Kavusi , Johan Vanderhaegen , Gary Yama , Fabian Purkl
IPC分类号： H04N7/18 , H04N5/33 , G01J5/08 , G01J5/02 , H04N5/225 , H04N5/232 , H04N13/02
摘要： A device for generating thermal images includes a low resolution infrared (IR) sensor supported within a housing and having a field of view. The IR sensor is configured to generate thermal images of objects within the field of view having a first resolution. A spatial information sensor supported within the housing is configured to determine a position for each of the thermal images generated by the IR sensor. A processing unit supported within the housing is configured to receive the thermal images and to combine the thermal images based on the determined positions of the thermal images to produce a combined thermal image having a second resolution that is greater than the first resolution.

3. 发明授权

US10224540B2 Li-ion battery with alumina coated porous silicon anode 有权
公开(公告)号：US10224540B2
公开(公告)日：2019-03-05
申请号：US14910695
申请日：2014-08-08
申请人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh , Robert Bosch GmbH
发明人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh
IPC分类号： H01M4/36 , H01M10/0525 , H01M10/0562 , C23C16/40 , C23C16/455 , C23C16/52 , H01M4/04 , H01M4/38 , H01M4/134 , H01M10/058 , C23C16/04 , H01M4/02
摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.

4. 发明授权

US10160632B2 System and method for forming a buried lower electrode in conjunction with an encapsulated MEMS device 有权
公开(公告)号：US10160632B2
公开(公告)日：2018-12-25
申请号：US13969522
申请日：2013-08-17
申请人： Robert Bosch GmbH
发明人： Andrew Graham , Ando Feyh , Gary O'Brien
IPC分类号： B81B3/00 , B81C1/00 , B81B7/00
摘要： A system and method for forming a sensor device with a buried first electrode includes providing a first silicon portion with an electrode layer and a second silicon portion with a device layer. The first silicon portion and the second silicon portion are adjoined along a common oxide layer formed on the electrode layer of the first silicon portion and the device layer of the second silicon portion. The resulting multi-silicon stack includes a buried lower electrode that is further defined by a buried oxide layer, a highly-doped ion implanted region, or a combination thereof. The multi-silicon stack has a plurality of silicon layers and silicon dioxide layers with electrically isolated regions in each layer allowing for both the lower electrode and an upper electrode. The multi-silicon stack further includes a spacer that enables the lower electrode to be accessible from a topside of the sensor device.

5. 发明授权

US10006810B2 Method to modulate the sensitivity of a bolometer via negative interference 有权
公开(公告)号：US10006810B2
公开(公告)日：2018-06-26
申请号：US15516821
申请日：2015-10-09
申请人： Robert Bosch GmbH
发明人： Thomas Rocznik , Fabian Purkl , Gary O'Brien , Ando Feyh , Bongsang Kim , Ashwin Samarao , Gary Yama
IPC分类号： G01J5/20 , G01J5/06 , G01J5/08 , G01J5/24
CPC分类号： G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , G01J5/24 , G01J2005/066 , G01J2005/067
摘要： A semiconductor sensor system, in particular a bolometer, includes a substrate, an electrode supported by the substrate, an absorber spaced apart from the substrate, a voltage source, and a current source. The electrode can include a mirror, or the system may include a mirror separate from the electrode. Radiation absorption efficiency of the absorber is based on a minimum gap distance between the absorber and mirror. The current source applies a DC current across the absorber structure to produce a signal indicative of radiation absorbed by the absorber structure. The voltage source powers the electrode to produce a modulated electrostatic field acting on the absorber to modulate the minimum gap distance. The electrostatic field includes a DC component to adjust the absorption efficiency, and an AC component that cyclically drives the absorber to negatively interfere with noise in the signal.

6. 发明授权

US09903763B2 Titanium nitride for MEMS bolometers 有权
公开(公告)号：US09903763B2
公开(公告)日：2018-02-27
申请号：US15022601
申请日：2014-09-26
申请人： Robert Bosch GmbH
发明人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh , Fabian Purkl , Gary Yama
IPC分类号： G01J5/20 , G01J5/02
CPC分类号： G01J5/20 , G01J5/024
摘要： A method for fabricating a semiconductor device includes patterning a sacrificial layer on a substrate to define a bolometer, with trenches being formed in the sacrificial layer to define anchors for the bolometer, the trenches extending through the sacrificial layer and exposing conductive elements at the bottom of the trenches. A thin titanium nitride layer is then deposited on the sacrificial layer and within the trenches. The titanium nitride layer is configured to form a structural support for the bolometer and to provide an electrical connection to the conductive elements on the substrate.

7. 发明授权

US09698281B2 CMOS bolometer 有权
公开(公告)号：US09698281B2
公开(公告)日：2017-07-04
申请号：US13969828
申请日：2013-08-19
申请人： Robert Bosch GmbH
发明人： Gary Yama , Ando Feyh , Ashwin Samarao , Fabian Purkl , Gary O'Brien
IPC分类号： G01J5/02 , H01L31/02 , G01J5/20 , H01L27/144
CPC分类号： H01L31/02019 , G01J5/023 , G01J5/0235 , G01J5/024 , G01J5/20 , G01J2005/204 , H01L27/1446
摘要： A method of manufacturing a semiconductor device includes forming at least one sacrificial layer on a substrate during a complementary metal-oxide-semiconductor (CMOS) process. An absorber layer is deposited on top of the at least one sacrificial layer. A portion of the at least one sacrificial layer beneath the absorber layer is removed to form a gap over which a portion of the absorber layer is suspended. The sacrificial layer can be an oxide of the CMOS process with the oxide being removed to form the gap using a selective hydrofluoric acid vapor dry etch release process. The sacrificial layer can also be a polymer layer with the polymer layer being removed to form the gap using an O2 plasma etching process.

8. 发明授权

US09588073B2 Resistive MEMS humidity sensor 有权
标题翻译：电阻式MEMS湿度传感器
公开(公告)号：US09588073B2
公开(公告)日：2017-03-07
申请号：US14108198
申请日：2013-12-16
申请人： Robert Bosch GmbH
发明人： Ando Feyh , Andrew Graham , Ashwin Samarao , Gary Yama , Gary O'Brien
IPC分类号： G01N27/12
CPC分类号： G01N27/121
摘要： A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.
摘要翻译：半导体器件包括衬底，设置在衬底的表面上的绝缘膜和由沉积在绝缘膜的顶部上的导电材料形成的感测膜。感测膜在绝缘膜上的第一位置和第二位置之间限定至少一个导电路径。第一电路连接在绝缘层上的第一位置处电连接到感测膜，并且第二电路连接在第二位置电连接到感测膜。控制电路可操作地连接到第一电路连接和用于测量感测膜的电阻的第二电路连接。感测膜具有能够以取决于环境水分含量的方式预测地改变感测膜的电阻率的厚度。

9. 发明授权

US09557222B2 Portable device with temperature sensing 有权
标题翻译：带温度传感器的便携式设备
公开(公告)号：US09557222B2
公开(公告)日：2017-01-31
申请号：US14199480
申请日：2014-03-06
申请人： Robert Bosch GmbH
发明人： Ando Feyh , Gary O'Brien , Gary Yama
IPC分类号： G01J5/50 , G01J5/08 , G01J5/20 , G01J5/00
CPC分类号： G01J5/505 , G01J5/0265 , G01J5/0859 , G01J5/089 , G01J5/20 , G01J2005/0077
摘要： A hand-held device having a housing and a processor disposed within the housing, includes a camera and a temperature sensing element having an adjustable field of view. The camera is configured to generate an image of an object and to permit the user to frame the image at a portion of the object to determine the temperature of the framed portion. The temperature sensing element includes a plurality of temperature sensors and the processor is configured to select ones of the plurality of sensors to produce a field of view (FOV) of the temperature sensing element that is less than or equal to the frame in the image. The selected sensors are activated to generate signals corresponding to the temperature of the object in the FOV and the processor is configured to determine a sensed temperature based on the sensor signals.
摘要翻译：具有壳体和设置在壳体内的处理器的手持式装置包括照相机和具有可调视场的温度感测元件。相机被配置为生成对象的图像并且允许用户在对象的一部分处对图像进行框架以确定框架部分的温度。温度感测元件包括多个温度传感器，并且处理器被配置为选择多个传感器中的一个以产生小于或等于图像中的帧的温度感测元件的视场（FOV）。所选择的传感器被激活以产生对应于FOV中的物体的温度的信号，并且处理器被配置为基于传感器信号来确定感测的温度。

10. 发明授权

US09517928B2 Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture 有权
标题翻译：微机械功能装置，特别是扬声器装置，以及适当的制造方法
公开(公告)号：US09517928B2
公开(公告)日：2016-12-13
申请号：US13650495
申请日：2012-10-12
申请人： Robert Bosch GmbH
发明人： Ricardo Ehrenpfordt , Mathias Bruendel , Andre Gerlach , Christina Leinenbach , Sonja Knies , Ando Feyh , Ulrike Scholz
IPC分类号： B81C1/00 , H04R19/00 , H04R31/00
CPC分类号： B81C1/0023 , B81B2201/0257 , H01L2224/48091 , H04R19/005 , H04R31/006 , Y10T29/4913 , H01L2924/00014
摘要： A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.
摘要翻译：微机械功能装置，特别是扬声器装置，包括基板，安装在基板上的至少一个电路芯片以及封装有电路芯片的封装封装。功能装置还包括微机械功能装置，特别是具有多个微机械式扬声器的扬声器装置，其安装在包络包装上。覆盖装置安装在微机械功能装置的上方，特别是扬声器装置，与包络包装件相对。实现微机械功能装置的制造方法。

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