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1. 发明授权

US08456249B2 Micro-scale system to provide thermal isolation and electrical communication between substrates 有权
标题翻译：微尺度系统提供基板之间的热隔离和电气通信
公开(公告)号：US08456249B2
公开(公告)日：2013-06-04
申请号：US13105735
申请日：2011-05-11
申请人： Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
发明人： Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
IPC分类号： H01S1/06 , H03B17/00
CPC分类号： H01S1/06 , B05D3/10 , B05D5/00 , B32B3/10 , B32B3/12 , B32B3/30 , B32B15/08 , B81B3/0081 , B81B7/0006 , C23F1/00 , G04F5/14 , H01S1/02 , H05K1/14 , Y10T428/24149 , Y10T428/24331 , Y10T428/24521 , Y10T428/24545
摘要： A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
摘要翻译：微型设备包括具有从带的第一侧延伸的增强结构的微尺寸刚性聚对二甲苯带，通过微尺寸刚性聚对二甲苯带悬挂的第一硅衬底，与第一衬底共形耦合的微尺寸刚性聚对二甲苯带和第二衬底保形地耦合到微尺寸刚性聚对二甲苯带，以悬浮第一硅衬底通过微尺寸刚性聚对二甲苯带。

2. 发明授权

US08654332B2 Chip-scale optics module for optical interrogators 有权
标题翻译：用于光学询问器的芯片级光学模块
公开(公告)号：US08654332B2
公开(公告)日：2014-02-18
申请号：US13166746
申请日：2011-06-22
申请人： Robert L. Borwick , Jeffrey F DeNatale
发明人： Robert L. Borwick , Jeffrey F DeNatale
IPC分类号： G01J4/00
CPC分类号： G02B5/3025 , Y10T29/49
摘要： A method is disclosed for manufacturing a chip-scale optics module for an optical interrogator. The method includes aligning a polarization axis of a linear polarizer to an angle of 45 degrees from a fast axis of a quarter wave plate to enable circular polarization of a beam, when a beam is introduced to the linear polarizer, coupling the linear polarizer to the quarter wave plate after the aligning to form a circular polarizing filter sheet and then dicing the circular polarizing filter sheet to obtain a plurality of chip-scale circular polarizing filters. Each of the chip-scale circular polarizing filters is diced to have an edge that defines a polarization location index for the linear polarizer. A linear polarizer plate face of one of the chip-scale circular polarizing filters is then positioned so that the linear polarizer plate face is aligned with and parallel to an output face of a laser, whereby the polarization axis of the linear polarizer is not orthogonal to a polarization axis of the laser. The chip-scale circular polarizing filter is coupled to a frame after the positioning step.
摘要翻译：公开了一种用于制造用于光学询问器的芯片级光学模块的方法。该方法包括将线性偏振器的偏振轴与四分之一波片的快轴成45度的角度，以便当光束被引入到线性偏振器时，使得光束能够进行圆偏振，将线性偏振器耦合到四分之一波片在对准之后形成圆偏振滤光片，然后切割圆偏振滤光片，以获得多个芯片级圆偏振滤光片。每个芯片级圆偏振滤光器被切割成具有限定线性偏振器的极化位置指数的边缘。然后定位一个芯片级圆偏振滤光器的线性偏振板面，使得线性偏振板面与激光器的输出面对准并平行，由此线偏振器的偏振轴不与激光的偏振轴。在定位步骤之后，芯片级圆偏振滤光器耦合到框架。

3. 发明申请

US20120286884A1 Micro-scale System to Provide Thermal Isolation and Electrical Communication Between Substrates 有权
标题翻译：微尺度系统提供基板之间的热隔离和电气通信
公开(公告)号：US20120286884A1
公开(公告)日：2012-11-15
申请号：US13105735
申请日：2011-05-11
申请人： Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
发明人： Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
IPC分类号： H01S1/02 , B05D5/00 , B05D3/10 , H05K1/14 , B32B3/12 , B32B15/08 , B32B3/10 , C23F1/00 , B32B3/30
CPC分类号： H01S1/06 , B05D3/10 , B05D5/00 , B32B3/10 , B32B3/12 , B32B3/30 , B32B15/08 , B81B3/0081 , B81B7/0006 , C23F1/00 , G04F5/14 , H01S1/02 , H05K1/14 , Y10T428/24149 , Y10T428/24331 , Y10T428/24521 , Y10T428/24545
摘要： A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
摘要翻译：微型设备包括具有从带的第一侧延伸的增强结构的微尺寸刚性聚对二甲苯带，通过微尺寸刚性聚对二甲苯带悬挂的第一硅衬底，与第一衬底共形耦合的微尺寸刚性聚对二甲苯带和第二衬底保形地耦合到微尺寸刚性聚对二甲苯带，以悬浮第一硅衬底通过微尺寸刚性聚对二甲苯带。

4. 发明授权

US07538032B2 Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method 有权
标题翻译：用于制造通过所述方法制造的高纵横比孔和器件的低温方法
公开(公告)号：US07538032B2
公开(公告)日：2009-05-26
申请号：US11167014
申请日：2005-06-23
申请人： Robert L. Borwick , Philip A. Stupar , Jeffrey F. DeNatale , Chailun Tsai , Zhimin J. Yao , Kathleen Garrett , John White , Les Warren , Morgan Tench
发明人： Robert L. Borwick , Philip A. Stupar , Jeffrey F. DeNatale , Chailun Tsai , Zhimin J. Yao , Kathleen Garrett , John White , Les Warren , Morgan Tench
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L21/288 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.
摘要翻译：本发明的实施例涉及在低温下形成小直径通孔的方法。在优选实施例中，通过形成贯穿衬底通孔来制造贯穿衬底通孔; 以及通过流动溶液电镀技术将导电材料沉积到所述通孔中，其中所述导电材料释放通过所述通孔推动所述导电材料的气体，以便于用所述导电材料电镀所述通孔。在优选的实施例中，衬底的制造在低温下进行。

5. 发明申请

US20080238446A1 High temperature microelectromechanical (MEM) devices 有权
标题翻译：高温微机电（MEM）器件
公开(公告)号：US20080238446A1
公开(公告)日：2008-10-02
申请号：US11897708
申请日：2007-08-30
申请人： Jeffrey F. DeNatale , Robert L. Borwick , Philip A. Stupar
发明人： Jeffrey F. DeNatale , Robert L. Borwick , Philip A. Stupar
IPC分类号： G01R27/26
CPC分类号： B81C1/0069 , B81C2203/032
摘要： A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.
摘要翻译：根据本发明的微机电（MEM）装置包括半导体晶片 - 通常是SOI晶片，衬底和将晶片接合到衬底以形成复合结构的高温接合。复合结构的部分被图案化和蚀刻以限定静止和可移动的MEM元件，其中可移动元件机械地联接到固定元件。高温键优选是机械结合，其中晶片和衬底具有对准和机械连接以形成热压接以实现结合的各自的焊盘。金属化层通常沉积在复合结构上并被图案化以为器件提供电互连。金属化层优选地包括诸如铂的导电耐火材料以承受高温环境。

6. 发明申请

US20120327413A1 CHIP-SCALE OPTICS MODULE FOR OPTICAL INTERROGATORS 有权
标题翻译：用于光学干涉仪的CHIP-SCALE OPTICS模块
公开(公告)号：US20120327413A1
公开(公告)日：2012-12-27
申请号：US13166746
申请日：2011-06-22
申请人： Robert L. Borwick , Jeffrey Denatale
发明人： Robert L. Borwick , Jeffrey Denatale
IPC分类号： G01N21/21 , B23P17/04 , F21V9/14
CPC分类号： G02B5/3025 , Y10T29/49
摘要： A method is disclosed for manufacturing a chip-scale optics module for an optical interrogator. The method includes aligning a polarization axis of a linear polarizer to an angle of 45 degrees from a fast axis of a quarter wave plate to enable circular polarization of a beam, when a beam is introduced to the linear polarizer, coupling the linear polarizer to the quarter wave plate after the aligning to form a circular polarizing filter sheet and then dicing the circular polarizing filter sheet to obtain a plurality of chip-scale circular polarizing filters. Each of the chip-scale circular polarizing filters is diced to have an edge that defines a polarization location index for the linear polarizer. A linear polarizer plate face of one of the chip-scale circular polarizing filters is then positioned so that the linear polarizer plate face is aligned with and parallel to an output face of a laser, whereby the polarization axis of the linear polarizer is not orthogonal to a polarization axis of the laser. The chip-scale circular polarizing filter is coupled to a frame after the positioning step.
摘要翻译：公开了一种用于制造用于光学询问器的芯片级光学模块的方法。该方法包括将线性偏振器的偏振轴与四分之一波片的快轴成45度的角度，以便当光束被引入到线性偏振器时，使得光束能够进行圆偏振，将线性偏振器耦合到四分之一波片在对准之后形成圆偏振滤光片，然后切割圆偏振滤光片，以获得多个芯片级圆偏振滤光片。每个芯片级圆偏振滤光器被切割成具有限定线性偏振器的极化位置指数的边缘。然后定位一个芯片级圆偏振滤光器的线性偏振板面，使得线性偏振板面与激光器的输出面对准并平行，由此线偏振器的偏振轴不与激光的偏振轴。在定位步骤之后，芯片级圆偏振滤光器耦合到框架。

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