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1. 发明授权

US09524817B2 Metal magnetic powder and method for forming the same, and inductor manufactured using the metal magnetic powder 有权
标题翻译：金属磁性粉末及其形成方法，以及使用金属磁性粉末制造的电感器
公开(公告)号：US09524817B2
公开(公告)日：2016-12-20
申请号：US14048825
申请日：2013-10-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hak Kwan Kim , Sung Yong An , Sung Jae Lee , Jung Wook Seo
IPC分类号： H01F27/24 , H01F5/00 , H01F27/28 , H01F1/00 , H01F1/26 , H01F1/33 , H01F17/00
CPC分类号： H01F1/26 , H01F1/33 , H01F17/0033
摘要： Disclosed herein is a metal magnetic powder, and the metal magnetic powder according to the exemplary embodiment of the present invention includes a soft magnetic core particle and a multilayer coating film covering the core particle and having a multilayer structure, the multilayer coating film including an oxide film formed by heat treating the core particle and an insulation film formed by coating a coating particle with respect to the core particle.
摘要翻译：本发明公开了一种金属磁粉，根据本发明的示例性实施方式的金属磁性粉末包括软磁芯颗粒和覆盖芯颗粒并具有多层结构的多层涂膜，所述多层涂膜包含氧化物通过热处理芯颗粒形成的膜和通过相对于芯颗粒涂覆涂层颗粒而形成的绝缘膜。

2. 发明授权

US09287317B2 Image sensor module and method of manufacturing the same 有权
标题翻译：图像传感器模块及其制造方法
公开(公告)号：US09287317B2
公开(公告)日：2016-03-15
申请号：US14154758
申请日：2014-01-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Bum Cha , Sung Jae Lee , In Cheol Chang , Sung Jun Byun
IPC分类号： H01L27/146 , H01L23/00 , H04N5/225
CPC分类号： H01L27/14685 , H01L24/83 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/83192 , H01L2224/83856 , H01L2924/3511 , H04N5/2257
摘要： There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
摘要翻译：提供了一种图像传感器模块，包括：具有175μm或更小的小厚度并且具有第一热膨胀系数的图像传感器; 具有安装在其上并具有高于第一热膨胀系数的第二热膨胀系数的图像传感器的基板; 以及设置在图像传感器和基板之间并且在玻璃化转变温度Tg以上具有第三热膨胀系数为130ppm /℃以上的粘合剂的粘合剂层。

3. 发明授权

US09161457B2 Apparatus for manufacturing camera module 有权
标题翻译：相机模块制造装置
公开(公告)号：US09161457B2
公开(公告)日：2015-10-13
申请号：US13827488
申请日：2013-03-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Jae Lee , Byung Jae Kim , Sang Jin Kim , Soo Gil Shin , Seung Hee Cho
IPC分类号： H05K3/30 , H04N5/225
CPC分类号： H05K3/30 , H04N5/2253 , H04N5/2254 , H05K3/305 , H05K2201/09036 , H05K2201/09045 , H05K2201/10121 , H05K2201/10151 , H05K2203/0165 , Y02P70/613 , Y10T29/53174
摘要： Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.
摘要翻译：本文公开了一种用于制造相机模块的装置，该装置包括：从下方夹持PCB的基座夹具; 接合头拾取图像传感器并将图像传感器附接到PCB上; 以及壳体接合工具，其拾取壳体组件并将壳体组件附接到PCB上，使得附接到PCB上的图像传感器被容纳在壳体组件中，其中，基部夹具以基部夹具为张力的结构构成，可沿垂直方向（Z轴方向）移动，使得当图像传感器被接合头拾取并附接到PCB上时，PCB的上表面是用于附接图像传感器和壳体组件的相同参考平面。

4. 发明授权

US12058443B2 Optical image stabilization actuator and camera module including the same 有权
公开(公告)号：US12058443B2
公开(公告)日：2024-08-06
申请号：US17988843
申请日：2022-11-17
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kyung Hun Lee , Gab Yong Kim , Sung Jae Lee
IPC分类号： H04N23/68 , H02K11/215 , H02K41/035 , H04N23/54 , G03B13/36
CPC分类号： H04N23/687 , H02K11/215 , H02K41/0354 , H04N23/54 , G03B13/36
摘要： An optical image stabilization actuator is provided. The optical image stabilization actuator includes a sensor substrate on which an image sensor having an imaging plane is disposed; a fixed frame configured to accommodate the sensor substrate; a movable frame accommodated in the fixed frame and configured to move in a direction parallel to the imaging plane; a first ball member disposed between the fixed frame and the movable frame and configured to support movement of the movable frame; and a first driver disposed on the movable frame and the fixed frame and configured to provide driving force to the movable frame, wherein the sensor substrate includes a movable portion coupled to the movable frame, a fixed portion coupled to the fixed frame, and a plurality of bridges configured to movably support the movable portion.

5. 发明授权

US09004132B2 Apparatus and method for manufacturing camera module 有权
标题翻译：相机模块制造装置及方法
公开(公告)号：US09004132B2
公开(公告)日：2015-04-14
申请号：US13801062
申请日：2013-03-13
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Sang Jin Kim , Byung Jae Kim , Sung Jae Lee , Seung Hee Cho
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/0469 , H05K13/0812 , Y10T156/10 , Y10T156/17
摘要： An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.
摘要翻译：一种用于制造相机模块的装置和方法。制造相机模块的方法包括：通过接合头拾取图像传感器并将图像传感器安装在PCB上; 当图像传感器安装在PCB上时，通过PCB支撑单元的陀螺仪单元同时补偿PCB和图像传感器之间的倾斜偏差; 通过接合头的加热单元施加热量以固化施加在图像传感器和PCB之间的粘合剂; 并且在安装了图像传感器并且粘合剂固化之后，通过透镜壳体模块拾取单元拾取透镜壳体模块并将透镜壳体模块安装在PCB上，并将PCB的接触部分附接到透镜壳体模块以完成制造相机模块。

6. 发明申请

US20130333843A1 APPARATUS FOR MANUFACTURING CAMERA MODULE 审中-公开
标题翻译：制造摄像机模块的装置
公开(公告)号：US20130333843A1
公开(公告)日：2013-12-19
申请号：US13826826
申请日：2013-03-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Byung Jae KIM , Sung Jae Lee , Sang Jin Kim , Hoon Taek Kang , Seung Hee Cho
IPC分类号： B29C65/80
CPC分类号： B29C65/80 , H04N5/2253 , H04N5/2254
摘要： Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a rim tool picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein a PCB holding unit is formed integrally with an image sensor pickup part of the rim tool outside the image sensor pickup part, the PCB holding unit being contacted with the PCB to hold the PCB when the image sensor is picked up by the image sensor pickup part and attached onto the PCB.
摘要翻译：本文公开了一种用于制造相机模块的装置，该装置包括：从下方夹持PCB的基座夹具; 拾取图像传感器并将图像传感器附接到PCB上的轮辋工具; 以及壳体接合工具，其拾取壳体组件并将壳体组件附接到PCB上，使得附接到PCB上的图像传感器被容纳在壳体组件中，其中PCB保持单元与图像传感器拾取部分边缘工具在图像传感器拾取部分外部，当图像传感器被图像传感器拾取部分拾取并附着到PCB上时，PCB保持单元与PCB接触以保持PCB。

7. 发明申请

US20130299081A1 APPARATUS AND METHOD FOR MANUFACTURING CAMERA MODULE 有权
标题翻译：制造摄像机模块的装置和方法
公开(公告)号：US20130299081A1
公开(公告)日：2013-11-14
申请号：US13801062
申请日：2013-03-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Jin KIM , Byung Jae Kim , Sung Jae Lee , Seung Hee Cho
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , H05K13/0469 , H05K13/0812 , Y10T156/10 , Y10T156/17
摘要： An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.
摘要翻译：一种用于制造相机模块的装置和方法。制造相机模块的方法包括：通过接合头拾取图像传感器并将图像传感器安装在PCB上; 当图像传感器安装在PCB上时，通过PCB支撑单元的陀螺仪单元同时补偿PCB和图像传感器之间的倾斜偏差; 通过接合头的加热单元施加热量以固化施加在图像传感器和PCB之间的粘合剂; 并且在安装了图像传感器并且粘合剂固化之后，通过透镜壳体模块拾取单元拾取透镜壳体模块并将透镜壳体模块安装在PCB上，并将PCB的接触部分附接到透镜壳体模块以完成制造相机模块。

8. 发明授权

US11225720B2 Magnetic powder, and manufacturing method thereof 有权
公开(公告)号：US11225720B2
公开(公告)日：2022-01-18
申请号：US16139696
申请日：2018-09-24
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Jae Lee , Jung Wook Seo , Hiroyuki Matsumoto , Chul Min Sim , Jong Sik Yoon , Jong Suk Jung
IPC分类号： H01F1/24 , H01F1/33 , B22F1/02 , C23D5/04 , C22C33/02
摘要： A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.

9. 发明授权

US10161049B2 Magnetic powder, and manufacturing method thereof 有权
公开(公告)号：US10161049B2
公开(公告)日：2018-12-25
申请号：US15072594
申请日：2016-03-17
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Jae Lee , Jung Wook Seo , Hiroyuki Matsumoto , Chul Min Sim , Jong Sik Yoon , Jong Suk Jung
IPC分类号： H01F1/24 , H01F1/33 , C23D5/04 , B22F1/02 , C22C33/02
摘要： A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.

10. 发明申请

US20140375413A1 METAL MAGNETIC POWDER AND METHOD FOR FORMING THE SAME, AND INDUCTOR MANUFACTURED USING THE METAL MAGNETIC POWDER 有权
标题翻译：金属磁粉及其制造方法以及使用金属磁粉制造的电感器
公开(公告)号：US20140375413A1
公开(公告)日：2014-12-25
申请号：US14048825
申请日：2013-10-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hak Kwan Kim , Sung Yong An , Sung Jae Lee , Jung Wook Seo
IPC分类号： H01F27/255 , H01F41/02 , H01F1/01
CPC分类号： H01F1/26 , H01F1/33 , H01F17/0033
摘要： Disclosed herein is a metal magnetic powder, and the metal magnetic powder according to the exemplary embodiment of the present invention includes a soft magnetic core particle and a multilayer coating film covering the core particle and having a multilayer structure, the multilayer coating film including an oxide film formed by heat treating the core particle and an insulation film formed by coating a coating particle with respect to the core particle.
摘要翻译：本发明公开了一种金属磁粉，根据本发明的示例性实施方式的金属磁性粉末包括软磁芯颗粒和覆盖芯颗粒并具有多层结构的多层涂膜，所述多层涂膜包含氧化物通过热处理芯颗粒形成的膜和通过相对于芯颗粒涂覆涂层颗粒而形成的绝缘膜。

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