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1. 发明申请

US20190006077A1 ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS 审中-公开
公开(公告)号：US20190006077A1
公开(公告)日：2019-01-03
申请号：US16102039
申请日：2018-08-13
申请人： Radial Electronics, Inc.
发明人： James E. Quilici
IPC分类号： H01F17/00 , H05K3/46 , H05K3/04 , H05K1/02 , H01F41/064 , H01F5/00 , H01F17/06 , H01F41/02 , H01F27/24 , H01F27/28 , H01F41/04 , H05K1/16 , H01F27/02 , H05K3/00
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/062 , H01F27/027 , H01F27/24 , H01F27/2804 , H01F27/2895 , H01F41/02 , H01F41/0206 , H01F41/041 , H01F41/042 , H01F41/064 , H01F2027/2809 , H01F2027/2814 , H05K1/0284 , H05K1/165 , H05K3/0014 , H05K3/045 , H05K3/4611 , H05K2201/086 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , Y10T29/4902 , Y10T29/49073 , Y10T29/49075 , Y10T156/10
摘要： Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.

2. 发明申请

US20180287275A1 RESIN MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180287275A1
公开(公告)日：2018-10-04
申请号：US16002004
申请日：2018-06-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Chu XU , Takahiro BABA
IPC分类号： H01R12/52 , H05K1/03 , H05K1/14 , H05K1/02 , H05K3/36
CPC分类号： H01R12/52 , H01R12/62 , H05K1/0271 , H05K1/0298 , H05K1/0313 , H05K1/113 , H05K1/144 , H05K3/363 , H05K3/368 , H05K2201/0129 , H05K2201/041 , H05K2201/052 , H05K2201/056 , H05K2201/09027 , H05K2201/09045 , H05K2201/09263 , H05K2201/09945 , H05K2201/10189 , H05K2201/1031 , H05K2201/10522
摘要： A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.

3. 发明授权

US10085353B2 Solder bridging prevention structures for circuit boards and semiconductor packages 有权
公开(公告)号：US10085353B2
公开(公告)日：2018-09-25
申请号：US14077642
申请日：2013-11-12
申请人： Infineon Technologies AG
发明人： Carlo Baterna Marbella , Fabian Schnoy
IPC分类号： H05K7/10 , H05K7/12 , H05K3/34 , H05K1/11
CPC分类号： H05K3/3452 , H05K1/111 , H05K3/3436 , H05K2201/09045 , H05K2201/09909 , H05K2201/10734
摘要： A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically conductive traces and pads disposed on the non-conductive substrate, and a solder mask applied to the non-conductive substrate and covering the traces. Metal lines are disposed on the non-conductive substrate under the solder mask and along at least two sides of the pads disposed in corners of the non-conductive substrate, so that a metal line is interposed between the pads in the corners of the non-conductive substrate and each adjacent pad. The metal lines form a raised region in the solder mask along the metal lines which prevents solder bridging in the corners of the non-conductive substrate during solder reflow. A corresponding semiconductor package and semiconductor assembly with such solder bridging prevention structures are also provided.

4. 发明申请

US20180035536A1 WIRING BOARD AND ELECTRONIC APPARATUS 审中-公开
公开(公告)号：US20180035536A1
公开(公告)日：2018-02-01
申请号：US15622412
申请日：2017-06-14
申请人： FUJITSU LIMITED
发明人： Takayoshi Matsumura , Shunji Baba , TAKASHI KANDA , NORITSUGU OZAKI , Hidehiko Kira
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0283 , H05K1/0271 , H05K1/092 , H05K1/181 , H05K1/189 , H05K3/245 , H05K2201/0314 , H05K2201/0338 , H05K2201/09045 , H05K2201/09281 , H05K2201/09727 , H05K2201/09736 , H05K2201/10015 , H05K2201/10098 , H05K2201/10522
摘要： A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics.

5. 发明授权

US09647322B2 Structural body and wireless communication apparatus 有权
公开(公告)号：US09647322B2
公开(公告)日：2017-05-09
申请号：US14433759
申请日：2014-01-16
申请人： SHARP KABUSHIKI KAISHA
发明人： Akihiro Iriyama
IPC分类号： H01Q1/24 , H05K1/02 , H05K1/16
CPC分类号： H01Q1/243 , H05K1/0296 , H05K1/165 , H05K2201/09045 , H05K2201/09263 , H05K2201/0999 , H05K2201/10098 , H05K2201/10265 , H05K2201/2072
摘要： A first resin layer is provided with a step part formed in conformity with a shape of at least part of an electrically conductive pattern, and the first resin layer and a second resin layer closely adhere to each other in the step part.

6. 发明申请

US20170072835A1 VEHICLE ACCESSORY CONTROL ARRANGEMENT 有权
标题翻译：车辆附件控制装置
公开(公告)号：US20170072835A1
公开(公告)日：2017-03-16
申请号：US15362703
申请日：2016-11-28
申请人： UUSI, LLC
发明人： David W. Shank , John M. Washeleski , Edward J. Cox, II
IPC分类号： B60Q1/00 , H05B33/08 , B60R16/02 , H05B37/02 , H05K1/14 , H05K7/14
CPC分类号： B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
摘要： An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
摘要翻译：车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。第一电路板各自具有支撑在基板上的多个电路元件的基板。第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。第二电路板各自具有支撑在它们上的多个电路元件的基板。第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。第二电路板基板包括与外边缘轮廓的多个第二偏差。第二偏差的至少一部分不同于第一电路板的第一偏差。

7. 发明授权

US09538589B2 Vehicle accessory control arrangement 有权
标题翻译：车辆附件控制装置
公开(公告)号：US09538589B2
公开(公告)日：2017-01-03
申请号：US14168036
申请日：2014-01-30
申请人： UUSI, LLC
发明人： David W. Shank , John M. Washeleski , Edward J. Cox, II
IPC分类号： B60Q1/14 , H05B33/08 , H05K1/02 , H05K1/14 , H05K1/11 , H05K1/16
CPC分类号： H05B33/0803 , H05B33/086 , H05K1/02 , H05K1/117 , H05K1/142 , H05K1/16 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10356
摘要： An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
摘要翻译：车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。第一电路板各自具有支撑在基板上的多个电路元件的基板。第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。第二电路板各自具有支撑在它们上的多个电路元件的基板。第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。第二电路板基板包括与外边缘轮廓的多个第二偏差。第二偏差的至少一部分不同于第一电路板的第一偏差。

8. 发明申请

US20160349884A1 CONDUCTIVE FILM, CONDUCTIVE FILM MANUFACTURING METHOD, AND TOUCH PANEL 审中-公开
标题翻译：导电膜，导电膜制造方法和触控面板
公开(公告)号：US20160349884A1
公开(公告)日：2016-12-01
申请号：US15234845
申请日：2016-08-11
申请人： FUJIFILM Corporation
发明人： Tasuku SATOU
IPC分类号： G06F3/044 , H05K3/00 , H05K3/04 , H05K1/09
CPC分类号： G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/092 , H05K3/0058 , H05K3/04 , H05K3/1258 , H05K2201/0769 , H05K2201/09045 , H05K2203/0139 , H05K2203/124
摘要： An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.
摘要翻译：本发明的目的是提供一种能够防止由离子迁移引起的操作误差的导电膜，并且适用于例如投射电容式触摸面板，导电膜的制造方法以及使用导电性的触摸面板电影。在导电膜中，在基板的表面层叠树脂层。在树脂层的表面形成网状槽部。在所述槽部中设置有细金属线，以形成电极图案。当表示电极图案的长度方向的离子迁移特性的值为ML，表示电极图案的横向的离子迁移特性的值为MS时，通过将两个值ML和MS中的较大值分割而获得的迁移率通过较小的值在1.0至1.4的范围内。

9. 发明申请

US20160220919A1 SELECTIVELY CONDUCTIVE TOY BUILDING ELEMENTS 有权
标题翻译：选择性导向玩具建筑元素
公开(公告)号：US20160220919A1
公开(公告)日：2016-08-04
申请号：US14917564
申请日：2014-09-03
申请人： BRIXO SMART TOYS LTD.
发明人： Boaz Almog , Amir Saraf
IPC分类号： A63H33/04 , A63H33/08
CPC分类号： A63H33/042 , A63H33/086 , H05K1/0284 , H05K1/119 , H05K3/326 , H05K2201/0367 , H05K2201/09045 , H05K2201/09081 , H05K2201/091 , H05K2201/0999 , H05K2201/209
摘要： The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.
摘要翻译：本发明涉及一种选择性导电的玩具构建元件，其包括：主体，其适于与至少一个其他玩具构建元件主体或相应的底板可释放地接合，所述主体包括至少一个导电部分，其具有适于以在相邻的玩具构建元件主体的导电部分或接触区域上产生压力，以便确保所述玩具构建元件之间在期望的位置和方向上的电传导。

10. 发明授权

US09407798B2 Electronic device having a flexible printed circuit biasing structure 有权
标题翻译：具有柔性印刷电路偏置结构的电子设备
公开(公告)号：US09407798B2
公开(公告)日：2016-08-02
申请号：US14028268
申请日：2013-09-16
申请人： Apple Inc.
发明人： David G. Havskjold , Emery A. Sanford
IPC分类号： H04N5/225 , H04M1/02 , H05K1/02 , G01J1/42 , H05K1/18
CPC分类号： H04N5/2253 , G01J1/4204 , H04M1/0264 , H04M1/0277 , H04M2250/12 , H05K1/028 , H05K1/189 , H05K2201/046 , H05K2201/055 , H05K2201/057 , H05K2201/09045
摘要： An electronic device may have electrical components such as input-output devices. An electrical component may be mounted on a flexible printed circuit. The flexible printed circuit may have a bend that forms a flexible printed circuit spring to bias the electrical component in a desired direction. The electronic device may have a display with a display cover layer. In an inactive display area, opaque masking material may be formed on the display cover layer. A light window may be formed in the opaque masking layer. The flexible printed circuit spring may bias the electrical component against the display cover layer in alignment with the light window. An air gap under the electrical component may separate the component from a planar portion of the flexible printed circuit that is overlapped by the electrical component. The electrical component may be a camera, a light sensor, or other device.
摘要翻译：电子设备可以具有诸如输入 - 输出设备的电气部件。电气部件可以安装在柔性印刷电路上。柔性印刷电路可以具有形成柔性印刷电路弹簧的弯曲部，以在期望的方向上偏置电气部件。电子设备可以具有带有显示器覆盖层的显示器。在非活动显示区域中，可以在显示器覆盖层上形成不透明掩模材料。可以在不透明掩模层中形成光窗。柔性印刷电路弹簧可以将电气部件偏置在与光窗口对准的显示器覆盖层上。电气部件下方的空气间隙可以将部件与由电气部件重叠的柔性印刷电路的平面部分分离。电气部件可以是相机，光传感器或其他装置。

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