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1. 发明申请

US20150000933A1 Method and Packages to Protect Electronics Components in a Subterranean Environment 审中-公开
标题翻译：在地下环境中保护电子元件的方法和封装
公开(公告)号：US20150000933A1
公开(公告)日：2015-01-01
申请号：US14366686
申请日：2012-12-21
申请人： Schlumberger Technology Corporation
发明人： Andrew J. Parry , Lahcen Garando , Francois Barbara , Jacques Sellin , Henri Denoix , Gregoire Jacob , Junchen Liu
IPC分类号： E21B47/01 , H05K5/06 , H05K7/02
CPC分类号： E21B47/011 , G01V1/52 , H05K5/069 , H05K7/02
摘要： Methods and packages for containing electronics components are described that use characteristic dimensions, so that the electronics components can remain electrically functional within the package subjected to harsh environments, such as a subterranean environment.
摘要翻译：描述了用于包含电子部件的方法和包装，其使用特征尺寸，使得电子部件可以在受到恶劣环境（例如地下环境）的包装内保持电功能。

2. 发明授权

US09379052B2 Multi chip modules for downhole equipment 有权
标题翻译：用于井下设备的多芯片模块
公开(公告)号：US09379052B2
公开(公告)日：2016-06-28
申请号：US13666868
申请日：2012-11-01
申请人： Schlumberger Technology Corporation
发明人： Francois Barbara , Lahcen Garando
IPC分类号： E21B4/04 , H01L23/498 , H01L23/15 , H01L23/00
CPC分类号： H01L23/498 , E21B4/04 , H01L23/15 , H01L24/45 , H01L2224/45124 , H01L2224/48227 , H01L2224/48744 , H01L2224/85444 , H01L2924/01327 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.
摘要翻译：用于井下模块的电子组件可以包括多层陶瓷组件和设置在多层陶瓷组件上的电子部件。多层陶瓷组件包括陶瓷衬底，设置在陶瓷衬底上的镀镍层和设置在镀镍层上的厚度小于约0.5微米的镀金层。诸如铝引线键的引线键在电子部件和镀金层之间延伸。

3. 发明申请

US20140185201A1 Electronic Device Sealing for A Downhole Tool 审中-公开
标题翻译：井下工具电子装置密封
公开(公告)号：US20140185201A1
公开(公告)日：2014-07-03
申请号：US14108297
申请日：2013-12-16
申请人： Schlumberger Technology Corporation
发明人： Francois Barbara , Vincent Martinez-Llorca
IPC分类号： H05K5/06 , H05K7/14
CPC分类号： H05K5/066 , E21B47/011 , H01L21/50 , H01L21/52 , H01L21/54 , H01L23/10 , H01L23/20 , H01L25/16 , H01L2924/0002 , H05K7/14 , H01L2924/00
摘要： Systems, methods, and devices that have a hermetic seal formed using reflow soldering are provided. The hermetic seal may protect electrical components within a packaging for use in downhole tools and/or other applications where the electrical components may be exposed to extreme environments. In one example, an electronic device includes a ceramic substrate having a plated ring. The electronic device also includes a metal lid. A high-temperature solder is disposed between the plated ring of the ceramic substrate and the metal lid. The electronic device includes a hermetically sealed cavity formed between the ceramic substrate and the metal lid. The hermetically sealed cavity is formed via a first bond between the plated ring of the ceramic substrate and the high-temperature solder, and via a second bond between the metal lid and the high-temperature solder. Moreover, the first and second bonds are formed using reflow soldering.
摘要翻译：提供了使用回流焊接形成气密密封的系统，方法和装置。气密密封件可以保护包装内的电气部件以用于井下工具和/或电气部件可能暴露于极端环境的其它应用。在一个示例中，电子设备包括具有电镀环的陶瓷基板。电子设备还包括金属盖。在陶瓷基板的镀覆环和金属盖之间设置高温焊料。电子设备包括形成在陶瓷基板和金属盖之间的气密密封腔。通过陶瓷基板的镀覆环和高温焊料之间的第一接合，以及金属盖和高温焊料之间的第二接合形成气密密封腔。此外，第一和第二键通过回流焊接形成。

4. 发明申请

US20130105140A1 Multi Chip Modules for Downhole Equipment 有权
标题翻译：井下设备多芯片模块
公开(公告)号：US20130105140A1
公开(公告)日：2013-05-02
申请号：US13666868
申请日：2012-11-01
申请人： Schlumberger Technology Corporation
发明人： Francois Barbara , Lahcen Garando
IPC分类号： E21B41/00 , B23K31/02
CPC分类号： H01L23/498 , E21B4/04 , H01L23/15 , H01L24/45 , H01L2224/45124 , H01L2224/48227 , H01L2224/48744 , H01L2224/85444 , H01L2924/01327 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.
摘要翻译：用于井下模块的电子组件可以包括多层陶瓷组件和设置在多层陶瓷组件上的电子部件。多层陶瓷组件包括陶瓷衬底，设置在陶瓷衬底上的镀镍层和设置在镀镍层上的厚度小于约0.5微米的镀金层。诸如铝引线键的引线键在电子部件和镀金层之间延伸。

5. 发明申请

US20130087903A1 Electronics Packaging For High Temperature Downhole Applications 审中-公开
标题翻译：电子封装用于高温井下应用
公开(公告)号：US20130087903A1
公开(公告)日：2013-04-11
申请号：US13627935
申请日：2012-09-26
申请人： SCHLUMBERGER TECHNOLOGY CORPORATION
发明人： Mohamed Salim Cherchali , Bernard Parmentier , Sandrine J. Lelong-Feneyrou , Vincent Martinez-Llorca , Francois Barbara
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L25/165 , E21B47/011 , E21B47/16 , H01L23/055 , H01L2924/0002 , H01L2924/00
摘要： A downhole tool is described. The downhole tool includes a work device and an electronics packaging connected to the work device. The electronics packaging comprises a housing, a substrate, at least one first type component, and at least one second type component. The housing defines a void. The substrate is positioned within the void of the housing and forms a first cavity and a second cavity relative to the housing. The first cavity and the second cavity are isolated to form separate atmospheric chambers. The at least one first type component is disposed in the first cavity and connected to the substrate. The at least one second type component is disposed in the second cavity and connected to the substrate. The at least one first type component is different from the at least one second type component.
摘要翻译：描述井下工具。井下工具包括连接到工作装置的工作装置和电子装置。电子封装包括壳体，基板，至少一个第一类型部件和至少一个第二类型部件。外壳定义了一个空白。衬底被定位在壳体的空隙内并相对于壳体形成第一空腔和第二空腔。第一腔和第二腔被隔离以形成分开的大气室。所述至少一个第一类型部件设置在所述第一腔体中并且连接到所述基板。所述至少一个第二类型部件设置在所述第二腔中并连接到所述基底。所述至少一个第一类型组件与所述至少一个第二类型组件不同。

6. 发明授权

US11532526B2 Double-sided hermetic multichip module 有权
公开(公告)号：US11532526B2
公开(公告)日：2022-12-20
申请号：US16075359
申请日：2017-02-03
申请人： SCHLUMBERGER TECHNOLOGY CORPORATION
发明人： Cleverson Souza Chaves , Francois Barbara
IPC分类号： H01L23/13 , H01L23/04 , H01L23/10 , H01L23/28 , H01L23/60
摘要： A packaged electronic module for downhole applications, in particular in a petrochemical well or similar environment. The electronic module includes one or more electronic components located on each side of a substrate, where the one or more electronic components are attached to the substrate by means of glue.

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