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1. 发明申请

US20150047709A1 TITANIUM OXIDE PASTE 审中-公开
标题翻译：氧化钛粉
公开(公告)号：US20150047709A1
公开(公告)日：2015-02-19
申请号：US14387964
申请日：2013-03-26
申请人： Sekisui Chemical Co., Ltd.
发明人： Taku Sasaki , Mayumi Horiki , Satoshi Haneda
IPC分类号： H01G9/20 , C09D5/24
CPC分类号： H01G9/2031 , C01P2006/22 , C09C1/3676 , C09D5/24 , H01G9/2059 , Y02E10/542 , Y02P70/521
摘要： The present invention aims to provide a titanium oxide paste which is excellent in printability and which allows for production of a porous titanium oxide layer having a high porosity with a small amount of impurities on the surface thereof even by low-temperature firing, a method of producing a porous titanium oxide laminate using the titanium oxide paste, and a dye-sensitized solar cell.The titanium oxide paste of the present invention contains titanium oxide particles, a (meth)acrylic resin, and an organic solvent. The paste has a viscosity of 15 to 50 Pa·s and a thixotropic ratio of 2 or greater. A dried mass obtained by heating the paste at a temperature-increasing rate of 10° C./min from 25° C. to 300° C. in the atmospheric environment contains 1% by weight or less of the (meth)acrylic resin and the organic solvent.
摘要翻译：本发明的目的在于提供一种印刷性优异的氧化钛糊料，即使通过低温烧制也能够在其表面上生产具有高孔隙率的多孔氧化钛层，其表面上含有少量的杂质，使用该氧化钛糊制造多孔氧化钛层压体，以及染料敏化太阳能电池。本发明的氧化钛糊包含氧化钛粒子，（甲基）丙烯酸树脂和有机溶剂。糊剂的粘度为15〜50Pa·s，触变比为2以上。在大气环境中以10℃/分钟的升温速度从25℃加热至300℃而得到的干燥物料含有1重量％以下的（甲基）丙烯酸树脂，有机溶剂。

2. 发明授权

US11020825B2 Connecting material and connection structure 有权
公开(公告)号：US11020825B2
公开(公告)日：2021-06-01
申请号：US15767804
申请日：2016-11-18
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Mai Yamagami , Satoshi Haneda , Takeshi Wakiya , Yasuyuki Yamada , Saori Ueda , Masao Sasadaira
IPC分类号： B23K35/36 , B23K35/02 , B23K35/30 , C08F216/06 , C08F212/36 , C08F36/20 , C09J9/02 , B23K35/34 , B22F7/08 , C08F30/08 , C08J3/12 , C08F16/32 , C08F36/08 , H01B1/22 , H01R11/01 , C09J11/00 , C09J201/00 , H01B5/00 , B23K35/26 , B22F1/00 , B22F1/02 , B22F7/06 , C08K3/08 , B23K35/24 , C08K7/00
摘要： A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

3. 发明授权

US11017916B2 Particles, connecting material and connection structure 有权
公开(公告)号：US11017916B2
公开(公告)日：2021-05-25
申请号：US15767803
申请日：2016-11-18
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Mai Yamagami , Satoshi Haneda , Takeshi Wakiya , Yasuyuki Yamada , Saori Ueda , Masao Sasadaira
IPC分类号： B23K35/36 , B23K35/02 , B23K35/30 , C08F216/06 , C08F212/36 , C08F36/20 , C09J9/02 , H01B1/22 , B22F7/08 , C08F30/08 , C08F36/08 , H01R11/01 , C08F16/32 , H01B5/00 , C09J201/00 , B23K35/26 , B22F7/06 , B22F1/02 , B23K35/24 , C08F12/36 , C09J11/08 , C08F16/20 , C08G61/02 , H01L23/00 , B22F1/00
摘要： Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

4. 发明授权

US11024439B2 Particles, connecting material and connection structure 有权
公开(公告)号：US11024439B2
公开(公告)日：2021-06-01
申请号：US15767833
申请日：2016-11-18
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Mai Yamagami , Satoshi Haneda , Takeshi Wakiya , Yasuyuki Yamada , Saori Ueda , Masao Sasadaira
IPC分类号： B23K35/36 , B23K35/02 , B23K35/30 , C08F216/06 , C08F212/36 , C08F36/20 , C09J9/02 , H01B1/22 , B22F7/08 , C08F30/08 , C08F36/08 , H01R11/01 , C08F16/32 , H01B5/00 , C09J201/00 , B23K35/26 , B22F7/06 , B22F1/02 , B23K35/24 , C08F12/36 , C09J11/08 , C08F16/20 , C08G61/02 , H01L23/00 , B22F1/00
摘要： Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

5. 发明授权

US11027374B2 Particles, connecting material and connection structure 有权
公开(公告)号：US11027374B2
公开(公告)日：2021-06-08
申请号：US15767820
申请日：2016-11-18
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Mai Yamagami , Satoshi Haneda , Takeshi Wakiya , Yasuyuki Yamada , Saori Ueda , Masao Sasadaira
IPC分类号： B23K35/36 , B23K35/02 , B23K35/30 , C08F216/06 , C08F212/36 , C08F36/20 , C09J9/02 , C08F30/08 , H01B5/00 , C08J3/12 , H01R11/01 , B22F7/08 , C08F16/32 , C09J201/00 , C08F12/36 , C08F36/08 , B22F1/02 , B22F7/06 , B22F1/00 , B23K101/40
摘要： Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

6. 发明授权

US09493625B2 Thermally expanding microcapsules 有权
标题翻译：热膨胀微胶囊
公开(公告)号：US09493625B2
公开(公告)日：2016-11-15
申请号：US14764755
申请日：2014-09-22
申请人： SEKISUI CHEMICAL CO., LTD. , TOKUYAMA SEKISUI CO., LTD.
发明人： Hiroshi Yamauchi , Hiroyuki Morita , Satoshi Haneda , Yasuko Wada
IPC分类号： C08J9/16 , C08J9/32 , B01J13/14
CPC分类号： C08J9/16 , B01J13/14 , C08J9/32 , C08J2201/024 , C08J2203/22 , C08J2300/22 , C08J2300/26 , C08J2333/14
摘要： The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.
摘要翻译：本发明提供一种在高温下具有高膨胀率和耐久性的热膨胀性微胶囊，并且当用于发泡成型时不易引起变色和气味。本发明的热膨胀性微胶囊包括：由聚合物形成的壳; 以及由外壳包封的作为核心试剂的挥发性膨胀剂，通过聚合含有腈单体的单体组合物和分子中具有缩水甘油基的化合物而获得的壳，所述壳的y值为50％以上，比例y / x为1.1以上，其中x表示常温下的凝胶分数，y表示在180℃加热30分钟时的凝胶分数。

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