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1. 发明授权

US10204946B1 Image sensors with color filter variations 有权
公开(公告)号：US10204946B1
公开(公告)日：2019-02-12
申请号：US15676664
申请日：2017-08-14
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Ulrich Boettiger , Swarnal Borthakur
IPC分类号： H01L31/0232 , H01L27/146
摘要： Color filters may affect imaging performance attributes such as low light sensitivity, color accuracy, and modulation transfer function (MTF). In an image pixel array, these factors are influenced by both the spectral absorption and pattern of the color filter elements. Different portions of an image sensor may prioritize different imaging performance attributes. Accordingly, in certain applications it may be beneficial for color filter characteristics to vary across an image sensor. Different color filters of the same color may have different structures to optimize imaging performance across the image sensor.

2. 发明授权

US10165211B1 Image sensors with optically black pixels 有权
公开(公告)号：US10165211B1
公开(公告)日：2018-12-25
申请号：US15683201
申请日：2017-08-22
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur , Loriston Ford , Bartosz Piotr Banachowicz
IPC分类号： H04N5/369 , H04N5/361 , H04N5/378 , H01L27/146
摘要： An image sensor may include optically black pixels for obtaining dark current measurements. The image sensor may include dummy pixels between the active pixel array and the optically black pixels. Light incident upon the dummy pixels may be redirected to the optically black pixels, causing inaccurate dark current measurements. Light-blocking structures may be provided in the dummy pixels to prevent light from reaching the optically black pixels. A grid of openings may be formed in the active pixel array and the dummy pixel area. The grid may be filled with color filters in the active area and light-blocking elements in the dummy pixel area. The dummy pixel area may include a single opening in the grid in which a single light-blocking element that covers multiple dummy pixel photodiodes is formed. Light-blocking structures in the dummy pixel area may extend over the optically black pixels.

3. 发明授权

US09893115B2 Image sensor chip scale packages and related methods 有权
公开(公告)号：US09893115B2
公开(公告)日：2018-02-13
申请号：US15621041
申请日：2017-06-13
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur
IPC分类号： H01L27/146 , H01L23/31 , H01L23/00 , H01L21/66
CPC分类号： H01L27/14685 , H01L22/32 , H01L23/3171 , H01L24/04 , H01L27/14634 , H01L27/14689
摘要： Methods of forming an image sensor chip scale package. Implementations may include providing a semiconductor wafer having a pixel array, forming a first cavity through the wafer and/or one or more layers coupled over the wafer, filling the first cavity with a fill material, planarizing the fill material and/or the one or more layers to form a first surface of the fill material coplanar with a first surface of the one or more layers, and bonding a transparent cover over the fill material and the one or more layers. The bond may be a fusion bond between the transparent cover and a passivation oxide; a fusion bond between the transparent cover and an anti-reflective coating; a bond between the transparent cover and an organic adhesive coupled over the fill material, and/or; a bond between a first metallized surface of the transparent cover and a metallized layer coupled over the wafer.

4. 发明授权

US09847359B2 Image sensors with improved surface planarity 有权
公开(公告)号：US09847359B2
公开(公告)日：2017-12-19
申请号：US15139505
申请日：2016-04-27
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Aaron Belsher , Richard Mauritzson , Swarnal Borthakur , Ulrich Boettiger
IPC分类号： H01L27/146
CPC分类号： H01L27/14603 , H01L27/14632 , H01L27/14636 , H01L27/1464 , H01L27/14643 , H01L27/14689
摘要： A backside illuminated image sensor with an array of pixels formed in a substrate is provided. To improve surface planarity, bond pads formed at the periphery of the array of pixels may be recessed into a back surface of the substrate. The bond pads may be recessed into a semiconductor layer of the substrate, may be recessed into a window in the semiconductor layer, or may be recessed in a passivation layer and covered with non-conductive material such as resin. In order to further improve surface planarity, a window may be formed in the semiconductor layer at the periphery of the array of pixels, or scribe region, over alignment structures. By providing an image sensor with improved surface planarity, device yield and time-to-market may be improved, and window framing defects and microlens/color filter non-uniformity may be reduced.

5. 发明授权

US09818776B2 Integrating bond pad structures with light shielding structures on an image sensor 有权
公开(公告)号：US09818776B2
公开(公告)日：2017-11-14
申请号：US14681940
申请日：2015-04-08
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur , Marc Sulfridge
IPC分类号： H01L31/0232 , H01L31/0216 , H01L31/18 , H01L31/02 , H01L27/14 , H01L21/30 , H01L21/768 , H01L31/14 , H01L27/144 , H01L27/146
CPC分类号： H01L27/1446 , H01L27/14607 , H01L27/14621 , H01L27/14623 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14689
摘要： An imaging system may include an image sensor that may be a backside illuminated (BSI) image sensor. The BSI sensor may be bonded to an inactive silicon substrate or bonded to an active silicon substrate like a digital signal processor (DSP). Through-oxide vias (TOVs) may be formed in the image sensor die. A bond pad region may be formed on a light shielding layer to facilitate coupling the light shield to a ground source or other power sources. Color filter housing structures may be formed over active image sensor pixels on the image sensor die. In-pixel grid structures may be integrated with the color filter housing structures to help reduce crosstalk. The light shielding layer may also be formed over reference image sensor pixels on the image sensor die. The TOVs, the in-pixel grid structures, and the light shielding structures may be formed simultaneously.

6. 发明授权

US09515111B2 Circuitry for biasing light shielding structures and deep trench isolation structures 有权
标题翻译：用于偏置遮光结构和深沟槽隔离结构的电路
公开(公告)号：US09515111B2
公开(公告)日：2016-12-06
申请号：US14518862
申请日：2014-10-20
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur , Marc Sulfridge
IPC分类号： H01L27/146 , H04N5/335 , H04N5/369 , H04N5/235 , H04N5/238
CPC分类号： H01L27/14623 , H01L27/1462 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14687 , H04N5/2354 , H04N5/238 , H04N5/335 , H04N5/3698
摘要： An imaging system may include an image sensor die stacked on top of a digital signal processor (DSP) die. Through-oxide vias (TOVs) may be formed in the image sensor die and may extend at least partially into in the DSP die to facilitate communications between the image sensor die and the DSP die. The image sensor die may include light shielding structures for preventing reference photodiodes in the image sensor die from receiving light and in-pixel grid structures for preventing cross-talk between adjacent pixels. The light shielding structure may receive a desired biasing voltage through a corresponding TOV, an integral plug structure, and/or a connection that makes contact directly with a polysilicon gate. The in-pixel grid may have a peripheral contact that receives the desired biasing voltage through a light shield, a conductive strap, a TOV, and/or an aluminum pad.
摘要翻译：成像系统可以包括堆叠在数字信号处理器（DSP）管芯的顶部上的图像传感器管芯。可以在图像传感器管芯中形成贯通氧化物通孔（TOV），并且可以至少部分地延伸到DSP管芯中以促进图像传感器管芯和DSP管芯之间的通信。图像传感器管芯可以包括用于防止图像传感器管芯中的参考光电二极管接收光和像素间栅格结构以防止相邻像素之间的串扰的遮光结构。光屏蔽结构可以通过相应的TOV，整体插塞结构和/或直接与多晶硅栅极接触的连接来接收期望的偏置电压。像素内栅格可以具有通过光屏蔽，导电带，TOV和/或铝垫接收期望的偏置电压的外围接触。

7. 发明授权

US09497366B1 Imaging systems with integrated light shield structures 有权
标题翻译：具有集成光屏蔽结构的成像系统
公开(公告)号：US09497366B1
公开(公告)日：2016-11-15
申请号：US14723147
申请日：2015-05-27
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Ulrich Boettiger , Andrew Perkins , Marc Sulfridge , Swarnal Borthakur
IPC分类号： H04N5/225 , H04N9/04 , H01L27/146
CPC分类号： H01L27/14623 , H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H04N5/2254 , H04N9/045
摘要： An imaging system may include an image sensor having an array of pixels. The image sensor may include an array of microlenses formed over a substrate and an array of color filter elements interposed between the microlenses and the substrate. Dielectric wall structures may be interposed between the color filter elements. Light shield structures may be formed within or on the dielectric wall structures and may be used to reduce optical crosstalk between adjacent pixels. The light shield structures may be formed on opposing sides or corners of the color filter elements and may partially or fully extend along the height of the color filter elements. In some arrangements, the light shield structures may each have a vertical portion that contacts a side surface of an adjacent color filter element and a horizontal portion that contacts a lower surface of an adjacent color filter element.
摘要翻译：成像系统可以包括具有像素阵列的图像传感器。图像传感器可以包括形成在衬底上的微透镜阵列和插入在微透镜和衬底之间的滤色器元件的阵列。电介质壁结构可以插在滤色器元件之间。光屏蔽结构可以形成在电介质壁结构内或上，并且可以用于减少相邻像素之间的光学串扰。遮光结构可以形成在滤色器元件的相对侧或角上，并且可以沿着滤色器元件的高度部分或全部地延伸。在一些布置中，遮光结构可以各自具有接触相邻滤色器元件的侧表面的垂直部分和接触相邻滤色器元件的下表面的水平部分。

8. 发明授权

US09456132B2 Image sensor system for detection and information processing based on user preferences 有权
标题翻译：基于用户偏好的图像传感器系统，用于检测和信息处理
公开(公告)号：US09456132B2
公开(公告)日：2016-09-27
申请号：US14577759
申请日：2014-12-19
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur , Ulrich Boettiger
IPC分类号： H04N5/232 , G06K9/46
CPC分类号： H04N5/23229 , G06K9/00825 , G06K9/46 , H04N5/23293 , H04N5/335 , H04N9/045
摘要： A system may include an image sensor having a pixel array that receives light in an environment. The light received at the pixel array may be transmitted by an external device that encodes information using the wavelength, spatial patterning, temporal patterning, or other characteristics of the light. In response to receiving the light, the pixel array may generate electrical signals that are processed to decode the information in the light. The system may compare the decoded information to user preferences to determine if the information is relevant to a user. In response to determining that the information is relevant to the user, the system may display the information to the user, transmit a pulse including user preference information, or change an operating state of the image sensor.
摘要翻译：系统可以包括具有在环境中接收光的像素阵列的图像传感器。在像素阵列处接收的光可以通过使用波长，空间图案，时间图案化或光的其它特征对信息进行编码的外部设备进行传输。响应于接收到光，像素阵列可以产生被处理以解码光中的信息的电信号。系统可以将解码的信息与用户偏好进行比较，以确定信息是否与用户相关。响应于确定信息与用户相关，系统可以向用户显示信息，发送包括用户偏好信息的脉冲或改变图像传感器的操作状态。

9. 发明申请

US20160182820A1 IMAGE SENSOR SYSTEM FOR DETECTION AND INFORMATION PROCESSING 有权
标题翻译：用于检测和信息处理的图像传感器系统
公开(公告)号：US20160182820A1
公开(公告)日：2016-06-23
申请号：US14577759
申请日：2014-12-19
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Swarnal Borthakur , Ulrich Boettiger
IPC分类号： H04N5/232 , G06K9/46
CPC分类号： H04N5/23229 , G06K9/00825 , G06K9/46 , H04N5/23293 , H04N5/335 , H04N9/045
摘要： A system may include an image sensor having a pixel array that receives light in an environment. The light received at the pixel array may be transmitted by an external device that encodes information using the wavelength, spatial patterning, temporal patterning, or other characteristics of the light. In response to receiving the light, the pixel array may generate electrical signals that are processed to decode the information in the light. The system may compare the decoded information to user preferences to determine if the information is relevant to a user. In response to determining that the information is relevant to the user, the system may display the information to the user, transmit a pulse including user preference information, or change an operating state of the image sensor.
摘要翻译：系统可以包括具有在环境中接收光的像素阵列的图像传感器。在像素阵列处接收的光可以通过使用波长，空间图案，时间图案化或光的其它特征对信息进行编码的外部设备进行传输。响应于接收到光，像素阵列可以产生被处理以解码光中的信息的电信号。系统可以将解码的信息与用户偏好进行比较，以确定信息是否与用户相关。响应于确定信息与用户相关，系统可以向用户显示信息，发送包括用户偏好信息的脉冲或改变图像传感器的操作状态。

10. 发明授权

US09215361B2 Array cameras with light barriers 有权
标题翻译：带光栅的阵列相机
公开(公告)号：US09215361B2
公开(公告)日：2015-12-15
申请号：US14464630
申请日：2014-08-20
申请人： Semiconductor Components Industries, LLC
发明人： Swarnal Borthakur , Scott Churchwell , Rick Lake , Nathan Lee
IPC分类号： H04N5/225 , H04N5/228
CPC分类号： H04N5/2258 , H04N5/2257
摘要： An imaging system such as an array camera may include an array of image sensors. The image sensors may each include an array of image pixels formed in a common image sensor substrate. A protective glass cover layer may be provided over the array of image sensors. The cover layer may be attached to the image sensor substrate using an adhesive. The adhesive may be formed on the image sensor substrate in a grid-like pattern in between adjacent image sensors in the array. A light blocking material may be formed on the adhesive grid to minimize optical crosstalk between neighboring image sensors. The light blocking material may fill or partially fill a trench in the adhesive, may coat the outer surfaces of the adhesive, and/or may coat the inner surfaces of the adhesive. If desired, light barriers may also be formed in openings in the glass cover layer.
摘要翻译：诸如阵列照相机的成像系统可以包括图像传感器阵列。图像传感器可以各自包括形成在公共图像传感器基板中的图像像素的阵列。可以在图像传感器阵列上方提供保护性玻璃覆盖层。覆盖层可以使用粘合剂附着到图像传感器基底。可以在图像传感器基板上以阵列中的相邻图像传感器之间的网格状图案形成粘合剂。可以在粘合剂网格上形成遮光材料以最小化相邻图像传感器之间的光学串扰。遮光材料可以填充或部分填充粘合剂中的沟槽，可以涂覆粘合剂的外表面和/或可以涂覆粘合剂的内表面。如果需要，也可以在玻璃覆盖层的开口中形成光栅。

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