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1. 发明授权

US10395810B2 Inductor 有权
公开(公告)号：US10395810B2
公开(公告)日：2019-08-27
申请号：US14885057
申请日：2015-10-16
申请人： Shinko Electric Industries Co., Ltd.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Kiyokazu Sato , Yasuyoshi Horikawa
IPC分类号： H01F5/00 , H01F27/28 , H01F17/00
摘要： An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.

2. 发明授权

US09396874B2 Method of manufacturing coil substrate and inductor 有权
标题翻译：制造线圈基板和电感器的方法
公开(公告)号：US09396874B2
公开(公告)日：2016-07-19
申请号：US14488400
申请日：2014-09-17
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Yoichi Sasada
IPC分类号： H01F41/04 , H01F27/30 , H01F27/28 , H01F27/32
CPC分类号： H01F17/0013 , H01F5/00 , H01F17/04 , H01F27/2804 , H01F27/323 , H01F41/04 , H01F41/041 , H01F41/042 , H01F41/043 , H01F41/045 , H01F2017/048 , H01F2027/2809 , Y10T29/4902 , Y10T29/49069 , Y10T29/49071 , Y10T29/49073 , Y10T156/10
摘要： A method of manufacturing a coil substrate, includes forming a plurality of structures, each of the structures including a first insulating layer and a metal layer formed on the first insulating layer; forming a stacked structure by stacking the structures while connecting the metal layers of the adjacent structures in series; and shaping the stacked structure such that the metal layers of the structures are shaped at the same time to be in shapes of wirings, each becomes a part of a spiral-shaped coil, to form the spiral-shaped coil in which the wirings of the adjacent structures are connected in series.
摘要翻译：一种制造线圈基板的方法，包括形成多个结构，每个结构包括形成在第一绝缘层上的第一绝缘层和金属层; 通过在连接相邻结构的金属层的同时堆叠结构来形成堆叠结构; 并且使堆叠结构成形，使得结构的金属层同时成形为布线的形状，每个都成为螺旋形线圈的一部分，以形成螺旋形线圈，其中，相邻结构串联连接。

3. 发明授权

US09615461B2 Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module 有权
公开(公告)号：US09615461B2
公开(公告)日：2017-04-04
申请号：US15161579
申请日：2016-05-23
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H05K7/00 , H05K1/18 , H05K1/11 , H05K3/42 , H01L23/31 , H01L23/495 , H01L23/00 , H01L33/54 , H01L33/62 , H05K1/02 , H05K1/03 , H05K1/09 , H01L33/48 , H05K1/05
CPC分类号： H05K1/181 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L33/48 , H01L33/54 , H01L33/62 , H01L2224/13 , H01L2224/48091 , H01L2224/48245 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K1/0296 , H05K1/0313 , H05K1/056 , H05K1/09 , H05K1/112 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/42 , H05K3/427 , H05K2201/10106 , H05K2203/1545 , Y10T29/49165 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

4. 发明授权

US09595384B2 Coil substrate, method for manufacturing coil substrate, and inductor 有权
标题翻译：线圈基板，线圈基板的制造方法以及电感器
公开(公告)号：US09595384B2
公开(公告)日：2017-03-14
申请号：US14338483
申请日：2014-07-23
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Yoichi Sasada
IPC分类号： H01F5/00 , H01F41/04 , H01F17/00
CPC分类号： H01F41/046 , H01F5/00 , H01F17/0013 , H01F2017/0066 , Y10T29/49071
摘要： A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.
摘要翻译：线圈基板包括基板，设置在基板的一个表面上的线圈状布线，线圈状布线包括彼此相邻设置的相邻部分，以及形成在线圈状布线的相邻部分之间的绝缘层。线圈状布线包括第一布线和层叠在第一布线上并具有大于第一布线的厚度的厚度的第二布线。在第一布线的侧面和绝缘层之间设置有空间。第二个接线填充空间并覆盖第一个接线。第二配线的两侧表面与绝缘层接触。

5. 发明申请

US20160343499A1 Inductor 审中-公开
标题翻译：电感器
公开(公告)号：US20160343499A1
公开(公告)日：2016-11-24
申请号：US14885057
申请日：2015-10-16
申请人： Shinko Electric Industries Co., Ltd.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Kiyokazu Sato , Yasuyoshi HORIKAWA
IPC分类号： H01F27/28 , H01F27/00
CPC分类号： H01F17/0033 , H01F17/0013
摘要： An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.
摘要翻译：电感器包括具有堆叠的多个结构体的层叠体。多个结构体中的每一个包括布线和形成在布线上的绝缘层。多个结构体的布线串联连接以形成螺旋线圈。所述电感器还包括沿所述层叠体的厚度方向延伸穿过所述层叠体的通孔，以及多个分离的绝缘膜，所述绝缘膜彼此间隔开并且覆盖所述多个结构体的电线的表面从堆叠体的表面露出。

6. 发明授权

US09472332B2 Coil substrate, method of manufacturing the same, and inductor 有权
标题翻译：线圈基板，其制造方法和电感器
公开(公告)号：US09472332B2
公开(公告)日：2016-10-18
申请号：US14341868
申请日：2014-07-28
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Kiyokazu Sato
IPC分类号： H01F5/00 , H01F17/00
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/0013 , Y10T29/4902
摘要： A coil substrate includes a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring. The plurality of structural bodies are stacked via an adhesion layer. The spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies.
摘要翻译：线圈基板包括多个结构体，每个结构体包括第一绝缘层，形成在第一绝缘层上并被配置为用作螺旋线圈的一部分的布线，以及形成在第一绝缘层上的第二绝缘层并配置为覆盖布线。多个结构体通过粘合层堆叠。螺旋线圈通过串联连接多个结构体中的相邻结构体的布线而形成。

7. 发明授权

US09406432B2 Inductor and coil substrate 有权
标题翻译：电感和线圈基片
公开(公告)号：US09406432B2
公开(公告)日：2016-08-02
申请号：US14706164
申请日：2015-05-07
申请人： Shinko Electric Industries, Co., Ltd.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Kiyokazu Sato
IPC分类号： H01F5/00 , H01F27/02 , H01F27/28 , H01F27/32 , H01F17/00 , H01F41/04
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0013 , H01F17/0033 , H01F27/022 , H01F27/24 , H01F27/323 , H01F41/046 , H01F2017/002 , H01F2027/2809
摘要： An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.
摘要翻译：电感器包括具有第一通孔的层叠体和覆盖层叠体的绝缘膜。层叠体包括：第一布线，堆叠在第一布线上的第一绝缘层，并且具有暴露第一布线的第二通孔;堆叠在第一绝缘层上的第一粘合层，并且包括与第二通孔连通的第三通孔第二布线层叠在第一粘合剂层上并且包括与第三通孔连通的第四通孔，层叠在第二布线上并具有与第四通孔连通的第五通孔的第二绝缘层，以及第一通孔用第二至第五通孔填充。第一和第二布线连接形成螺旋线圈。第五通孔具有比第四通孔更大的平面形状。

8. 发明授权

US09224933B2 Light emitting device package and package for mounting light emitting device 有权
标题翻译：用于安装发光装置的发光装置封装和封装
公开(公告)号：US09224933B2
公开(公告)日：2015-12-29
申请号：US14333602
申请日：2014-07-17
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Tsukasa Nakanishi , Atsushi Nakamura , Takayuki Matsumoto
IPC分类号： H01L29/22 , H01L33/62 , H01L33/48 , H01L33/60 , H01L25/16
CPC分类号： H01L33/62 , H01L25/167 , H01L33/486 , H01L33/60 , H01L2224/16225 , H01L2924/15311
摘要： A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each other in a plan view, first and second through-wirings that penetrate the substrate and are provided on the two areas, respectively, each of the first and second through-wirings including one end electrically connected to the light emitting device mounting part and another end exposed from another surface of the substrate. A part of each of the first and second through-wirings includes a maximum part having a plan-view shape that is larger than a plan-view shape of the one end of each of the first and second through-wirings.
摘要翻译：一种用于在其上安装发光器件的封装。封装包括基板，发光器件安装部分，其包括形成在基板的一个表面上的布线，布线包括彼此面对布置并且在平面图中彼此间隔开预定间隔的两个区域，第一以及分别穿过所述基板并设置在所述两个区域上的第二贯通布线，所述第一和第二贯通布线中的每一个包括电连接到所述发光器件安装部分的一端和从所述基板的另一表面暴露的另一端。第一和第二贯通布线中的每一个的一部分包括具有大于第一和第二贯通布线中的每一个的一端的平面视图形状的平面视图形状的最大部分。

9. 发明授权

US09166132B2 Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package 有权
标题翻译：具有散热路径的发光元件安装封装，其制造方法和发光元件封装
公开(公告)号：US09166132B2
公开(公告)日：2015-10-20
申请号：US13795253
申请日：2013-03-12
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H01L33/48 , H01L33/64 , H01L33/62 , H05K1/02 , H05K1/11
CPC分类号： H01L33/64 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H05K1/0206 , H05K1/113
摘要： A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.
摘要翻译：一种发光元件安装封装，包括：形成第一发光元件安装部的第一布线，其设置在基板的一个表面上以安装发光元件;以及第一布线，其一端和另一端，所述一端电连接到所述第一发光元件安装部，从而可热转印，另一端从所述基板的另一表面突出。

10. 发明授权

US09147518B1 Inductor and coil substrate 有权
标题翻译：电感和线圈基片
公开(公告)号：US09147518B1
公开(公告)日：2015-09-29
申请号：US14661535
申请日：2015-03-18
申请人： Shinko Electric Industries Co., Ltd.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01F5/00 , H01F17/0013 , H01F27/292 , H01F2017/048
摘要： An inductor includes a stacked structure. The stacked structure includes a substrate, a first structural body stacked on a lower surface of the substrate, and second structural bodies sequentially stacked on an upper surface of the substrate. A through hole extends through the stacked structure in a thickness direction. An insulation film covers the stacked structure. The first structural body includes a first insulating layer stacked on the lower surface of the substrate, and a first wiring stacked on a lower surface of the first insulating layer. The second structural bodies include second insulating layers and second wirings. The first wiring and the second wirings are connected in series to one another to form a helical coil. The substrate has a thickness greater than that of the first insulating layer and the second insulating layers.
摘要翻译：电感器包括堆叠结构。堆叠结构包括基板，堆叠在基板的下表面上的第一结构体和顺序地堆叠在基板的上表面上的第二结构体。通孔在厚度方向上延伸穿过层叠结构。绝缘膜覆盖堆叠结构。第一结构体包括堆叠在基板的下表面上的第一绝缘层和堆叠在第一绝缘层的下表面上的第一布线。第二结构体包括第二绝缘层和第二布线。第一布线和第二布线彼此串联连接以形成螺旋线圈。基板的厚度大于第一绝缘层和第二绝缘层的厚度。

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