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1. 发明授权

US11302623B2 Electronic device 有权
公开(公告)号：US11302623B2
公开(公告)日：2022-04-12
申请号：US16779875
申请日：2020-02-03
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Matsumoto , Tsukasa Nakanishi , Tadaaki Katsuyama
IPC分类号： H01L23/498 , H01L23/367 , H01L23/00
摘要： An electronic device includes a first metal plate including a first wiring and a second wiring, an electronic component mounted on a lower surface of the first wiring so as to overlap the second wiring in plan view, a second metal plate including an electrode electrically connected to the lower surface of the first wiring, and an insulation layer filling a space between the first metal plate, the second metal plate, and the electronic component and covering the electronic component. The upper surface of the second wiring is exposed from the insulation layer.

2. 发明申请

US20210335695A1 WIRING SUBSTRATE AND ELECTRONIC DEVICE 有权
公开(公告)号：US20210335695A1
公开(公告)日：2021-10-28
申请号：US17233786
申请日：2021-04-19
申请人： Shinko Electric Industries, Co., Ltd.
发明人： Takayuki Matsumoto , Tsukasa Nakanishi , Yukinori Hatori
IPC分类号： H01L23/495 , H01L23/31 , H01L21/48 , H01L21/56
摘要： A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.

3. 发明授权

US10986732B2 Laminated circuit board, and electronic component 有权
公开(公告)号：US10986732B2
公开(公告)日：2021-04-20
申请号：US16594428
申请日：2019-10-07
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Matsumoto , Tsukasa Nakanishi
IPC分类号： H05K1/18 , H05K3/46
摘要： A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.

4. 发明申请

US20130248894A1 LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, MANUFACTURING METHOD OF THE SAME, AND LIGHT-EMITTING ELEMENT PACKAGE 有权
公开(公告)号：US20130248894A1
公开(公告)日：2013-09-26
申请号：US13795253
申请日：2013-03-12
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi NAKAMURA , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H01L33/64
CPC分类号： H01L33/64 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H05K1/0206 , H05K1/113
摘要： A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.

5. 发明申请

US20210153355A1 WIRING SUBSTRATE AND ELECTRONIC DEVICE 有权
公开(公告)号：US20210153355A1
公开(公告)日：2021-05-20
申请号：US17094656
申请日：2020-11-10
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Matsumoto , Tsukasa Nakanishi , Yukinori Hatori
IPC分类号： H05K1/18 , H05K1/11
摘要： An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.

6. 发明申请

US20200152556A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20200152556A1
公开(公告)日：2020-05-14
申请号：US16671532
申请日：2019-11-01
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Matsumoto , Tsukasa Nakanishi , Tadaaki Katsuyama
IPC分类号： H01L23/495 , H01L23/498 , H01L23/31 , H01L23/00
摘要： An electronic component includes a metal member, an inductor, and a encapsulating resin. The metal member has an outer lead, an inner lead provided at a position opposed to the outer lead, and a post connecting the outer lead with the inner lead. The inductor is provided between the outer lead and the inner lead and connected to the outer lead or the inner lead. The encapsulating resin encapsulates the metal member and the inductor.

7. 发明授权

US09615461B2 Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module 有权
公开(公告)号：US09615461B2
公开(公告)日：2017-04-04
申请号：US15161579
申请日：2016-05-23
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H05K7/00 , H05K1/18 , H05K1/11 , H05K3/42 , H01L23/31 , H01L23/495 , H01L23/00 , H01L33/54 , H01L33/62 , H05K1/02 , H05K1/03 , H05K1/09 , H01L33/48 , H05K1/05
CPC分类号： H05K1/181 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L33/48 , H01L33/54 , H01L33/62 , H01L2224/13 , H01L2224/48091 , H01L2224/48245 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K1/0296 , H05K1/0313 , H05K1/056 , H05K1/09 , H05K1/112 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/42 , H05K3/427 , H05K2201/10106 , H05K2203/1545 , Y10T29/49165 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

8. 发明授权

US09224933B2 Light emitting device package and package for mounting light emitting device 有权
标题翻译：用于安装发光装置的发光装置封装和封装
公开(公告)号：US09224933B2
公开(公告)日：2015-12-29
申请号：US14333602
申请日：2014-07-17
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Tsukasa Nakanishi , Atsushi Nakamura , Takayuki Matsumoto
IPC分类号： H01L29/22 , H01L33/62 , H01L33/48 , H01L33/60 , H01L25/16
CPC分类号： H01L33/62 , H01L25/167 , H01L33/486 , H01L33/60 , H01L2224/16225 , H01L2924/15311
摘要： A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each other in a plan view, first and second through-wirings that penetrate the substrate and are provided on the two areas, respectively, each of the first and second through-wirings including one end electrically connected to the light emitting device mounting part and another end exposed from another surface of the substrate. A part of each of the first and second through-wirings includes a maximum part having a plan-view shape that is larger than a plan-view shape of the one end of each of the first and second through-wirings.
摘要翻译：一种用于在其上安装发光器件的封装。封装包括基板，发光器件安装部分，其包括形成在基板的一个表面上的布线，布线包括彼此面对布置并且在平面图中彼此间隔开预定间隔的两个区域，第一以及分别穿过所述基板并设置在所述两个区域上的第二贯通布线，所述第一和第二贯通布线中的每一个包括电连接到所述发光器件安装部分的一端和从所述基板的另一表面暴露的另一端。第一和第二贯通布线中的每一个的一部分包括具有大于第一和第二贯通布线中的每一个的一端的平面视图形状的平面视图形状的最大部分。

9. 发明授权

US09166132B2 Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package 有权
标题翻译：具有散热路径的发光元件安装封装，其制造方法和发光元件封装
公开(公告)号：US09166132B2
公开(公告)日：2015-10-20
申请号：US13795253
申请日：2013-03-12
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H01L33/48 , H01L33/64 , H01L33/62 , H05K1/02 , H05K1/11
CPC分类号： H01L33/64 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H05K1/0206 , H05K1/113
摘要： A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.
摘要翻译：一种发光元件安装封装，包括：形成第一发光元件安装部的第一布线，其设置在基板的一个表面上以安装发光元件;以及第一布线，其一端和另一端，所述一端电连接到所述第一发光元件安装部，从而可热转印，另一端从所述基板的另一表面突出。

10. 发明授权

US09147518B1 Inductor and coil substrate 有权
标题翻译：电感和线圈基片
公开(公告)号：US09147518B1
公开(公告)日：2015-09-29
申请号：US14661535
申请日：2015-03-18
申请人： Shinko Electric Industries Co., Ltd.
发明人： Atsushi Nakamura , Tsukasa Nakanishi , Takayuki Matsumoto
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01F5/00 , H01F17/0013 , H01F27/292 , H01F2017/048
摘要： An inductor includes a stacked structure. The stacked structure includes a substrate, a first structural body stacked on a lower surface of the substrate, and second structural bodies sequentially stacked on an upper surface of the substrate. A through hole extends through the stacked structure in a thickness direction. An insulation film covers the stacked structure. The first structural body includes a first insulating layer stacked on the lower surface of the substrate, and a first wiring stacked on a lower surface of the first insulating layer. The second structural bodies include second insulating layers and second wirings. The first wiring and the second wirings are connected in series to one another to form a helical coil. The substrate has a thickness greater than that of the first insulating layer and the second insulating layers.
摘要翻译：电感器包括堆叠结构。堆叠结构包括基板，堆叠在基板的下表面上的第一结构体和顺序地堆叠在基板的上表面上的第二结构体。通孔在厚度方向上延伸穿过层叠结构。绝缘膜覆盖堆叠结构。第一结构体包括堆叠在基板的下表面上的第一绝缘层和堆叠在第一绝缘层的下表面上的第一布线。第二结构体包括第二绝缘层和第二布线。第一布线和第二布线彼此串联连接以形成螺旋线圈。基板的厚度大于第一绝缘层和第二绝缘层的厚度。

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