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    • 3. 发明授权
    • Semiconductor device and method for operating the same
    • 半导体装置及其操作方法
    • US09406360B2
    • 2016-08-02
    • US14489120
    • 2014-09-17
    • SK hynix Inc.
    • Choung-Ki Song
    • G11C7/22G11C7/10G11C29/02
    • G11C7/222G11C7/1087G11C7/1093G11C29/023G11C29/028G11C2207/105G11C2207/2254
    • A semiconductor device may include a first pad suitable for inputting a dock, a plurality of second pads suitable for inputting data through a plurality of first data paths, a third pad suitable for inputting a first strobe signal through a first strobe signal path, a data latch unit suitable for latching the data inputted through the first data paths in response to the first strobe signal inputted through the first strobe signal path, and a calibration control unit suitable for calibrating delay values of the plurality of first data paths and the first strobe signal path in a first calibration mode such that a plurality of first test signals passing through the respective first data paths and a second test signal passing through the first strobe path are in phase with the clock inputted from the first pad.
    • 半导体器件可以包括适于输入基座的第一焊盘,适用于通过多个第一数据路径输入数据的多个第二焊盘,适于通过第一选通信号路径输入第一选通信号的第三焊盘,数据 锁存单元,用于响应于通过第一选通信号路径输入的第一选通信号,锁存通过第一数据路径输入的数据;以及校准控制单元,适于校准多个第一数据路径的延迟值和第一选通信号 路径,使得通过各个第一数据路径的多个第一测试信号和通过第一选通路径的第二测试信号与从第一焊盘输入的时钟同相。
    • 4. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US09311986B2
    • 2016-04-12
    • US14469072
    • 2014-08-26
    • SK hynix Inc.
    • Chang-Hyun KimChoung-Ki Song
    • G11C7/00G11C11/406G11C7/02
    • G11C11/40626G11C7/02G11C11/40615
    • A semiconductor memory device includes a control signal generator suitable for generating a control signal corresponding to temperature information, a refresh controller suitable for enabling a refresh signal for a smart refresh operation at a predetermined moment in response to a refresh command signal and enabling the refresh signal for a normal refresh operation at a moment corresponding to the control signal in response to the refresh command signal, and a data storage suitable for storing a data and performing the smart refresh operation and the normal refresh operation in response to the refresh signal of the refresh controller.
    • 半导体存储器件包括适于产生对应于温度信息的控制信号的控制信号发生器,适于在预定时刻响应于刷新命令信号启用用于智能刷新操作的刷新信号的刷新控制器,并使能刷新信号 用于响应于刷新命令信号在对应于控制信号的时刻进行正常的刷新操作,以及适于存储数据并响应于刷新刷新信号执行智能刷新操作和正常刷新操作的数据存储 控制器。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US09190138B2
    • 2015-11-17
    • US14293694
    • 2014-06-02
    • SK hynix Inc.
    • Choung-Ki Song
    • G11C5/02G11C11/406G11C11/408G11C7/02
    • G11C11/40618G11C5/025G11C7/02G11C11/406G11C11/40611G11C11/408G11C11/4087
    • A semiconductor memory device includes a first bank, a second bank disposed separately from the first bank along a first direction, a third bank disposed separately from the first bank along a second direction substantially perpendicular to the first direction, a fourth bank disposed separately from the second bank along the second direction and from the third bank along the first direction, a first row control region, which is disposed between the first bank and the second bank, suitable for controlling a row decoding operation of the first bank and the second bank, a second row control region, which is disposed between the third bank and the fourth bank, suitable for controlling a row decoding operation of the third bank and the fourth bank, and a refresh control unit suitable for controlling a refresh operation of the first to fourth banks.
    • 半导体存储器件包括第一组,沿第一方向与第一组分离设置的第二组,沿着基本上垂直于第一方向的第二方向与第一组分开设置的第三组,与第一组分开设置的第四组, 沿着第二方向的第二组和沿着第一方向的第三组,布置在第一组和第二组之间的第一行控制区,适于控制第一组和第二组的行解码操作, 布置在第三组和第四组之间的适于控制第三组和第四组的行解码操作的第二行控制区,以及适于控制第一至第四组的刷新操作的刷新控制单元 银行。
    • 7. 发明授权
    • Integrated circuit chip and memory device having the same
    • 集成电路芯片和存储器件具有相同的功能
    • US09140741B2
    • 2015-09-22
    • US13720191
    • 2012-12-19
    • SK hynix Inc.
    • Choung-Ki Song
    • G06F11/00G01R31/30G01R31/04G11C29/00G11C29/12G11C29/48
    • G01R31/041G01R31/046G11C29/00G11C29/1201G11C29/48
    • An integrated circuit chip includes a plurality of test input pads configured to receive a plurality of test input signals, a plurality of single-ended type buffers configured to receive signals input to the plurality of test input pads in a connectivity test mode, a plurality of differential-type buffers configured to receive signals input to the plurality of test input pads in a normal mode, a signal combination unit configured to combine the plurality of test input signals input through the plurality of single-ended type buffers, and to generate a plurality of test output signals, and a plurality of test output pads configured to output the plurality of test output signals in the connectivity test mode.
    • 集成电路芯片包括被配置为接收多个测试输入信号的多个测试输入焊盘,多个单端型缓冲器,被配置为在连接测试模式下接收输入到多个测试输入焊盘的信号,多个 差分型缓冲器,其被配置为以正常模式接收输入到所述多个测试输入焊盘的信号;信号组合单元,被配置为组合通过所述多个单端型缓冲器输入的所述多个测试输入信号,并且生成多个 的测试输出信号,以及多个测试输出焊盘,被配置为在连接测试模式下输出多个测试输出信号。