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1. 发明授权

US10729008B2 Flexible printed circuit board 有权
公开(公告)号：US10729008B2
公开(公告)日：2020-07-28
申请号：US16474727
申请日：2017-12-21
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Hiroshi Ueda , Kousuke Miura , Kou Noguchi
IPC分类号： H05K1/02
摘要： A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.

2. 发明授权

US10111330B2 Printed circuit board, electronic component, and method for producing printed circuit board 有权
公开(公告)号：US10111330B2
公开(公告)日：2018-10-23
申请号：US15319997
申请日：2015-06-24
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Hiroshi Ueda , Kousuke Miura
IPC分类号： H05K1/05 , H05K1/09 , H05K3/24 , H05K3/38 , H05K1/16
摘要： A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 μm or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.

3. 发明授权

US11641716B2 Method for manufacturing printed circuit board 有权
公开(公告)号：US11641716B2
公开(公告)日：2023-05-02
申请号：US16474705
申请日：2017-12-04
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Kou Noguchi , Hiroshi Ueda
IPC分类号： H05K3/07 , H05K3/00 , G03F7/09 , H05K3/06 , H05K3/18
摘要： A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.

4. 发明授权

US11140784B2 Printed wiring board and manufacturing method thereof 有权
公开(公告)号：US11140784B2
公开(公告)日：2021-10-05
申请号：US16495217
申请日：2017-12-22
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Kohei Okamoto , Kousuke Miura , Hiroshi Ueda , Shoichiro Sakai , Maki Ikebe
IPC分类号： H05K3/10 , H05K1/02 , H05K3/24
摘要： A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

5. 发明授权

US10307825B2 Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder 有权
公开(公告)号：US10307825B2
公开(公告)日：2019-06-04
申请号：US15546093
申请日：2016-01-26
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Issei Okada , Yoshio Oka , Takashi Kasuga , Yasuhiro Okuda , Jinjoo Park , Kousuke Miura , Hiroshi Ueda
IPC分类号： B22F9/24 , B05D3/02 , H05K1/09 , B22F1/00 , B22F7/04 , H01B1/00 , H01B1/22 , H01B5/00 , H01B5/14 , H01B13/00 , C22C9/00
摘要： An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.

6. 发明授权

US10292265B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US10292265B2
公开(公告)日：2019-05-14
申请号：US15505619
申请日：2015-09-08
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Shigeaki Uemura , Shigeyoshi Nakayama , Jinjoo Park , Sumito Uehara , Hiroshi Ueda , Kousuke Miura
IPC分类号： B21D39/00 , H05K1/09 , C23C18/31 , C23C18/18 , C23C18/30 , H05K3/02 , H05K3/10 , H05K3/46 , C23C18/20 , B22F7/06 , C09D11/037 , C09D11/10 , C09D11/52 , C23C18/32 , C23C18/40 , C23C18/42 , H05K3/38 , C23C18/16 , H05K3/18 , B22F1/00 , B22F3/16
摘要： The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

7. 发明授权

US10237976B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US10237976B2
公开(公告)日：2019-03-19
申请号：US15127203
申请日：2015-03-26
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Jinjoo Park , Sumito Uehara , Kousuke Miura , Hiroshi Ueda
IPC分类号： H05K3/12 , H05K1/09 , H05K3/24 , H05K3/40
摘要： A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.

8. 发明授权

US10076032B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US10076032B2
公开(公告)日：2018-09-11
申请号：US15127165
申请日：2015-03-19
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Shigeyoshi Nakayama , Jinjoo Park , Sumito Uehara , Kousuke Miura , Hiroshi Ueda
IPC分类号： H05K1/05 , H05K1/09 , H05K3/02 , H05K3/10 , H05K3/38
CPC分类号： H05K1/092 , H05K1/05 , H05K3/022 , H05K3/108 , H05K3/38 , H05K3/384 , H05K2201/0154 , H05K2201/0257 , H05K2203/0709 , H05K2203/072
摘要： A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

9. 发明授权

US10076028B2 Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board 有权
公开(公告)号：US10076028B2
公开(公告)日：2018-09-11
申请号：US15544961
申请日：2016-01-19
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Shigeaki Uemura , Jinjoo Park , Hiroshi Ueda , Kousuke Miura
IPC分类号： H05K1/09 , H05K1/02 , H05K3/42 , C23C28/02 , H05K3/18 , H05K3/06 , H05K3/10 , H05K3/12 , H05K3/40 , H05K3/02
CPC分类号： H05K1/0298 , C23C28/023 , H05K1/09 , H05K1/097 , H05K3/025 , H05K3/064 , H05K3/108 , H05K3/1283 , H05K3/188 , H05K3/245 , H05K3/381 , H05K3/4038 , H05K3/424 , H05K2201/0116 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2203/072 , H05K2203/095 , H05K2203/1131
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

10. 发明授权

US11523518B2 Method of making flexible printed circuit board and flexible printed circuit board 有权
公开(公告)号：US11523518B2
公开(公告)日：2022-12-06
申请号：US16766884
申请日：2018-11-23
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Kou Noguchi , Hiroshi Ueda
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/10 , H05K3/36 , H05K3/38 , H05K3/40 , H05K3/46 , G02B6/12 , G02B6/13 , G02B6/36 , H05K3/28 , H05K3/42
摘要： According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

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