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1. 发明授权

US11362426B2 Antenna module comprising cavity 有权
公开(公告)号：US11362426B2
公开(公告)日：2022-06-14
申请号：US16973316
申请日：2019-06-11
申请人： Samsung Electronics Co., Ltd.
发明人： Eunseok Hong
IPC分类号： H01Q1/00 , H01Q9/04 , H05K1/02
摘要： According to various embodiments of the disclosure, an antenna module and an electronic device including the same are disclosed. The antenna module includes a layer structure that includes a plurality of non-conductive layers, a first layer that is disposed between the plurality of non-conductive layers and that includes at least one first conductive patch, a second layer that is disposed adjacent to the plurality of non-conductive layers in a first direction and that includes a ground, and a feeding line that passes through at least one non-conductive layer located between the first layer and the second layer among the plurality of non-conductive layers and the second layer and that is electrically connected with the at least one first conductive patch, and communication circuitry that is disposed adjacent to the layer structure in the first direction and that supplies electric power to the at least one first conductive patch through the feeding line, and at least one first cavity is formed in at least part of the at least one non-conductive layer through which the feeding line passes. Besides, it may be permissible to prepare various other embodiments speculated through the specification.

2. 发明授权

US10653046B2 Structure having circuit board disposed on upper face of shield can disposed on circuit board, and electronic device including same 有权
公开(公告)号：US10653046B2
公开(公告)日：2020-05-12
申请号：US16442703
申请日：2019-06-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Eunseok Hong
IPC分类号： H05K9/00 , H05K1/18 , H05K1/14 , H01Q1/24 , H05K5/00
摘要： An electronic device according to various embodiments may include: a first communication module comprising communication circuitry configured to process a communication signal in a first frequency band among multiple frequency bands corresponding to a specified communication method; a second communication module comprising communication circuitry configured to process a communication signal in a second frequency band among the multiple frequency bands; a first circuit board on which the first communication module and a first connector electrically connected to the first communication module are mounted; a shield can including an upper face including at least one opening and the shield can further including a side face surrounding the upper face of the shield can, the shield can being disposed on the first circuit board to accommodate the first communication module in an inner space defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first circuit board; a second circuit board on which the second communication module and a second connector electrically connected to the second communication module are mounted, the second circuit board being disposed on the upper face of the shield can such that the second communication module corresponds to the first communication module and/or at least one component mounted on the first circuit board in the inner space through a corresponding opening among the at least one opening wherein the second connector is electrically coupled to the first connector; and an adhesive disposed between the upper face and the second circuit board.

3. 发明授权

US09952997B2 Method for improving data transmission speed and electronic device implementing the same 有权
公开(公告)号：US09952997B2
公开(公告)日：2018-04-24
申请号：US15066770
申请日：2016-03-10
申请人： Samsung Electronics Co., Ltd.
发明人： Junebum Lee , Eunseok Hong
IPC分类号： G06F13/00 , G06F13/40 , G06F13/20
CPC分类号： G06F13/4022 , G06F13/20 , G06F13/4068
摘要： A method for improving a data transmission speed and an electronic device implementing the same are provided. The electronic device includes a USB connection unit configured to be connectable to an external electronic device and including designated data reception channels and data transmission channels, a switch unit configured to switch an electrical connection between the data reception channels and data transmission channels, and a control unit configured to confirm device attribute information of the external electronic device that is connected through the USB connection unit and to control the switch unit to switch the electrical connection so that at least one data reception channel functions as a data transmission channel if the connected external electronic device is a display device.

4. 发明授权

US11510312B2 Circuit board having copper clad laminate laminated on core layer, and electronic device comprising same 有权
公开(公告)号：US11510312B2
公开(公告)日：2022-11-22
申请号：US17265888
申请日：2019-08-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
IPC分类号： H01Q1/38 , H05K1/02 , H01Q1/48 , H01Q9/04 , H05K1/09 , H05K1/11 , H05K1/14
摘要： Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.

5. 发明授权

US11363711B2 Printed circuit board including electroconductive pattern and electronic device including printed circuit board 有权
公开(公告)号：US11363711B2
公开(公告)日：2022-06-14
申请号：US16200401
申请日：2018-11-26
申请人： Samsung Electronics Co., Ltd.
发明人： Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
IPC分类号： H01Q1/22 , H01Q1/38 , H05K1/02 , H01Q15/00 , H01Q21/28 , H01Q9/04 , H01Q21/00 , H01Q21/08
摘要： According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.

6. 发明授权

US11212378B2 Foldable electronic device 有权
公开(公告)号：US11212378B2
公开(公告)日：2021-12-28
申请号：US16723350
申请日：2019-12-20
申请人： Samsung Electronics Co., Ltd.
发明人： Eunseok Hong
IPC分类号： G09G5/00 , H04M1/02 , G06F1/20 , G06F1/16
摘要： A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.

7. 发明授权

US11617257B2 Printed circuit board for transmitting signal in high-frequency band and electronic device including same 有权
公开(公告)号：US11617257B2
公开(公告)日：2023-03-28
申请号：US17298810
申请日：2021-05-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
IPC分类号： H05K1/02 , H05K1/03
摘要： Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

8. 发明授权

US11503702B2 Electronic device comprising conductive member disposed to have dielectric-fillable interval space along wire 有权
公开(公告)号：US11503702B2
公开(公告)日：2022-11-15
申请号：US17286160
申请日：2019-10-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Eunseok Hong
IPC分类号： H05K1/02 , H01P3/08 , H05K1/14 , H05K9/00
摘要： An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

9. 发明授权

US11121067B2 Interposer and electronic device including the same 有权
公开(公告)号：US11121067B2
公开(公告)日：2021-09-14
申请号：US16791575
申请日：2020-02-14
申请人： Samsung Electronics Co., Ltd.
发明人： Eunseok Hong
IPC分类号： H01L23/498 , H01L23/528 , H01L25/065
摘要： An electronic device includes a housing, a first substrate disposed in the housing and configured to face a first direction, wherein the first substrate includes a first interconnection, a second substrate located in the first direction from the first substrate, wherein the second substrate includes a second interconnection, and a plurality of interposers formed between the first substrate and the second substrate to electrically connect the first interconnection and the second interconnection, wherein the plurality of interposers is configured to at least partially surround a shielded space formed between the first substrate and the second substrate, wherein each of the plurality of interposers includes a plurality of layers configured to face a direction perpendicular to the first direction, and wherein at least one of the plurality of layers includes a conductive pattern that extends in the first direction and is electrically connected with the first interconnection and the second interconnection.

10. 发明授权

US10120466B2 Pen input device having malfunction prevention function and method of preventing malfunction thereof 有权
公开(公告)号：US10120466B2
公开(公告)日：2018-11-06
申请号：US15244185
申请日：2016-08-23
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Gyounghwan Park , Eunseok Hong , Shinho Kim , Wonseob Kim
IPC分类号： G06F3/038 , G06F3/0346 , G06F3/0354 , G06F3/046
摘要： A pen input device having malfunction prevention function and method of preventing malfunction thereof are disclosed. The pen input device includes: a housing having a bar form and having one end relatively narrowly opened to form a housing space; a resonant circuit housed within the housing; a tip that protrudes from an open end of the housing to the outside, the tip comprising a dielectric material and being configured to be movable within a predetermined range in a direction of a longitudinal axis of the housing, the tip being further configured to be self-centering; and a ground shielding portion formed in a portion of the housing in which electromagnetic induction occurs, the ground shielding portion not including the tip.

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