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1. 发明授权

US09627955B2 Semiconductor module 有权
公开(公告)号：US09627955B2
公开(公告)日：2017-04-18
申请号：US15110653
申请日：2015-01-07
申请人： Satoru Kameyama
发明人： Satoru Kameyama
IPC分类号： H01L29/78 , H02M1/088 , H02M3/155 , H01L29/32 , H01L29/861 , H01L27/07 , H01L29/739 , H01L29/08 , H01L23/31 , H01L23/498 , H01L25/065 , H01L29/06 , H01L29/10 , H02M3/158 , H01L29/40 , H02M1/00
CPC分类号： H02M1/088 , H01L23/3114 , H01L23/49844 , H01L25/0655 , H01L27/0727 , H01L27/0761 , H01L29/063 , H01L29/0834 , H01L29/1095 , H01L29/32 , H01L29/407 , H01L29/7397 , H01L29/78 , H01L29/861 , H01L29/8613 , H02M3/155 , H02M3/158 , H02M2001/0048 , H02M2001/0054 , Y02B70/1491
摘要： A semiconductor module is provided with a high potential wiring, an output wiring, a low potential wiring, an upper arm switching device, an upper arm diode, a lower arm switching device, and a lower arm diode. A ratio of steady loss to switching loss of the upper arm switching device is configured to be smaller than a ratio of steady loss to switching loss of the lower arm switching device. Further, a ratio of steady loss to switching loss of the upper arm diode is configured to be smaller than a ratio of steady loss to switching loss of the lower arm diode.

2. 发明申请

US20160329323A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20160329323A1
公开(公告)日：2016-11-10
申请号：US15029583
申请日：2014-07-17
申请人： Shinya Iwasaki , Satoru Kameyama
发明人： Shinya Iwasaki , Satoru Kameyama
IPC分类号： H01L27/07 , H01L29/32 , H01L29/10 , H01L29/423 , H01L29/739 , H01L29/08
CPC分类号： H01L27/0727 , H01L21/3223 , H01L29/0804 , H01L29/0821 , H01L29/1095 , H01L29/32 , H01L29/4236 , H01L29/7397
摘要： A small semiconductor device having a diode forward voltage less likely to change due to a gate potential is provided. An anode and an upper IGBT structure (emitter and body) are provided in a range in the substrate exposed at the upper surface. A trench, a gate insulating film, and a gate electrode extend along a border of the anode and the upper IGBT structure. Cathode and collector are provided in a range in the substrate exposed at the lower surface. A drift is provided between an upper structure and a lower structure. A crystal defect region extends across the drift above the cathode and the drift above the collector. When a thickness of the substrate is defined as x [μm] and a width of a portion of the crystal defect region that protrudes above the cathode is defined as y [μm], y≧0.007x2−1.09x+126 is satisfied.
摘要翻译：提供了具有由于栅极电位而不太可能改变的二极管正向电压的小型半导体器件。阳极和上部IGBT结构（发射体和主体）设置在暴露在上表面的衬底的范围内。沟槽，栅极绝缘膜和栅极电极沿着阳极和上部IGBT结构的边界延伸。阴极和集电体设置在暴露在下表面的基板的范围内。在上部结构和下部结构之间提供漂移。晶体缺陷区域延伸穿过阴极上方的漂移物，并且在集电极上方漂移。当衬底的厚度被定义为x [μm]，并且在阴极上方突出的晶体缺陷区域的一部分的宽度被定义为y [μm]时，满足y≥0.007x2-1.09x+ 126。

3. 发明授权

US09397206B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09397206B2
公开(公告)日：2016-07-19
申请号：US14356984
申请日：2011-11-09
申请人： Satoru Kameyama
发明人： Satoru Kameyama
IPC分类号： H01L29/06 , H01L29/739 , H01L29/861 , H01L27/06 , H01L21/265 , H01L21/268 , H01L29/66 , H01L29/08 , H01L29/36
CPC分类号： H01L27/0664 , H01L21/26513 , H01L21/268 , H01L29/0834 , H01L29/1095 , H01L29/36 , H01L29/6609 , H01L29/66333 , H01L29/66348 , H01L29/7395 , H01L29/7397 , H01L29/861
摘要： A semiconductor device including a semiconductor substrate in which a diode region and an IGBT region are formed is provided. In the semiconductor device, the diode region includes a second conductivity type cathode layer. An impurity concentration of second conductivity type impurities of the cathode layer is distributed in a curve pattern having at least two peaks, and the impurity concentration of the second conductivity type impurities is higher than that of first conductivity type impurities at all depths of the cathode layer.
摘要翻译：提供了包括形成有二极管区域和IGBT区域的半导体衬底的半导体器件。在半导体器件中，二极管区域包括第二导电型阴极层。阴极层的第二导电型杂质的杂质浓度以具有至少两个峰的曲线图形分布，并且第二导电型杂质的杂质浓度高于阴极层的所有深度处的第一导电型杂质的杂质浓度。

4. 发明授权

US09153575B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09153575B2
公开(公告)日：2015-10-06
申请号：US14373992
申请日：2013-01-23
申请人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
发明人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
IPC分类号： H01L29/66 , H01L27/06 , H01L29/739 , H01L29/08 , H01L29/40 , H01L29/861 , H01L29/06
CPC分类号： H01L27/0664 , H01L29/0646 , H01L29/0834 , H01L29/407 , H01L29/7395 , H01L29/7397 , H01L29/861
摘要： When a semiconductor substrate of a semiconductor device is viewed from above, an isolation region, an IGBT region, and a diode region are all formed adjacent to each other. A deep region that is connected to a body region and an anode region is formed in the isolation region. A drift region is formed extending across the isolation region, the IGBT region, and the diode region, inside the semiconductor substrate. A collector region that extends across the isolation region, the IGBT region and the diode region, and a cathode region positioned in the diode region, are formed in a region exposed on a lower surface of the semiconductor substrate. A boundary between the collector region and the cathode region is in the diode region, in a cross-section that cuts across a boundary between the isolation region and the diode region, and divides the isolation region and the diode region. The collector region formed in the isolation region has a higher dopant impurity concentration than the collector region in the IGBT region.
摘要翻译：当从上方观察半导体器件的半导体衬底时，隔离区域，IGBT区域和二极管区域都彼此相邻地形成。在隔离区域中形成连接到体区和阳极区的深区。在半导体衬底内部跨越隔离区域，IGBT区域和二极管区域形成漂移区域。在半导体衬底的下表面上暴露的区域中形成有跨越隔离区域，IGBT区域和二极管区域以及位于二极管区域中的阴极区域的集电极区域。在二极管区域中，集电极区域和阴极区域之间的边界处于跨越隔离区域和二极管区域之间的边界的横截面，并且分隔隔离区域和二极管区域。形成在隔离区域的集电极区域的掺杂浓度比IGBT区域的集电极区域高。

5. 发明授权

US09960165B2 Semiconductor device having adjacent IGBT and diode regions with a shifted boundary plane between a collector region and a cathode region 有权
公开(公告)号：US09960165B2
公开(公告)日：2018-05-01
申请号：US15027846
申请日：2013-11-05
申请人： Yuki Horiuchi , Satoru Kameyama
发明人： Yuki Horiuchi , Satoru Kameyama
IPC分类号： H01L29/66 , H01L27/105 , H01L29/78 , H01L29/40 , H01L29/739 , H01L29/06 , H01L29/08
CPC分类号： H01L27/105 , H01L29/0696 , H01L29/0821 , H01L29/0834 , H01L29/0839 , H01L29/407 , H01L29/7391 , H01L29/7397 , H01L29/78 , H01L29/8613
摘要： Provided is a technology for further reducing a loss in a semiconductor device including a semiconductor substrate in which an IGBT region and a diode region are provided. This semiconductor device includes a semiconductor substrate in which at least one IGBT region and at least one diode region are provided. The IGBT region and the diode region are adjacent to each other in a predetermined direction in a plan view of the semiconductor substrate. In the plan view of the semiconductor substrate, a first boundary plane where the collector region and the cathode region are adjacent is shifted from a second boundary plane where the IGBT region and the diode region are adjacent on the front surface side of the semiconductor substrate either in a direction from the cathode region toward the collector region or in a direction from the collector region toward the cathode region.

6. 发明申请

US20140361333A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20140361333A1
公开(公告)日：2014-12-11
申请号：US14373992
申请日：2013-01-23
申请人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
发明人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
IPC分类号： H01L27/06 , H01L29/739 , H01L29/06
CPC分类号： H01L27/0664 , H01L29/0646 , H01L29/0834 , H01L29/407 , H01L29/7395 , H01L29/7397 , H01L29/861
摘要： When a semiconductor substrate of a semiconductor device is viewed from above, an isolation region, an IGBT region, and a diode region are all formed adjacent to each other. A deep region that is connected to a body region and an anode region is formed in the isolation region. A drift region is formed extending across the isolation region, the IGBT region, and the diode region, inside the semiconductor substrate. A collector region that extends across the isolation region, the IGBT region and the diode region, and a cathode region positioned in the diode region, are formed in a region exposed on a lower surface of the semiconductor substrate. A boundary between the collector region and the cathode region is in the diode region, in a cross-section that cuts across a boundary between the isolation region and the diode region, and divides the isolation region and the diode region. The collector region formed in the isolation region has a higher dopant impurity concentration than the collector region in the IGBT region.
摘要翻译：当从上方观察半导体器件的半导体衬底时，隔离区域，IGBT区域和二极管区域都彼此相邻地形成。在隔离区域中形成连接到体区和阳极区的深区。在半导体衬底内部跨越隔离区域，IGBT区域和二极管区域形成漂移区域。在半导体衬底的下表面上暴露的区域中形成有跨越隔离区域，IGBT区域和二极管区域以及位于二极管区域中的阴极区域的集电极区域。在二极管区域中，集电极区域和阴极区域之间的边界处于跨越隔离区域和二极管区域之间的边界的横截面，并且分隔隔离区域和二极管区域。形成在隔离区域的集电极区域的掺杂浓度比IGBT区域的集电极区域高。

7. 发明授权

US10141304B2 Semiconductor device 有权
公开(公告)号：US10141304B2
公开(公告)日：2018-11-27
申请号：US15029583
申请日：2014-07-17
申请人： Shinya Iwasaki , Satoru Kameyama
发明人： Shinya Iwasaki , Satoru Kameyama
IPC分类号： H01L29/66 , H01L27/07 , H01L29/32 , H01L29/739 , H01L21/322 , H01L29/08 , H01L29/10 , H01L29/423
摘要： A small semiconductor device having a diode forward voltage less likely to change due to a gate potential is provided. An anode and an upper IGBT structure (emitter and body) are provided in a range in the substrate exposed at the upper surface. A trench, a gate insulating film, and a gate electrode extend along a border of the anode and the upper IGBT structure. Cathode and collector are provided in a range in the substrate exposed at the lower surface. A drift is provided between an upper structure and a lower structure. A crystal defect region extends across the drift above the cathode and the drift above the collector. When a thickness of the substrate is defined as x [μm] and a width of a portion of the crystal defect region that protrudes above the cathode is defined as y [μm], y≥0.007x2−1.09x+126 is satisfied.

8. 发明授权

US09972707B2 Semiconductor device 有权
公开(公告)号：US09972707B2
公开(公告)日：2018-05-15
申请号：US15104073
申请日：2014-09-08
申请人： Keisuke Kimura , Satoru Kameyama
发明人： Keisuke Kimura , Satoru Kameyama
IPC分类号： H01L29/739 , H01L29/861 , H01L29/08 , H01L29/06 , H01L29/40
CPC分类号： H01L29/7397 , H01L29/0649 , H01L29/0834 , H01L29/407 , H01L29/861
摘要： A semiconductor device includes a main IGBT region in which an IGBT is provided, a main diode region in which a diode is provided, a sense IGBT region in which an IGBT is provided, and a sense diode region in which a diode is provided. A clearance between the body region and the anode region is longer than a product of electron mobility and electron lifetime in the n-type region between the body region and the anode region. A clearance between an end of the collector region on a sense diode region side and the body region is longer than a product of electron mobility and electron lifetime in the n-type region between the end and the body region.

9. 发明授权

US09379225B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09379225B2
公开(公告)日：2016-06-28
申请号：US14767370
申请日：2013-02-13
申请人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
发明人： Keisuke Kimura , Satoru Kameyama , Masaki Koyama , Sachiko Aoi
IPC分类号： H01L29/739 , H01L29/06 , H01L29/08 , H01L29/10 , H01L27/06
CPC分类号： H01L29/7397 , H01L27/0629 , H01L27/0664 , H01L29/0696 , H01L29/0834 , H01L29/1095
摘要： A semiconductor device in which an IGBT region and a diode region are formed on one semiconductor substrate is disclosed. The IGBT region includes: a body layer of a first conductivity type that is formed on a front surface of the semiconductor substrate; a body contact layer of the first conductivity type that is partially formed on a front surface of the body layer and has a higher impurity concentration of the first conductivity type than the body layer; an emitter layer of a second conductivity type that is partially formed on the front surface of the body layer; a drift layer; a collector layer; and a gate electrode. In the semiconductor device, a part of the body contact layer placed at a long distance from the diode region is made larger than a part of the body contact layer placed at a short distance from the diode region.
摘要翻译：公开了在一个半导体衬底上形成IGBT区域和二极管区域的半导体器件。 IGBT区域包括：形成在半导体衬底的前表面上的第一导电类型的主体层; 所述第一导电类型的体接触层部分地形成在所述主体层的前表面上，并且具有比所述主体层更高的第一导电类型的杂质浓度; 第二导电类型的发射极层，部分地形成在所述主体层的前表面上; 漂移层收集层; 和栅电极。在半导体器件中，与二极管区域长距离放置的身体接触层的一部分被制成大于放置在与二极管区域相距很短距离的身体接触层的一部分。

10. 发明申请

US20150295042A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20150295042A1
公开(公告)日：2015-10-15
申请号：US14443199
申请日：2012-12-20
申请人： Satoru KAMEYAMA , Keisuke KIMURA
发明人： Satoru Kameyama , Keisuke Kimura
IPC分类号： H01L29/06 , H01L29/08 , H01L29/861 , H01L29/10 , H01L27/06 , H01L29/739
CPC分类号： H01L29/0696 , H01L27/0629 , H01L29/0804 , H01L29/0821 , H01L29/0834 , H01L29/1095 , H01L29/7397 , H01L29/861
摘要： The present application discloses a semiconductor device in which an IGBT region and a diode region are formed on one semiconductor substrate. The IGBT region includes: a collector layer; an IGBT drift layer; a body layer; a gate electrode; and an emitter layer. The diode region includes: a cathode layer; a diode drift layer; an anode layer; a trench electrode; and an anode contact layer. The diode region is divided into unit diode regions by the gate electrode or the trench electrode. In a unit diode region adjacent to the IGBT region, when seen in a plan view of the front surface of the semiconductor substrate, the anode layer and the anode contact layer are mixedly placed, and the anode contact layer is placed at least in a location opposite to the emitter layer with the gate electrode interposed therebetween.
摘要翻译：本申请公开了一种半导体器件，其中在一个半导体衬底上形成IGBT区域和二极管区域。 IGBT区域包括：集电极层; IGBT漂移层; 身体层栅电极; 和发射极层。二极管区域包括：阴极层; 二极管漂移层; 阳极层; 沟槽电极; 和阳极接触层。二极管区域由栅极电极或沟槽电极分为单位二极管区域。在与IGBT区域相邻的单位二极管区域中，当在半导体衬底的前表面的平面图中看到阳极层和阳极接触层时，将阳极接触层至少放置在位置与发射极层相对，栅电极插在其间。

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