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    • 3. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US09324876B2
    • 2016-04-26
    • US14474533
    • 2014-09-02
    • Semiconductor Energy Laboratory Co., Ltd.
    • Yoshiyuki KobayashiDaisuke Matsubayashi
    • H01L31/06H01L29/786H01L29/417
    • H01L29/7869H01L29/41733H01L29/78696
    • A semiconductor device includes a first oxide semiconductor film over an insulating surface; a second oxide semiconductor film over the first oxide semiconductor film; a source electrode and a drain electrode in contact with side surfaces of the first oxide semiconductor film, side surfaces of the second oxide semiconductor film, and the top surface of the second oxide semiconductor film; a third oxide semiconductor film over the second oxide semiconductor film, the source electrode, and the drain electrode; a gate insulating film over the third oxide semiconductor film; and a gate electrode in contact with the top surface of the gate insulating film. A length obtained by subtracting a channel length between the source electrode and the drain electrode from a length of the second oxide semiconductor film in the channel length direction is 0.2 times to 2.0 times as long as the channel length.
    • 半导体器件包括绝缘表面上的第一氧化物半导体膜; 第一氧化物半导体膜上的第二氧化物半导体膜; 与第一氧化物半导体膜的侧表面,第二氧化物半导体膜的侧表面和第二氧化物半导体膜的顶表面接触的源电极和漏电极; 第二氧化物半导体膜上的第三氧化物半导体膜,源电极和漏电极; 第三氧化物半导体膜上的栅极绝缘膜; 以及与栅极绝缘膜的顶表面接触的栅电极。 通过从沟道长度方向上的第二氧化物半导体膜的长度减去源电极和漏电极之间的沟道长度而获得的长度是沟道长度的0.2倍至2.0倍。
    • 10. 发明授权
    • Thin film transistor for integrated circuit
    • 用于集成电路的薄膜晶体管
    • US09281409B2
    • 2016-03-08
    • US14330444
    • 2014-07-14
    • Semiconductor Energy Laboratory Co., Ltd.
    • Shunpei YamazakiDaisuke MatsubayashiYoshiyuki Kobayashi
    • H01L29/786H01L29/423H01L27/12
    • H01L29/78693H01L27/1225H01L29/0684H01L29/42384H01L29/7869H01L29/78696
    • A semiconductor device is provided with a first oxide semiconductor film over an insulating surface; a second oxide semiconductor film over the first oxide semiconductor film; a third oxide semiconductor film in contact with a top surface of the insulating surface, a side surface of the first oxide semiconductor film, and side and top surfaces of the second oxide semiconductor film; a gate insulating film over the third oxide semiconductor film; and a gate electrode in contact with the gate insulating film and faces the top and side surfaces a of the second oxide semiconductor film. A thickness of the first oxide semiconductor film is larger than a sum of a thickness of the third oxide semiconductor film and a thickness of the gate insulating film, and the difference is larger than or equal to 20 nm.
    • 半导体器件在绝缘表面上设置有第一氧化物半导体膜; 第一氧化物半导体膜上的第二氧化物半导体膜; 与所述绝缘表面的顶表面接触的第三氧化物半导体膜,所述第一氧化物半导体膜的侧表面以及所述第二氧化物半导体膜的侧表面和顶表面; 第三氧化物半导体膜上的栅极绝缘膜; 以及与栅极绝缘膜接触并与第二氧化物半导体膜的顶表面和侧表面a相对的栅电极。 第一氧化物半导体膜的厚度大于第三氧化物半导体膜的厚度与栅极绝缘膜的厚度的和,并且该差值大于或等于20nm。