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    • 1. 发明授权
    • Phase change memories
    • 相变记忆
    • US09136469B2
    • 2015-09-15
    • US14642573
    • 2015-03-09
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Ying LiNeil ZhuGuanping Wu
    • H01L21/06H01L45/00
    • H01L45/06H01L45/1233H01L45/124H01L45/1253H01L45/144H01L45/1683
    • A method is provided for fabricating a phase change memory. The method includes providing a semiconductor substrate having a bottom electrode connecting with one or more semiconductor devices, and forming a first dielectric layer on the semiconductor substrate. The method also includes forming a loop-shape electrode in the first dielectric layer, and forming a second dielectric layer having a first opening exposing a portion of the first dielectric layer and a portion of the loop-shape electrode. Further, the method includes forming a phase change layer in the first opening of the second dielectric layer such that a contact area between the phase change layer and the loop-shape electrode may be controlled to achieve desired contact, and forming a top electrode.
    • 提供了一种用于制造相变存储器的方法。 该方法包括提供具有与一个或多个半导体器件连接的底部电极并在半导体衬底上形成第一电介质层的半导体衬底。 该方法还包括在第一电介质层中形成环形电极,以及形成具有暴露第一电介质层的一部分和环形电极的一部分的第一开口的第二电介质层。 此外,该方法包括在第二电介质层的第一开口中形成相变层,使得可以控制相变层和环形电极之间的接触面积以实现期望的接触,并形成顶部电极。
    • 3. 发明授权
    • Method for fabricating phase change memory
    • 制造相变存储器的方法
    • US09006022B2
    • 2015-04-14
    • US14056253
    • 2013-10-17
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Ying LiNeil ZhuGuanping Wu
    • H01L21/06H01L45/00
    • H01L45/06H01L45/1233H01L45/124H01L45/1253H01L45/144H01L45/1683
    • A method is provided for fabricating a phase change memory. The method includes providing a semiconductor substrate having a bottom electrode connecting with one or more semiconductor devices, and forming a first dielectric layer on the semiconductor substrate. The method also includes forming a loop-shape electrode in the first dielectric layer, and forming a second dielectric layer having a first opening exposing a portion of the first dielectric layer and a portion of the loop-shape electrode. Further, the method includes forming a phase change layer in the first opening of the second dielectric layer such that a contact area between the phase change layer and the loop-shape electrode may be controlled to achieve desired contact, and forming a top electrode.
    • 提供了一种用于制造相变存储器的方法。 该方法包括提供具有与一个或多个半导体器件连接的底部电极并在半导体衬底上形成第一电介质层的半导体衬底。 该方法还包括在第一电介质层中形成环形电极,以及形成具有暴露第一电介质层的一部分和环形电极的一部分的第一开口的第二电介质层。 此外,该方法包括在第二电介质层的第一开口中形成相变层,使得可以控制相变层和环形电极之间的接触面积以实现期望的接触,并形成顶部电极。