会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Image forming apparatus for retrieving print data using an address of the stored print data
    • 图像形成装置,用于使用所存储的打印数据的地址来检索打印数据
    • US09542131B2
    • 2017-01-10
    • US14038103
    • 2013-09-26
    • Hiroyuki Hayashi
    • Hiroyuki Hayashi
    • G06F3/12
    • G06F3/122G06F3/1236G06F3/1271G06F3/1288
    • A printing apparatus which communicates with a data providing apparatus includes a printing mechanism which executes a printing operation. The printing apparatus receives a number of print copies, and acquires print data from the data providing apparatus by executing a request processing of transmitting to the data providing apparatus a data request of the print data, and a reception processing of receiving the print data from the data providing apparatus. When executing a printing operation of N copies (N is an integer of 2 or larger), the acquiring executes, for each copy, the request processing and the reception processing to acquire the print data from the data providing apparatus while executing the request processing of the print data of M-th copy (M is an integer of 2 or larger and N or smaller) after the reception processing of the print data of (M−1)-th copy is completed.
    • 与数据提供装置通信的打印装置包括执行打印操作的打印机构。 打印装置接收多个打印副本,并通过执行向数据提供装置发送打印数据的数据请求的请求处理从数据提供装置获取打印数据,以及从打印数据接收打印数据的接收处理 数据提供装置。 当执行N个副本的打印操作(N是2或更大的整数)时,对于每个副本,获取执行请求处理和接收处理,以在执行请求处理的请求处理期间从数据提供装置获取打印数据 第(M-1)次复印的打印数据的接收处理完成后,第M个拷贝的打印数据(M为2以上且N以下的整数)。
    • 5. 发明授权
    • Defect inspection apparatus and defect inspection method
    • 缺陷检查装置和缺陷检查方法
    • US08604432B2
    • 2013-12-10
    • US13600980
    • 2012-08-31
    • Hiroyuki Hayashi
    • Hiroyuki Hayashi
    • H01J37/28
    • H01J37/02H01J37/265H01J37/28H01J2237/2446H01J2237/24485H01J2237/24564
    • In accordance with an embodiment, a defect inspection apparatus includes a charged beam irradiation unit, a detection unit, an energy filter, and an inspection unit. The charged beam irradiation unit generates a charged beam and irradiates a sample including a pattern as an inspection target thereon with the generated charged beam. The detection unit detects secondary charged particles or reflected charged particles generated from the sample by irradiation of the charged beam and outputs a signal. The energy filter is arranged between the detection unit and the sample to selectively allow the secondary charged particles or the reflected charged particles with energy associated with an applied voltage to pass therethrough. The inspection unit applies voltages different from each other to the energy filter and outputs information concerning a defect of the pattern from an intensity difference between signals obtained under application voltage different from each other.
    • 根据实施例,缺陷检查装置包括带电束照射单元,检测单元,能量过滤器和检查单元。 充电光束照射单元产生带电光束,并且利用所产生的带电束将包括作为检查对象的图案的样本照射。 检测单元通过照射带电波束来检测从样品产生的二次带电粒子或反射带电粒子,并输出信号。 能量过滤器布置在检测单元和样品之间,以选择性地允许具有与施加电压相关联的能量通过的二次带电粒子或反射带电粒子。 检查单元向能量滤波器施加彼此不同的电压,并且从根据施加电压彼此不同获得的信号之间的强度差输出关于图案的缺陷的信息。
    • 7. 发明授权
    • Ink ribbon cassette and apparatus that uses the ink ribbon cassette
    • 墨带盒和使用色带盒的设备
    • US08348529B2
    • 2013-01-08
    • US12128912
    • 2008-05-29
    • Hiroyuki Hayashi
    • Hiroyuki Hayashi
    • B41J35/28B41J32/00B41J32/02B41J33/26
    • B41J33/10B41J32/02
    • An ink ribbon cassette includes first and second rotatable bodies that rotate with an ink ribbon held between the rotatable bodies in sandwiched relation. The second rotatable body includes a hole through which a shaft extends such that the second rotatable body is rotatably supported on the shaft. The shaft may have a circumferential surface conical toward the free end, and the hole may be a conical hole into which the conical shaft extends. The shaft may include a plurality of cylindrical shaft portions that are in line with one another and that have different diameters. The second rotatable body is formed with a plurality of cylindrical hole portions having different diameters corresponding to the cylindrical shaft portions such that the second rotatable body is rotatably supported on the shaft.
    • 墨带盒包括第一和第二可旋转体,其以夹持在可转动体之间的墨带旋转。 第二旋转体包括孔,轴延伸穿过该孔,使得第二可旋转体可旋转地支撑在轴上。 轴可以具有朝向自由端圆锥形的圆周表面,并且孔可以是锥形轴延伸到其中的锥形孔。 轴可以包括彼此成直角且具有不同直径的多个圆柱形轴部。 第二旋转体形成有多个圆柱形孔部分,其具有与圆柱形轴部分对应的不同直径的圆柱形孔部分,使得第二可旋转体可旋转地支撑在轴上。
    • 9. 发明授权
    • Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus
    • 半导体衬底,衬底检查方法,半导体器件制造方法和检查装置
    • US07973281B2
    • 2011-07-05
    • US12458343
    • 2009-07-08
    • Hiroyuki HayashiTakamitsu NagaiTomonobu NodaKenichi KadotaHisaki Kozaki
    • Hiroyuki HayashiTakamitsu NagaiTomonobu NodaKenichi KadotaHisaki Kozaki
    • G01N23/00
    • H01L22/14H01L2924/0002H01L2924/00
    • A semiconductor substrate inspection method includes: generating a charged particle beam, and irradiating the charged particle beam to a semiconductor substrate in which contact wiring lines are formed on a surface thereof, the contact wiring lines of the semiconductor substrate being designed to alternately repeat in a plane view so that one of the adjacent contact wiring lines is grounded to the semiconductor substrate and the other of the adjacent contact wiring lines is insulated from the semiconductor substrate; detecting at least one of a secondary charged particle, a reflected charged particle and a back scattering charged particle generated from the surface of the semiconductor substrate to acquire a signal; generating an inspection image with the signal, the inspection image showing a state of the surface of the semiconductor substrate; and judging whether the semiconductor substrate is good or bad from a difference of brightness in the inspection image obtained from the surfaces of the adjacent contact wiring lines.
    • 半导体衬底检查方法包括:产生带电粒子束,并将带电粒子束照射到其表面上形成有接触布线的半导体衬底,半导体衬底的接触布线被设计成在 平面图,使得相邻的接触布线中的一个接地到半导体基板,并且相邻的接触布线中的另一个与半导体基板绝缘; 检测从半导体衬底的表面产生的二次带电粒子,反射带电粒子和反向散射带电粒子中的至少一个,以获得信号; 产生具有信号的检查图像,检查图像显示半导体基板的表面的状态; 以及从相邻接触布线的表面获得的检查图像中的亮度差来判断半导体基板是否良好。