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1. 发明授权

US09346205B2 Optical device molding system 有权
标题翻译：光学元件成型系统
公开(公告)号：US09346205B2
公开(公告)日：2016-05-24
申请号：US12578745
申请日：2009-10-14
申请人： Shu Chuen Ho , Teng Hock Eric Kuah , Ji Yuan Hao , Ee Ling Chiw , See Yap Ong
发明人： Shu Chuen Ho , Teng Hock Eric Kuah , Ji Yuan Hao , Ee Ling Chiw , See Yap Ong
IPC分类号： B29D11/00 , B29C45/26 , B29C33/68 , B29C45/14 , B29C45/02
CPC分类号： B29C45/2608 , B29C33/68 , B29C45/02 , B29C45/14008 , B29C45/14655 , B29C45/2602 , B29D11/00807 , H01L2924/0002 , H01L2924/00
摘要： A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.
摘要翻译：在其表面上具有多个突起构件的基板通过模制系统模制，该模制系统包括第一和第二模具，其协作以将夹紧力施加到用于模制的基板上，以及位于第一模具和第二模具之间的中间板，在模制过程中夹在中间板和第一个模具之间。多个模制腔位于第二模具上，并且形成在中间板中的通孔对应于模腔的位置，使得每个通孔的尺寸和构造适于插入基板的突出构件，以使每个凸起构件与第二模具的模制空腔连通。在模塑过程中，模塑料通过模腔模塑在突起构件上。

2. 发明授权

US07927087B2 Method and apparatus for molding with reduced cull formation 有权
标题翻译：减少ull形成的成型方法和装置
公开(公告)号：US07927087B2
公开(公告)日：2011-04-19
申请号：US11052566
申请日：2005-02-07
申请人： Xiang Chen , Shu Chuen Ho , Teng Hock Eric Kuah , Si Liang Lu , See Yap Ong
发明人： Xiang Chen , Shu Chuen Ho , Teng Hock Eric Kuah , Si Liang Lu , See Yap Ong
IPC分类号： B29C45/00
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/27 , B29C45/586
摘要： An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.
摘要翻译：提供了用于在模具中模制电子装置的装置和方法，该装置包括在模具中的至少一个流道，其连接到模具供应罐，用于将模制化合物从模具供应罐引导到电子装置。还提供了一种柱塞组件，其包括主体和构造成相对于主体可移动的辅助主体。柱塞组件可定位在模具供应罐中，并且可以在朝着流道的方向上驱动，以迫使模塑料进入流道。为了避免或减少ull形，在连接流道与模具供应罐的开口处的流道宽度小于柱塞组件主体的宽度。

3. 发明申请

US20080075802A1 MEMORY CARD MOLDING APPARATUS AND PROCESS 有权
标题翻译：存储卡成型设备和工艺
公开(公告)号：US20080075802A1
公开(公告)日：2008-03-27
申请号：US11534254
申请日：2006-09-22
申请人： Lap Yu Chan , Chun Yu Li , Si Liang Lu , Teng Hock Eric Kuah
发明人： Lap Yu Chan , Chun Yu Li , Si Liang Lu , Teng Hock Eric Kuah
IPC分类号： B29C45/00 , B29C35/00
CPC分类号： B29C45/14647 , B29C45/0053 , B29C45/27
摘要： A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.
摘要翻译：一种模制系统，其被设计成用于模制基板，该基板包括多个单独的载体，每个载体被预切成存储卡装置的形状，并通过窄的连接条连接到基板的框架。模制板被构造成接收基板，并且构造成被夹持在模制板上的模腔板还包括多个模制腔，其各自构造成所述载体的形状。空腔可操作以在符合存储卡装置的形状的载体上产生模制包装，而不需要在模制之后进一步形成模塑料。此外，每个空腔的表面上的喷嘴可操作以将成型材料沿基本上垂直于放置在模制板上的基板的平面的方向引入空腔。

4. 发明授权

US07618249B2 Memory card molding apparatus and process 有权
标题翻译：存储卡成型设备和工艺
公开(公告)号：US07618249B2
公开(公告)日：2009-11-17
申请号：US11534254
申请日：2006-09-22
申请人： Lap Yu Chan , Chun Yu Li , Si Liang Lu , Teng Hock Eric Kuah
发明人： Lap Yu Chan , Chun Yu Li , Si Liang Lu , Teng Hock Eric Kuah
IPC分类号： B29C45/14
CPC分类号： B29C45/14647 , B29C45/0053 , B29C45/27
摘要： A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.
摘要翻译：一种模制系统，其被设计成用于模制基板，该基板包括多个单独的载体，每个载体被预切成存储卡装置的形状，并通过窄的连接条连接到基板的框架。模制板被构造成接收基板，并且构造成被夹持在模制板上的模腔板还包括多个模制腔，其各自构造成所述载体的形状。空腔可操作以在符合存储卡装置的形状的载体上产生模制包装，而不需要在模制之后进一步形成模塑料。此外，每个空腔的表面上的喷嘴可操作以将成型材料沿基本上垂直于放置在模制板上的基板的平面的方向引入空腔。

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