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1. 发明授权

US06934557B2 Portable type radio equipment 有权
标题翻译：便携式无线电设备
公开(公告)号：US06934557B2
公开(公告)日：2005-08-23
申请号：US10256080
申请日：2002-09-27
申请人： Shu-ichi Sekine , Takayoshi Itoh , Yuji Iseki , Naoko Ono , Keiichi Yamaguchi , Hiroyuki Kayano , Akihiro Tsujimura , Kazuhiro Inoue , Noriaki Odachi , Yasushi Murakami
发明人： Shu-ichi Sekine , Takayoshi Itoh , Yuji Iseki , Naoko Ono , Keiichi Yamaguchi , Hiroyuki Kayano , Akihiro Tsujimura , Kazuhiro Inoue , Noriaki Odachi , Yasushi Murakami
IPC分类号： H01Q1/24 , H03H7/40 , H04B1/04 , H04M1/00
CPC分类号： H03H7/40 , H01Q1/242 , H04B1/0458
摘要： In a radio equipment of portable type, the impedance of an antenna is optimized by adjusting a matching circuit which has the adjustment function and is connected to an antenna, based on a reflection phase sent back from the antenna, outputted from a reflection phase detector, and a current supplied to a transmitter-receiver which generates a transmitting signal.
摘要翻译：在便携式无线电设备中，通过基于从反射相位检测器输出的从天线发回的反射相位调整具有调整功能并连接到天线的匹配电路来优化天线的阻抗，以及提供给产生发送信号的收发器的电流。

2. 发明申请

US20050261036A1 Portable type radio equipment 审中-公开
公开(公告)号：US20050261036A1
公开(公告)日：2005-11-24
申请号：US11183009
申请日：2005-07-18
申请人： Shu-ichi Sekine , Takayoshi Itoh , Yuji Iseki , Naoko Ono , Keiichi Yamaguchi , Hiroyuki Kayano , Akihiro Tsujimura , Kazuhiro Inoue , Noriaki Odachi , Yasushi Murakami
发明人： Shu-ichi Sekine , Takayoshi Itoh , Yuji Iseki , Naoko Ono , Keiichi Yamaguchi , Hiroyuki Kayano , Akihiro Tsujimura , Kazuhiro Inoue , Noriaki Odachi , Yasushi Murakami
IPC分类号： H01Q1/24 , H03H7/40 , H04B1/04 , H04B1/46
CPC分类号： H03H7/40 , H01Q1/242 , H04B1/0458
摘要： In a radio equipment of portable type, the impedance of an antenna is optimized by adjusting a matching circuit which has the adjustment function and is connected to an antenna, based on a reflection phase sent back from the antenna, outputted from a reflection phase detector, and a current supplied to a transmitter-receiver which generates a transmitting signal.

3. 发明授权

US07623087B2 High-impedance substrate, antenna device and mobile radio device 失效
标题翻译：高阻抗基板，天线装置和移动无线电设备
公开(公告)号：US07623087B2
公开(公告)日：2009-11-24
申请号：US11950525
申请日：2007-12-05
申请人： Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
发明人： Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
IPC分类号： H01Q15/02 , H01Q15/24
CPC分类号： H01Q15/0066 , H01Q1/243 , H01Q15/008
摘要： There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.
摘要翻译：设置有高阻抗基板，包括：有限接地平面; 多个金属板，其布置在与所述有限接地平面相对的预定高度处并以矩阵图形布置，使得其各个面大致平行于所述有限接地平面; 以及多个线性导电元件，其被配置为将所述多个金属板连接到所述有限接地平面，并且其中布置在所述多个金属板中的最外周的外部金属板在所述外部金属的边缘处与所述线性导电元件连接盘子

4. 发明申请

US20090040112A1 ANTENNA APPARATUS 失效
标题翻译：天线装置
公开(公告)号：US20090040112A1
公开(公告)日：2009-02-12
申请号：US12170733
申请日：2008-07-10
申请人： Shuichi SEKINE , Kazuhiro Inoue , Makoto Higaki , Yukako Tsutsumi , Akihiro Tsujimura
发明人： Shuichi SEKINE , Kazuhiro Inoue , Makoto Higaki , Yukako Tsutsumi , Akihiro Tsujimura
IPC分类号： H01Q9/04
CPC分类号： H01Q15/008 , H01Q1/38 , H01Q9/16
摘要： There is provided with an antenna apparatus, including: a finite ground plate; a plurality of conductor plates arranged along and on both sides of a first gap line or a second gap line that intersect with the first gap line; a plurality of first linear conductive elements configured to connect the finite ground plate with each of the conductor plates; and an antenna element configured to have second and third linear conductive elements arranged in the first gap line and a feeding point that is placed between adjacent ends of the second and third linear conductive elements for supplying electric power from the ends, wherein the feeding point is positioned in an intersection area of the first gap line and the second gap line.
摘要翻译：设有天线装置，包括：有限接地板; 沿着与第一间隙线相交的第一间隙线或第二间隙线的两侧布置的多个导体板; 多个第一线性导电元件，其被配置为将所述有限接地板与每个所述导体板连接; 以及天线元件，其被配置为具有布置在所述第一间隙线中的第二和第三线性导电元件和放置在所述第二和第三线性导电元件的相邻端之间的馈电点，用于从所述端部提供电力，其中所述馈电点为位于第一间隙线和第二间隙线的交叉区域中。

5. 发明申请

US20080150825A1 HIGH-IMPEDANCE SUBSTRATE, ANTENNA DEVICE AND MOBILE RADIO DEVICE 失效
标题翻译：高阻抗衬底，天线器件和移动无线电器件
公开(公告)号：US20080150825A1
公开(公告)日：2008-06-26
申请号：US11950525
申请日：2007-12-05
申请人： Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
发明人： Makoto Higaki , Kazuhiro Inoue , Shuichi Sekine , Akihiro Tsujimura
IPC分类号： H01Q1/50 , H03H7/01
CPC分类号： H01Q15/0066 , H01Q1/243 , H01Q15/008
摘要： There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.
摘要翻译：设置有高阻抗基板，包括：有限接地平面; 多个金属板，其布置在与所述有限接地平面相对的预定高度处并以矩阵图形布置，使得其各个面大致平行于所述有限接地平面; 以及多个线性导电元件，其被配置为将所述多个金属板连接到所述有限接地平面，并且其中布置在所述多个金属板中的最外周的外部金属板在所述外部金属的边缘处与所述线性导电元件连接盘子

6. 发明授权

US07760154B2 Antenna apparatus 失效
标题翻译：天线装置
公开(公告)号：US07760154B2
公开(公告)日：2010-07-20
申请号：US12170733
申请日：2008-07-10
申请人： Shuichi Sekine , Kazuhiro Inoue , Makoto Higaki , Yukako Tsutsumi , Akihiro Tsujimura
发明人： Shuichi Sekine , Kazuhiro Inoue , Makoto Higaki , Yukako Tsutsumi , Akihiro Tsujimura
IPC分类号： H01Q9/16 , H01Q15/02 , H01Q19/10
CPC分类号： H01Q15/008 , H01Q1/38 , H01Q9/16
摘要： There is provided with an antenna apparatus, including: a finite ground plate; a plurality of conductor plates arranged along and on both sides of a first gap line or a second gap line that intersect with the first gap line; a plurality of first linear conductive elements configured to connect the finite ground plate with each of the conductor plates; and an antenna element configured to have second and third linear conductive elements arranged in the first gap line and a feeding point that is placed between adjacent ends of the second and third linear conductive elements for supplying electric power from the ends, wherein the feeding point is positioned in an intersection area of the first gap line and the second gap line.
摘要翻译：设有天线装置，包括：有限接地板; 沿着与第一间隙线相交的第一间隙线或第二间隙线的两侧布置的多个导体板; 多个第一线性导电元件，其被配置为将所述有限接地板与每个所述导体板连接; 以及天线元件，其被配置为具有布置在所述第一间隙线中的第二和第三线性导电元件和放置在所述第二和第三线性导电元件的相邻端之间的馈电点，用于从所述端部提供电力，其中所述馈电点为位于第一间隙线和第二间隙线的交叉区域中。

7. 发明授权

US08399794B2 Atmospheric pressure plasma, generating method, plasma processing method and component mounting method using same, and device using these methods 有权
标题翻译：大气压等离子体，生成方法，等离子体处理方法和使用其的部件安装方法以及使用这些方法的装置
公开(公告)号：US08399794B2
公开(公告)日：2013-03-19
申请号：US12299174
申请日：2007-05-28
申请人： Hiroyuki Tsuji , Kazuhiro Inoue
发明人： Hiroyuki Tsuji , Kazuhiro Inoue
IPC分类号： B23K10/00
CPC分类号： H01J37/32825 , H01J37/32366 , H05H1/30 , H05H1/42 , H05H1/46 , H05H2001/4667
摘要： A first inert gas (5) is supplied into a reaction space (1) and a high-frequency power supply (4) applies a high-frequency electric field so that a primary plasma (6) composed of the first inert gas which has been made into the plasma is ejected from the reaction space. A mixed gas area (10) in which a mixed gas (8) having a second inert gas (12) as a main ingredient and a proper amount of a reactive gas (13) mixed is formed. The primary plasma collides into the mixed gas area to generate a secondary plasma (11) composed of the mixed gas which has been made into the plasma, and the secondary plasma is sprayed on a processed object (S) to carry out a plasma processing. Accordingly, the plasma processing is carried out in a wide range by an atmospheric pressure plasma generated by a small input power.
摘要翻译：将第一惰性气体（5）供应到反应空间（1）中，并且高频电源（4）施加高频电场，使得由已经被第一惰性气体组成的初级等离子体（6）制成等离子体的物质从反应空间喷出。形成混合气体区域（10），其中混合有第二惰性气体（12）作为主要成分的混合气体（8）和适量的反应性气体（13）混合。初级等离子体与混合气体区域碰撞，生成由等离子体制成的混合气体构成的二次等离子体（11），将二次等离子体喷射到被处理物（S）上进行等离子体处理。因此，通过由小的输入功率产生的大气压等离子体等离子体处理在宽范围内进行。

8. 发明授权

US08334587B2 Semiconductor light emitting device with first and second leads 有权
标题翻译：具有第一和第二引线的半导体发光器件
公开(公告)号：US08334587B2
公开(公告)日：2012-12-18
申请号：US11697448
申请日：2007-04-06
申请人： Kazuhiro Inoue , Haruhiko Okazaki , Hiroyuki Nakashima
发明人： Kazuhiro Inoue , Haruhiko Okazaki , Hiroyuki Nakashima
IPC分类号： H01L23/48
CPC分类号： H01L33/62 , H01L24/05 , H01L24/48 , H01L24/49 , H01L33/483 , H01L2224/04042 , H01L2224/05 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： In at least one aspect, a semiconductor light emitting device may include a first lead, a second lead provided being apart from the first lead, a semiconductor light emitting element provided on the first lead, a wiring electrically connecting the semiconductor light emitting element and the second lead, a first resin being optically transparent to light from the semiconductor light emitting element, the first resin covering the semiconductor light emitting element, and a second resin provided on the first resin, the first lead and the second lead, and being optically transparent to light from the semiconductor light emitting element, wherein a part of the first lead which is covered with the second resin is symmetric with respect to a vertical line passing through the semiconductor light emitting element in a cross-sectional view cut along a plane, the plane passing the semiconductor light emitting element and being parallel with a direction to which the first lead is extended.
摘要翻译：在至少一个方面，半导体发光器件可以包括第一引线，与第一引线分开设置的第二引线，设置在第一引线上的半导体发光元件，将半导体发光元件和第二引线，对来自半导体发光元件的光进行光学透明化的第一树脂，覆盖半导体发光元件的第一树脂和设置在第一树脂，第一引线和第二引线上的第二树脂，并且是光学透明的从半导体发光元件发光，其中被第二树脂覆盖的第一引线的一部分相对于沿着平面切割的横截面图中相对于穿过半导体发光元件的垂直线对称，平面通过半导体发光元件并且与第一引线延伸的方向平行。

9. 发明申请

US20120132931A1 LED MODULE 有权
标题翻译： LED模块
公开(公告)号：US20120132931A1
公开(公告)日：2012-05-31
申请号：US13053525
申请日：2011-03-22
申请人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Gen Watari , Tetsuro Komatsu , Tatsuo Tonedachi
发明人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Gen Watari , Tetsuro Komatsu , Tatsuo Tonedachi
IPC分类号： H01L33/08 , H01L33/60
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.
摘要翻译：根据一个实施例，LED模块包括衬底，互连层，发光二极管（LED）封装和反射构件。互连层设置在基板上。 LED封装安装在互连层上。反射构件设置在基板中未安装LED封装的区域上，具有反射从LED封装件发出的光的性质。 LED封装包括第一引线框架，第二引线框架，LED芯片和树脂体。第一引线框架和第二引线框架在同一平面上彼此分开布置。 LED芯片设置在第一引线框架和第二引线框架的上方，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架。所述树脂体覆盖所述LED芯片，覆盖所述第一引线框架和所述第二引线框架的上表面，下表面的一部分和端面的一部分，并且暴露所述下表面的剩余部分，端面的剩余部分。

10. 外观设计

USD658606S1 Portion of a light-emitting diode 有权
公开(公告)号：USD658606S1
公开(公告)日：2012-05-01
申请号：US29381335
申请日：2010-12-17
申请人： Satoshi Shimizu , Kazuhisa Iwashita , Tatsuo Tonedachi , Kazuhiro Inoue , Teruo Takeuchi
设计人： Satoshi Shimizu , Kazuhisa Iwashita , Tatsuo Tonedachi , Kazuhiro Inoue , Teruo Takeuchi

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