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    • 7. 发明授权
    • Memory element and memory apparatus
    • 存储器元件和存储器件
    • US09484528B2
    • 2016-11-01
    • US15095553
    • 2016-04-11
    • Sony Corporation
    • Yutaka HigoMasanori HosomiHiroyuki OhmoriKazuhiro BesshoTetsuya AsayamaKazutaka YamaneHiroyuki Uchida
    • H01L29/82H01L43/10H01L43/08G11C11/16
    • H01L43/10G11C11/161H01L27/222H01L27/228H01L29/82H01L43/08
    • A memory element includes a layered structure: a memory layer having a magnetization direction changed depending on information, the magnetization direction being changed by applying a current in a lamination direction of the layered structure to record the information in the memory layer, including a first ferromagnetic layer having a magnetization direction that is inclined from a direction perpendicular to a film face, a bonding layer laminated on the first ferromagnetic layer, and a second ferromagnetic layer laminated on the bonding layer and bonded to the first ferromagnetic layer via the bonding layer, having a magnetization direction that is inclined from the direction perpendicular to the film face, a magnetization-fixed layer having a fixed magnetization direction, an intermediate layer that is provided between the memory layer and the magnetization-fixed layer, and is contacted with the first ferromagnetic layer, and a cap layer that is contacted with the second ferromagnetic layer.
    • 存储元件包括分层结构:具有根据信息改变的磁化方向的存储层,通过在分层结构的层叠方向施加电流来改变磁化方向,以将信息记录在存储层中,该信息包括第一铁磁 层,其具有从垂直于膜面的方向倾斜的磁化方向,层压在所述第一铁磁层上的接合层和层压在所述接合层上并通过所述接合层接合到所述第一铁磁性层的第二铁磁层, 从垂直于膜面的方向倾斜的磁化方向,具有固定的磁化方向的磁化固定层,设置在存储层和磁化固定层之间的中间层,并与第一铁磁体 层和与第二铁磁体接触的盖层 c层。