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1. 发明申请

US20230080778A1 CAMERA MODULE 有权
公开(公告)号：US20230080778A1
公开(公告)日：2023-03-16
申请号：US17799244
申请日：2021-02-10
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki
IPC分类号： B60R11/04 , G02B7/02 , G03B17/02
摘要： A camera module includes a housing, a barrel member, a sensor board, and a metallic shield case. The housing includes a first case that includes an opening, and a second case that is joined to the first case. The barrel member is arranged in the first case, and includes a barrel that is fitted into the opening in an optical-axis direction. The sensor board is arranged in the housing and includes an imaging device that faces the barrel member. The shield case is arranged between the barrel member and the second case. The shield case includes a peripheral wall portion that covers around the sensor element, and an elastic part that is provided to an end of the peripheral wall portion and biases the barrel member toward the opening. The elastic part includes a control portion that controls approach of the barrel member to the second case such that the barrel member is at a distance greater than or equal to a specified distance from the second case.

2. 发明授权

US11119389B2 Image-capturing apparatus and housing component 有权
公开(公告)号：US11119389B2
公开(公告)日：2021-09-14
申请号：US16964575
申请日：2018-11-20
申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
发明人： Hirofumi Owaki
IPC分类号： G03B17/08 , H04N5/225 , B60R11/04
摘要： An image-capturing apparatus according to an embodiment of the present technology includes a first case, a second case, a connection mechanism, and an elastic member. The first case includes a first pressing surface. The second case includes a second pressing surface arranged to face the first pressing surface, and is connected to the first case. The connection mechanism is capable of connecting the first and second cases. The elastic member includes a first contact portion and a second contact portion in at least some of cross-sections of the elastic member, the first contact portion being brought into contact with the first pressing surface, the second contact portion being brought into contact with the second pressing surface, the elastic member including a plurality of the second contact portions, the elastic member hermetically sealing a space between the first and second pressing surfaces.

3. 发明申请

US20230116237A1 SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULE 有权
公开(公告)号：US20230116237A1
公开(公告)日：2023-04-13
申请号：US17798053
申请日：2021-02-10
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki
IPC分类号： H04N23/51 , G01S7/481
摘要： A sensor module according to an embodiment of the present technology includes a sensor element, a first casing, a bracket, and a second casing. The first casing includes an opening end and accommodates therein the sensor element. The bracket fixes the first casing to an attachment target. The second casing includes a first surface that includes a first welding portion welded to the opening end, and a second surface that includes a second welding portion welded to the bracket, the second casing being fixed between the first casing and the bracket.

4. 发明申请

US20230008374A1 CAMERA MODULE, SPACER COMPONENT, AND METHOD FOR PRODUCING CAMERA MODULE 有权
公开(公告)号：US20230008374A1
公开(公告)日：2023-01-12
申请号：US17785013
申请日：2020-12-11
申请人： Sony Semiconductor Solutions Corporation Corporation
发明人： Hirofumi Owaki
IPC分类号： H04N5/225 , H05K1/02 , H01R12/71 , H05K13/00
摘要： A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

5. 发明授权

US11930258B2 Camera module, spacer component, and method for producing camera module 有权
公开(公告)号：US11930258B2
公开(公告)日：2024-03-12
申请号：US17785013
申请日：2020-12-11
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki
IPC分类号： H04N5/335 , H01R12/71 , H04N23/52 , H04N23/54 , H05K1/02 , H05K13/00
CPC分类号： H04N23/52 , H01R12/716 , H04N23/54 , H05K1/0209 , H05K13/0015 , H01R2201/18 , H05K2201/042 , H05K2201/10121 , H05K2201/1059
摘要： A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

6. 发明公开

US20240027236A1 SENSOR MODULE 审中-公开
公开(公告)号：US20240027236A1
公开(公告)日：2024-01-25
申请号：US18039199
申请日：2021-11-10
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki
IPC分类号： G01D11/24 , B29C65/16
CPC分类号： G01D11/245 , B29C65/1635
摘要： [Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components.
[Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.

7. 发明授权

US11152726B2 Connector device and connector system 有权
公开(公告)号：US11152726B2
公开(公告)日：2021-10-19
申请号：US16617815
申请日：2018-05-23
申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
发明人： Hirofumi Owaki
IPC分类号： H01R12/71 , H04N5/225
摘要： The present technology relates to a connector device and a connector system capable of achieving reduction in manufacturing cost. Provided is a connector device including a first contact used in actual use, and a second contact used only in manufacturing, in which the first contact and the second contact have different core lengths in a case of being viewed from a connection target side. The present technology can be applied to a camera device electrically connected to a vehicle connector, for example.

8. 发明授权

US11830104B2 Image processing apparatus, camera system, and image processing method for superimposing an image representing a part of a vehicle body 有权
公开(公告)号：US11830104B2
公开(公告)日：2023-11-28
申请号：US17293860
申请日：2019-11-21
申请人： Sony Semiconductor Solutions Corporation
发明人： Yutaro Yamashita , Hirofumi Owaki , Takuya Yamaguchi
IPC分类号： G06T11/00 , B60R1/25 , B60R1/24 , B60R1/26 , G06T3/60
CPC分类号： G06T11/00 , B60R1/24 , B60R1/25 , B60R1/26 , G06T3/60 , B60R2300/304 , G06T2210/22
摘要： An image processing apparatus includes a first signal processing unit for generating a first image of a first angle of view from an image captured by a camera attached to a vehicle body, and an image superimposing unit for superimposing an image representing a part of the vehicle body on the first image.

9. 发明申请

US20230071961A1 SENSOR MODULE 有权
公开(公告)号：US20230071961A1
公开(公告)日：2023-03-09
申请号：US17799231
申请日：2021-02-10
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki , Tomonori Agawa , Kunihiko Togano , Hiroo Suzuki
IPC分类号： H04N5/225 , H05K9/00
摘要： A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

10. 发明申请

US20220084257A1 IMAGE PROCESSING APPARATUS, CAMERA SYSTEM, AND IMAGE PROCESSING METHOD 有权
公开(公告)号：US20220084257A1
公开(公告)日：2022-03-17
申请号：US17293860
申请日：2019-11-21
申请人： Sony Semiconductor Solutions Corporation
发明人： Yutaro Yamashita , Hirofumi Owaki , Takuya Yamaguchi
IPC分类号： G06T11/00 , G06T3/60 , B60R1/26 , B60R1/24 , B60R1/25
摘要： An image processing apparatus includes a first signal processing unit for generating a first image of a first angle of view from an image captured by a camera attached to a vehicle body, and an image superimposing unit for superimposing an image representing a part of the vehicle body on the first image.

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