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1. 发明授权

US09661751B2 Power semiconductor module arrangement 有权
公开(公告)号：US09661751B2
公开(公告)日：2017-05-23
申请号：US15005345
申请日：2016-01-25
申请人： Infineon Technologies AG
发明人： Reinhold Bayerer
IPC分类号： H05K1/14 , H01L25/16 , H05K1/02 , H05K1/18
CPC分类号： H05K1/142 , H01L25/162 , H01L2924/0002 , H05K1/0262 , H05K1/144 , H05K1/145 , H05K1/181 , H05K2201/04 , H05K2201/10166 , H05K2201/10303 , H05K2201/10318 , H05K2201/1059 , H01L2924/00
摘要： A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.

2. 发明申请

US20170142857A1 UNGROUNDED INVERTER ENCLOSURE AND CABLING 审中-公开
公开(公告)号：US20170142857A1
公开(公告)日：2017-05-18
申请号：US15420853
申请日：2017-01-31
申请人： Enphase Energy, Inc.
发明人： Ryan Linderman
IPC分类号： H05K7/14 , H02M7/44 , H05K1/18 , H01R13/642 , H05K1/11 , H02M7/00 , H05K5/00
CPC分类号： H05K7/1432 , H01R13/642 , H02M7/003 , H02M7/44 , H05K1/116 , H05K1/181 , H05K5/0065 , H05K2201/10272 , H05K2201/10356 , H05K2201/1059
摘要： A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output.

3. 发明申请

US20160364019A1 HANDHELD OPERATION DEVICE 审中-公开
标题翻译：手持操作装置
公开(公告)号：US20160364019A1
公开(公告)日：2016-12-15
申请号：US14736274
申请日：2015-06-11
申请人： COOLER MASTER TECHNOLOGY INC.
发明人： Yu-hsun Cheng
IPC分类号： G06F3/0354
CPC分类号： G06F3/0362 , H05K3/301 , H05K2201/10325 , H05K2201/1059 , H05K2203/167 , H05K2203/176
摘要： A handheld operation device includes a casing, a circuit board, a socket, an encoder and a roller. The circuit board is disposed in the casing. The socket is disposed on the circuit board. The encoder is detachably disposed in the socket. The roller is rotatably connected to the encoder and exposed out of the casing. Since the encoder is detachably disposed in the socket, a user can detach the encoder from the socket directly without using any tools.
摘要翻译：手持操作装置包括壳体，电路板，插座，编码器和滚子。电路板设置在壳体中。插座设在电路板上。编码器可拆卸地设置在插座中。滚轮可旋转地连接到编码器，并露出外壳。由于编码器可拆卸地设置在插座中，因此用户可以直接从编码器脱离编码器而不使用任何工具。

4. 发明申请

US20160338191A1 CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD 有权
标题翻译：电路板，电子设备及制造电路板的方法
公开(公告)号：US20160338191A1
公开(公告)日：2016-11-17
申请号：US15096680
申请日：2016-04-12
申请人： FUJITSU LIMITED
发明人： Megumi TANAKA , Daisuke USUI
IPC分类号： H05K1/02 , H05K3/00 , H01R12/71 , H05K1/11
CPC分类号： H05K1/0251 , H01R12/585 , H01R12/7082 , H01R12/737 , H05K1/115 , H05K1/142 , H05K3/0047 , H05K3/429 , H05K2201/09545 , H05K2201/096 , H05K2201/10189 , H05K2201/10303 , H05K2201/1059 , H05K2203/0207 , H05K2203/1476
摘要： A circuit board includes: a first surface and a second surface opposite to the first surface; a through hole extending between the first surface and the second surface; a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and a wire connected to the conductor, wherein a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.
摘要翻译：电路板包括：与第一表面相对的第一表面和第二表面; 在所述第一表面和所述第二表面之间延伸的通孔; 覆盖所述通孔的内壁表面的导体，所述导体的第一端和第二端终止于所述通孔内; 以及连接到所述导体的导线，其中，所述导体与所述导体与所述导体中插入到所述通孔中的连接器针与所述导体的第一端接触的接触部的长度和从所述导体的导线连接部的长度连接到导体的导线的第二端是0.5mm以下。

5. 发明申请

US20160113128A1 PIN TO PCB CONNECTION STRUCTURE AND METHOD 有权
标题翻译： PIN到PCB连接结构和方法
公开(公告)号：US20160113128A1
公开(公告)日：2016-04-21
申请号：US14515152
申请日：2014-10-15
申请人： Continental Automotive Systems, Inc.
发明人： Jennifer L. Matoy
IPC分类号： H05K5/00
CPC分类号： H05K5/0069 , H01R12/55 , H01R12/58 , H05K3/325 , H05K3/403 , H05K2201/09181 , H05K2201/1034 , H05K2201/10446 , H05K2201/1059
摘要： A printed circuit board assembly includes a printed circuit board (PCB) having an end. The end includes surfaces defining a plurality of electrically conductive notches therein. A plurality of electrically conductive pins is provided with each pin being received in an associated notch in a press-fitted manner so as to make electrical connection with the PCB.
摘要翻译：印刷电路板组件包括具有端部的印刷电路板（PCB）。端部包括在其中限定多个导电凹口的表面。多个导电销设置有每个销以压配合方式容纳在相关联的切口中，以便与PCB电连接。

6. 发明授权

US09215809B2 Contact bumps methods of making contact bumps 有权
标题翻译：接触凸块的触点方法
公开(公告)号：US09215809B2
公开(公告)日：2015-12-15
申请号：US14094714
申请日：2013-12-02
申请人： SMARTRAC TECHNOLOGY GmbH
发明人： Carsten Nieland , Frank Kriebel
IPC分类号： H01L23/48 , H05K1/18 , H01L21/768 , H01L23/498 , H05K3/30 , H01L23/00
CPC分类号： H05K1/18 , G06K19/077 , H01L21/76885 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/11462 , H01L2224/11464 , H01L2224/1161 , H01L2224/11622 , H01L2224/1182 , H01L2224/13006 , H01L2224/13011 , H01L2224/13012 , H01L2224/13014 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13599 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81206 , H01L2224/81345 , H01L2224/81385 , H01L2224/814 , H01L2224/8149 , H01L2224/81898 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2924/00014 , H05K3/301 , H05K3/325 , H05K2201/1059 , H05K2201/10674 , H05K2201/10954 , H05K2203/0278 , H05K2203/041 , Y10T29/49018 , Y10T29/4913 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2224/05552 , H01L2924/014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01082 , H01L2924/0105 , H01L2924/01047 , H01L2224/03
摘要： Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.
摘要翻译：接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的凹部和凸起。接触凸块和接触垫之间的不规则配合表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。

7. 发明授权

US09131632B2 Relief plug-in connector and multilayer circuit board 有权
标题翻译：浮雕插入式连接器和多层电路板
公开(公告)号：US09131632B2
公开(公告)日：2015-09-08
申请号：US13514347
申请日：2010-12-03
申请人： Roland Moedinger
发明人： Roland Moedinger
IPC分类号： H01R12/00 , H05K3/30 , H01R12/58 , H01R12/72 , H01R13/6587 , H05K1/02
CPC分类号： H05K3/308 , H01R12/585 , H01R12/724 , H01R13/6587 , H05K1/0245 , H05K1/0251 , H05K2201/09845 , H05K2201/10189 , H05K2201/10401 , H05K2201/1059 , H05K2203/0242 , Y10T29/49126
摘要： A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.
摘要翻译：多极释放插入式连接器包括接触元件，其接触部分布置在高度偏移的接触区域表面中，并且多层电路板相应地包括多个高度偏移的接触面积表面。组合在一起，多极释放插入式连接器接触多层电路板，并且多层电路板填充多极释放插入式连接器。泄压插入式连接器的接触元件设计在接触部分中，作为用于压入多层电路板的压入接触部分的压入触头。多层电路板的接触元件接收部分布置在多层电路板的接触区域表面中，接触元件接收部分被设计成压入接触部分。生产方法生产多层电路板。

8. 发明申请

US20150250059A1 METHOD FOR MANUFACTURING A CIRCUIT BOARD SYSTEM WITH MECHANICAL PROTECTION 审中-公开
标题翻译：用于制造具有机械保护的电路板系统的方法
公开(公告)号：US20150250059A1
公开(公告)日：2015-09-03
申请号：US14715627
申请日：2015-05-19
申请人： TELLABS OY
发明人： Antti HOLMA , Peter KOKKO
IPC分类号： H05K3/30 , H05K3/22
CPC分类号： H05K3/303 , H05K1/02 , H05K3/22 , H05K3/222 , H05K3/30 , H05K3/306 , H05K2201/09972 , H05K2201/10189 , H05K2201/10303 , H05K2201/10363 , H05K2201/1059 , H05K2201/2018 , H05K2203/162 , Y10T29/49004 , Y10T29/4913
摘要： A method for manufacturing a circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. Furthermore, the protection element provides electrical connections between functional entities of the circuit board system.
摘要翻译：提出了一种用于制造包括电气部件的机械保护的电路板系统的方法。电路板系统包括配备有电气部件（103-111）的电路板（101）和附接到电路板的没有电气部件的区域的保护元件（102）。保护元件在垂直于电路板的方向上具有厚度，并且其形状使得电子部件在垂直于电路板的方向上未被屏蔽。因此，保护元件构成保护电气元件的障碍物，但是仍然允许例如在飞行探针测试中从垂直于电路板的方向访问电气部件。此外，保护元件在电路板系统的功能实体之间提供电连接。

9. 发明申请

US20150114706A1 CIRCUIT BOARD VIA CONFIGURATIONS FOR HIGH FREQUENCY SIGNALING 有权
标题翻译：电路板通过高频信号配置
公开(公告)号：US20150114706A1
公开(公告)日：2015-04-30
申请号：US14511397
申请日：2014-10-10
申请人： Curtiss-Wright Controls, Inc.
发明人： Michael Rose , Robert Sullivan
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
摘要： A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
摘要翻译：电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。

10. 发明授权

US08974094B2 Device and method for coupling a light source to a printed circuit board in lamps 有权
标题翻译：用于将光源耦合到灯中的印刷电路板的装置和方法
公开(公告)号：US08974094B2
公开(公告)日：2015-03-10
申请号：US13778488
申请日：2013-02-27
申请人： General Electric Company
发明人： Tamás Vásárhelyi , József Fülöp , Tímea Seszták , Zsolt Bagoly , Jácint Gergely
IPC分类号： F21V19/00 , F21K99/00 , F21V23/00 , H05K1/00 , H01R12/51
CPC分类号： F21K9/90 , F21V23/004 , H01R12/515 , H05K1/00 , H05K1/117 , H05K2201/09027 , H05K2201/09163 , H05K2201/1059 , Y10T29/49117 , Y10T29/49155
摘要： A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface. The head portions include a slot. The lamp includes a light source with at least two external lead-in wires. The lead-in wires are located within respective slots and are mechanically coupled to respective surfaces of the slots in a press-fit manner which may be free of wrapping, winding, twisting, or soldering. A PCB disposed inside the lamp has two opposing surfaces and a rim between the two opposing surfaces. There are conductive surfaces disposed on at least one of the rim and one of the opposing surfaces at positions corresponding to connection pin slots. The PCB is located between connection pins with the conductive surfaces in electrical communication with the lead-in wires.
摘要翻译：灯包括具有内表面和外表面的套环，其中两个或多个连接销从套环的内表面延伸。至少两个连接销具有远离套环内表面的头部。头部包括槽。该灯包括具有至少两个外部引入线的光源。引入线位于相应的槽内，并且以压配合的方式机械地联接到槽的相应表面，压配合方式可以没有包裹，缠绕，扭转或焊接。布置在灯内的PCB具有两个相对的表面和两个相对表面之间的边缘。在对应于连接销槽的位置处，设置在轮辋和相对表面中的至少一个上的导电表面。 PCB位于连接引脚之间，导电表面与引入线电连通。

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