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1. 发明授权

US09257384B2 Integrated circuit packaging system with substrate and method of manufacture thereof 有权
标题翻译：具有基板的集成电路封装系统及其制造方法
公开(公告)号：US09257384B2
公开(公告)日：2016-02-09
申请号：US13488812
申请日：2012-06-05
申请人： Soohan Park , Sung Jun Yoon
发明人： Soohan Park , Sung Jun Yoon
IPC分类号： H01L29/66 , H01L23/498 , H01L23/00 , H01L21/56
CPC分类号： H01L23/49833 , H01L21/563 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/92 , H01L2224/97 , H01L2924/381 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2924/15311 , H01L21/78 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a stack substrate over the base substrate with an inter-substrate connector directly on the stack substrate and the base substrate, the inter-substrate connector having an inter-substrate connector pitch; mounting an integrated circuit over the stack substrate, the integrated circuit having an internal connector directly on the stack substrate; and attaching an external connector directly on the base substrate, the external connector having an external connector pitch greater than the inter-substrate connector pitch.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供基底; 将基板上的堆叠基板直接安装在基板与基板之间，基板间连接器具有基板间连接器间距; 将集成电路安装在所述堆叠衬底上，所述集成电路具有直接在所述堆叠衬底上的内部连接器; 并且将外部连接器直接连接到基底基板上，该外部连接器具有大于基板间连接器间距的外部连接器间距。

2. 发明申请

US20130320566A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有基板的集成电路包装系统及其制造方法
公开(公告)号：US20130320566A1
公开(公告)日：2013-12-05
申请号：US13488812
申请日：2012-06-05
申请人： Soohan Park , Sung Jun Yoon
发明人： Soohan Park , Sung Jun Yoon
IPC分类号： H01L23/538 , H01L21/58
CPC分类号： H01L23/49833 , H01L21/563 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/92 , H01L2224/97 , H01L2924/381 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2924/15311 , H01L21/78 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a stack substrate over the base substrate with an inter-substrate connector directly on the stack substrate and the base substrate, the inter-substrate connector having an inter-substrate connector pitch; mounting an integrated circuit over the stack substrate, the integrated circuit having an internal connector directly on the stack substrate; and attaching an external connector directly on the base substrate, the external connector having an external connector pitch greater than the inter-substrate connector pitch.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供基底; 将基板上的堆叠基板直接安装在基板与基板之间，基板间连接器具有基板间连接器间距; 将集成电路安装在所述堆叠衬底上，所述集成电路具有直接在所述堆叠衬底上的内部连接器; 并且将外部连接器直接连接到基底基板上，该外部连接器具有大于基板间连接器间距的外部连接器间距。

3. 发明授权

US08569870B1 Integrated circuit packaging system with shielding spacer and method of manufacture thereof 有权
标题翻译：具有屏蔽间隔物的集成电路封装系统及其制造方法
公开(公告)号：US08569870B1
公开(公告)日：2013-10-29
申请号：US13531941
申请日：2012-06-25
申请人： SinJae Lee , JongVin Park , Sung Jun Yoon , JiHoon Oh
发明人： SinJae Lee , JongVin Park , Sung Jun Yoon , JiHoon Oh
IPC分类号： H01L21/44
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/4334 , H01L24/48 , H01L25/0657 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2225/06589 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供基板; 在基板上安装底部集成电路; 连接底部集成电路和衬底之间的底部互连; 并且在底部集成电路上方安装底部屏蔽间隔件，并且底部屏蔽隔离件包括底部集成电路上方的底部屏蔽板，从底部屏蔽脚延伸并连接到底部屏蔽板的底部屏蔽柱，以及突出部在底部屏蔽柱上方垂直延伸并直接在底部屏蔽脚的上方延伸。

4. 发明授权

US08559480B2 Apparatus and method for generating scrambling codes in a radio communication system 有权
标题翻译：一种用于在无线电通信系统中产生扰码的装置和方法
公开(公告)号：US08559480B2
公开(公告)日：2013-10-15
申请号：US13143688
申请日：2010-01-15
申请人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
发明人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
IPC分类号： H04B1/00
CPC分类号： H04J13/10 , G06F7/584 , H04J13/0029 , H04J13/102
摘要： An apparatus and method for generating a scrambling code in a radio communication system is disclosed. In particular, an apparatus and method for generating a scrambling code using a Gold-like sequence even when m is a multiple of 4 for a length 2m−1 of a pseudo-random sequence is disclosed. Two LFSRs (LFSR a and LFSR a′) for generating the Gold-like sequence by two different polynomials of degree m are included. The LFSR a′ is constructed by a reciprocal primitive polynomial of the primitive polynomial of degree m over GF(2) used to construct the LFSR a. In order to generate 2m different scrambling codes, one fixed initial value is input to the LFSR a and different initial values of m bits are input to the LFSR a′ according to system-specific information.
摘要翻译：公开了一种用于在无线电通信系统中产生扰码的装置和方法。具体地，公开了即使在伪随机序列的长度2m-1的m为m的倍数时也使用Gold类序列来生成扰码的装置和方法。包括用于通过两个不同的m度多项式产生Gold状序列的两个LFSR（LFSR a和LFSR a'）。 LFSR a'由用于构造LFSR a的GF（2）上的m度的原始多项式的互逆原始多项式构成。为了产生2m个不同的扰码，根据系统特定的信息，将一个固定的初始值输入到LFSR a，并且将m个比特的不同初始值输入到LFSR a'。

5. 发明申请

US20120082785A1 BIAXIALLY ORIENTED POLYESTER FILM AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：双面聚酯薄膜及其制备方法
公开(公告)号：US20120082785A1
公开(公告)日：2012-04-05
申请号：US13376931
申请日：2010-06-09
申请人： Nam Ill Kim , Soo Hee Kim , Sung Jun Yoon
发明人： Nam Ill Kim , Soo Hee Kim , Sung Jun Yoon
IPC分类号： B05D7/24 , C08L67/02 , C08K5/3475 , B29C47/88 , C08K5/132 , C08G63/189 , C08G63/672 , C08G63/183 , C08K5/17
CPC分类号： C08L67/02 , B29C48/08 , B29C48/914 , C08G63/181 , C08J5/18 , C08J2367/02 , C08K5/132 , C08K5/34 , H01L31/049 , Y02E10/50
摘要： A back sheet for a solar cell, consisting of a polyester comprising at least one repeating unit of trimethylene naphthalate and trimethylene terephthalate in an amount of 85% by weight or more, has improved hydrolysis-resistance and is useful in the field requiring weatherability.
摘要翻译：用于太阳能电池的背板由包含至少一种萘二甲酸丙二醇酯和三亚甲基对苯二甲酸酯的重复单元的聚酯组成，其量为85重量％以上，具有改善的耐水解性，并且在需要耐候性的领域中是有用的。

6. 发明申请

US20100135493A1 METHOD AND APPARATUS FOR GENERATING PSEUDO RANDOM SEQUENCE IN BROADBAND WIRELESS COMMUNICATION SYSTEM 有权
标题翻译：用于在无线通信系统中生成PSEUDO随机序列的方法和装置
公开(公告)号：US20100135493A1
公开(公告)日：2010-06-03
申请号：US12629570
申请日：2009-12-02
申请人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
发明人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
IPC分类号： H04L9/22
CPC分类号： H04L9/0662 , G06F7/584 , H04L2209/34 , H04L2209/80
摘要： Provided are a method and an apparatus for generating pseudo random sequence to generate pseudo random sequences which have larger sizes and are different from each other in a wireless communication system; a method for generating pseudo random sequence in a wireless communication system, comprising generating a first output sequence, generating a second output sequence, and generating a third output sequence; and an apparatus to generate pseudo random sequence in a wireless communication system, comprising a first linear feedback shift register (LFSR), a second LSFR, and a third LFSR, a first initial value mapper, a second initial value mapper, a third initial value mapper, and an N delay operator.
摘要翻译：提供一种用于生成伪随机序列以在无线通信系统中生成具有更大尺寸并且彼此不同的伪随机序列的方法和装置; 一种用于在无线通信系统中生成伪随机序列的方法，包括：生成第一输出序列，产生第二输出序列，以及生成第三输出序列; 以及在无线通信系统中产生伪随机序列的装置，包括第一线性反馈移位寄存器（LFSR），第二LSFR和第三LFSR，第一初始值映射器，第二初始值映射器，第三初始值映射器和N延迟算子。

7. 发明授权

US09236993B2 Method and apparatus for transmitting a reference signal in a wireless communication system 有权
标题翻译：用于在无线通信系统中发送参考信号的方法和装置
公开(公告)号：US09236993B2
公开(公告)日：2016-01-12
申请号：US14234086
申请日：2012-07-25
申请人： Sung Jun Yoon , Jian Jun Li , Kyoung Min Park
发明人： Sung Jun Yoon , Jian Jun Li , Kyoung Min Park
IPC分类号： H04W4/00 , H04L5/00 , H04J11/00 , H04B7/02
CPC分类号： H04L5/0053 , H04B7/024 , H04J11/0053 , H04L5/0007 , H04L5/0035 , H04L5/005
摘要： Provided is a method and apparatus for transmitting a reference signal by a base station in a multi-cell cooperative communication environment. The method for transmitting the reference signal according to the present invention comprises the steps of: transmitting cell ID information of a second cell to a terminal which uses a first cell as a serving cell; generating reference signal sequences in the first cell and the second cell on the basis of the same cell ID; and performing resource element mapping on each of the generated reference signals, generating signals, and transmitting the signals to the terminal, wherein the same cell ID used in generating the reference signal sequences is a cell ID of the first cell or a cell ID of the second cell.
摘要翻译：提供了一种用于在多小区协作通信环境中由基站发送参考信号的方法和装置。根据本发明的用于发送参考信号的方法包括以下步骤：将第二小区的小区ID信息发送到使用第一小区作为服务小区的终端; 基于相同的小区ID在第一小区和第二小区中生成参考信号序列; 并且对所生成的参考信号中的每一个进行资源元素映射，生成信号，并将该信号发送到终端，其中，用于生成参考信号序列的相同小区ID是第一小区的小区ID或者第一小区的小区ID 第二个细胞。

8. 发明申请

US20110274193A1 APPARATUS AND METHOD FOR GENERATING SCRAMBLING CODES IN A RADIO COMMUNICATION SYSTEM 有权
标题翻译：用于在无线电通信系统中生成SCRAMBLING代码的装置和方法
公开(公告)号：US20110274193A1
公开(公告)日：2011-11-10
申请号：US13143688
申请日：2010-01-15
申请人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
发明人： Sung Jun Yoon , Sung Jin Suh , Myung Cheul Jung
IPC分类号： H04L27/28
CPC分类号： H04J13/10 , G06F7/584 , H04J13/0029 , H04J13/102
摘要： An apparatus and method for generating a scrambling code in a radio communication system is disclosed. In particular, an apparatus and method for generating a scrambling code using a Gold-like sequence even when m is a multiple of 4 for a length 2m−1 of a pseudo-random sequence is disclosed. Two LFSRs (LFSR a and LFSR a′) for generating the Gold-like sequence by two different polynomials of degree m are included. The LFSR a′ is constructed by a reciprocal primitive polynomial of the primitive polynomial of degree m over GF(2) used to construct the LFSR a. In order to generate 2m different scrambling codes, one fixed initial value is input to the LFSR a and different initial values of m bits are input to the LFSR a′ according to system-specific information.
摘要翻译：公开了一种用于在无线电通信系统中产生扰码的装置和方法。具体地，公开了即使在伪随机序列的长度2m-1的m为m的倍数时也使用Gold类序列来生成扰码的装置和方法。包括用于通过两个不同的m度多项式产生Gold状序列的两个LFSR（LFSR a和LFSR a'）。 LFSR a'由用于构造LFSR a的GF（2）上的m度的原始多项式的互逆原始多项式构成。为了产生2m个不同的扰码，根据系统特定的信息，将一个固定的初始值输入到LFSR a，并且将m个比特的不同初始值输入到LFSR a'。

9. 发明授权

US08709932B2 Integrated circuit packaging system with interconnects and method of manufacture thereof 有权
标题翻译：具有互连的集成电路封装系统及其制造方法
公开(公告)号：US08709932B2
公开(公告)日：2014-04-29
申请号：US12966071
申请日：2010-12-13
申请人： Soo Won Lee , JiHoon Oh , Sung Jun Yoon
发明人： Soo Won Lee , JiHoon Oh , Sung Jun Yoon
IPC分类号： H01L21/44 , H01L21/00 , H01L23/02
CPC分类号： H01L23/49816 , H01L21/563 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/00 , H01L2224/05639 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供具有接触焊盘的载体; 在所述载体和所述接触焊盘上形成具有第一抗蚀剂开口的第一抗蚀剂层，所述第一抗蚀剂开口部分地暴露所述第一接触焊盘; 形成第二抗蚀剂层，在所述第一抗蚀剂开口上具有第二抗蚀剂开口，所述第二抗蚀剂开口部分地暴露所述第一抗蚀剂层; 在载体上安装集成电路; 以及在所述集成电路和所述载体之间形成内部互连，所述内部互连件在所述第二抗蚀剂开口中的所述第二抗蚀剂层之间没有空间填充所述第二抗蚀剂开口。

10. 发明申请

US20120146230A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有互连的集成电路包装系统及其制造方法
公开(公告)号：US20120146230A1
公开(公告)日：2012-06-14
申请号：US12966071
申请日：2010-12-13
申请人： Soo Won Lee , JiHoon Oh , Sung Jun Yoon
发明人： Soo Won Lee , JiHoon Oh , Sung Jun Yoon
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L23/49816 , H01L21/563 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/00 , H01L2224/05639 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供具有接触焊盘的载体; 在所述载体和所述接触焊盘上形成具有第一抗蚀剂开口的第一抗蚀剂层，所述第一抗蚀剂开口部分地暴露所述第一接触焊盘; 形成第二抗蚀剂层，在所述第一抗蚀剂开口上具有第二抗蚀剂开口，所述第二抗蚀剂开口部分地暴露所述第一抗蚀剂层; 在载体上安装集成电路; 以及在所述集成电路和所述载体之间形成内部互连，所述内部互连件在所述第二抗蚀剂开口中的所述第二抗蚀剂层之间没有空间填充所述第二抗蚀剂开口。

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