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1. 发明申请

US20070011574A1 Memory device 有权
标题翻译：内存设备
公开(公告)号：US20070011574A1
公开(公告)日：2007-01-11
申请号：US11151650
申请日：2005-06-14
申请人： Christian Weiss , Sven Kalms , Hermann Ruckerbauer
发明人： Christian Weiss , Sven Kalms , Hermann Ruckerbauer
IPC分类号： G11C29/00
CPC分类号： G06F11/1008 , G11C5/04
摘要： A memory device includes at least two DRAM memory modules, at least one external ECC module, and a memory controller. The external ECC module provides the memory modules with ECC functionality. Each memory module is connected to the memory controller via a respective memory channel. The external ECC modules are connected to the memory controller via a common ECC channel. Each external ECC module is assigned to a group of the memory modules. The memory modules of one group with respective ECC modules are synchronously operated by the memory controller.
摘要翻译：存储器件包括至少两个DRAM存储器模块，至少一个外部ECC模块和存储器控制器。外部ECC模块为内存模块提供ECC功能。每个存储器模块通过相应的存储器通道连接到存储器控制器。外部ECC模块通过公共ECC通道连接到存储器控制器。每个外部ECC模块分配给一组内存模块。具有相应ECC模块的一组存储器模块由存储器控制器同步操作。

2. 发明申请

US20090080151A1 HEAT TRANSFER SYSTEM 有权
标题翻译：换热系统
公开(公告)号：US20090080151A1
公开(公告)日：2009-03-26
申请号：US12201524
申请日：2008-08-29
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： H05K5/00 , H05K1/00
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
摘要翻译：存储器模块包括具有第一和第二侧的电路板，其中存储器芯片至少布置在第一侧上。在第一侧上布置有纵向延伸的模块导热体。模块导热体包括接触表面，其被配置为接触传热系统。

3. 发明申请

US20120314363A1 HEAT TRANSFER SYSTEM 有权
标题翻译：换热系统
公开(公告)号：US20120314363A1
公开(公告)日：2012-12-13
申请号：US13568968
申请日：2012-08-07
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： G06F1/20
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
摘要翻译：存储器模块包括具有第一和第二侧的电路板，其中存储器芯片至少布置在第一侧上。在第一侧上布置有纵向延伸的模块导热体。模块导热体包括接触表面，其被配置为接触传热系统。

4. 发明授权

US08238101B2 Heat transfer system for memory modules 有权
标题翻译：内存模块传热系统
公开(公告)号：US08238101B2
公开(公告)日：2012-08-07
申请号：US12201524
申请日：2008-08-29
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34 , H01R13/62
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
摘要翻译：存储器模块包括具有第一和第二侧的电路板，其中存储器芯片至少布置在第一侧上。第一侧布置有纵向延伸的模块导热体。模块导热体包括接触表面，其被配置为接触传热系统。

5. 发明授权

US08094654B2 Information transfer in electronic modules 有权
标题翻译：电子模块中的信息传输
公开(公告)号：US08094654B2
公开(公告)日：2012-01-10
申请号：US11528988
申请日：2006-09-27
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： H04L12/50
CPC分类号： H01L25/065 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly includes electronic modules connected in a series circuit such that a particular number of input connections of one of the electronic modules is connected with the particular number of output connections of another of the electronic modules. Each electronic module is configured to pass on an information which each electronic module receives on an input side at an nth of each electronic module's input connections to an nth of each electronic module's output connections. The input connections and output connections of each electronic module are arranged in a same geometric arrangement. Each electronic module is configured to receive, irrespective of a geometric orientation of the input connections of a given electronic module in relation to a geometric orientation of the output connections of a corresponding electronic module connected with the given electronic module on the input side of the given electronic module, at the same of the given electronic module's input connections, a particular information which is transmitted by the same output connections of the corresponding electronic module.
摘要翻译：电子组件包括以串联电路连接的电子模块，使得一个电子模块的特定数量的输入连接与另一个电子模块的特定数量的输出连接相连接。每个电子模块被配置为将每个电子模块在每个电子模块的输入连接的第n个的输入侧接收的信息传递到每个电子模块的输出连接的第n个。每个电子模块的输入连接和输出连接以相同的几何排列布置。每个电子模块被配置为接收与给定电子模块的输入连接相对于在给定的输入端上与给定电子模块连接的相应电子模块的输出连接的几何取向的几何取向电子模块，在给定的电子模块的输入连接相同的情况下，由相应电子模块的相同输出连接传输的特定信息。

6. 发明申请

US20070106837A1 Information transfer in electronic modules 有权
标题翻译：电子模块中的信息传输
公开(公告)号：US20070106837A1
公开(公告)日：2007-05-10
申请号：US11528988
申请日：2006-09-27
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： G06F12/00
CPC分类号： H01L25/065 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly includes electronic modules connected in a series circuit such that a particular number of input connections of one of the electronic modules is connected with the particular number of output connections of another of the electronic modules. Each electronic module is configured to pass on an information which each electronic module receives on an input side at an nth of each electronic module's input connections to an nth of each electronic module's output connections. The input connections and output connections of each electronic module are arranged in a same geometric arrangement. Each electronic module is configured to receive, irrespective of a geometric orientation of the input connections of a given electronic module in relation to a geometric orientation of the output connections of a corresponding electronic module connected with the given electronic module on the input side of the given electronic module, at the same of the given electronic module's input connections, a particular information which is transmitted by the same output connections of the corresponding electronic module.
摘要翻译：电子组件包括以串联电路连接的电子模块，使得一个电子模块的特定数量的输入连接与另一个电子模块的特定数量的输出连接相连接。每个电子模块被配置为将每个电子模块在每个电子模块的输入连接的第n个的输入侧接收的信息传递到每个电子模块的输出连接的第n个。每个电子模块的输入连接和输出连接以相同的几何排列布置。每个电子模块被配置为接收与给定电子模块的输入连接相对于在给定的输入端上与给定电子模块连接的相应电子模块的输出连接的几何取向的几何取向电子模块，在给定的电子模块的输入连接相同的情况下，由相应电子模块的相同输出连接传输的特定信息。

7. 发明授权

US08879260B2 Heat transfer system 有权
标题翻译：传热系统
公开(公告)号：US08879260B2
公开(公告)日：2014-11-04
申请号：US13568968
申请日：2012-08-07
申请人： Sven Kalms , Christian Weiss
发明人： Sven Kalms , Christian Weiss
IPC分类号： H05K7/20 , G06F1/20 , H01L23/427 , F28F7/00 , H01L23/34 , H01R13/62
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
摘要翻译：存储器模块包括具有第一和第二侧的电路板，其中存储器芯片至少布置在第一侧上。在第一侧上布置有纵向延伸的模块导热体。模块导热体包括接触表面，其被配置为接触传热系统。

8. 发明授权

US09436362B2 OData service provisioning on top of GenIL layer 有权
公开(公告)号：US09436362B2
公开(公告)日：2016-09-06
申请号：US14596933
申请日：2015-01-14
申请人： Zhiqiang Wu , Christian Weiss , Joerg Singler
发明人： Zhiqiang Wu , Christian Weiss , Joerg Singler
IPC分类号： G06F17/30 , G06F3/0484 , H04L29/08
CPC分类号： G06F3/0484 , G06F17/30569 , G06F17/30876 , H04L67/10 , H04L67/32
摘要： The disclosure generally describes computer-implemented methods, software, and systems for allowing provisioning of open data protocol (OData) services on top of a generic interaction layer (GenIL). One computer-implemented method includes receiving an OData-compliant request for data, determining a GenIL data provider to receive the OData-compliant request for data, determining the memory location of the data, requesting the data from the determined memory location, receiving the requested data from the determined memory location, converting, using at least one computer, the received data into an OData-compliant format, rendering an OData-compliant response, and transmitting the OData-compliant response.

9. 发明申请

US20150134683A1 ODATA SERVICE PROVISIONING ON TOP OF GENIL LAYER 有权
公开(公告)号：US20150134683A1
公开(公告)日：2015-05-14
申请号：US14596933
申请日：2015-01-14
申请人： Zhiqiang Wu , Christian Weiss , Joerg Singler
发明人： Zhiqiang Wu , Christian Weiss , Joerg Singler
IPC分类号： G06F17/30 , H04L29/08
CPC分类号： G06F3/0484 , G06F17/30569 , G06F17/30876 , H04L67/10 , H04L67/32
摘要： The disclosure generally describes computer-implemented methods, software, and systems for allowing provisioning of open data protocol (OData) services on top of a generic interaction layer (GenIL). One computer-implemented method includes receiving an OData-compliant request for data, determining a GenIL data provider to receive the OData-compliant request for data, determining the memory location of the data, requesting the data from the determined memory location, receiving the requested data from the determined memory location, converting, using at least one computer, the received data into an OData-compliant format, rendering an OData-compliant response, and transmitting the OData-compliant response.

10. 发明授权

US07414917B2 Re-driving CAwD and rD signal lines 失效
标题翻译：重新启动CAwD和rD信号线
公开(公告)号：US07414917B2
公开(公告)日：2008-08-19
申请号：US11192335
申请日：2005-07-29
申请人： Hermann Ruckerbauer , Simon Muff , Christian Weiss , Peter Gregorius
发明人： Hermann Ruckerbauer , Simon Muff , Christian Weiss , Peter Gregorius
IPC分类号： G11C8/00
CPC分类号： G11C5/04 , G11C5/06 , H05K1/142
摘要： Semiconductor memory modules and semiconductor memory systems using the same are described herein. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input lines and the rD signal output lines in a respective point-to-point fashion.
摘要翻译：本文描述了使用其的半导体存储器模块和半导体存储器系统。这些模块将常规DIMM分成一系列独立的较小内存模块。每个存储器模块包括布置在衬底上的至少一个半导体存储器芯片; CAwD信号输入线，以第一预定行号排列在基板上，并将半导体存储器芯片之一连接到基板上的CAwD输入信号引脚; 和rD信号输出线，以第二预定行号排列在基板上，并将一个或最后一个半导体存储器连接到基板的第二数量的rD输出信号引脚。在包括半导体存储器模块的半导体存储器系统中，每个存储器模块通过CAwD信号输入线和rD信号输出线分别以点对点的方式连接到存储器控制器。

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