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    • 2. 发明授权
    • Silicon controlled rectifier for high voltage applications
    • 可控硅整流器用于高压应用
    • US09129809B2
    • 2015-09-08
    • US13958901
    • 2013-08-05
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yi-Feng Chang
    • H01L23/552H01L27/088H01L29/74H01L31/111H01L23/62H01L27/02
    • H01L27/0262H01L29/7436
    • In a silicon-controlled rectifier, an anode region includes p-type anode well regions which are laterally surrounded by an n-type well region. A length of a p-type anode well region, as measured in a first direction, is greater than a width of the p-type anode well region, as measured in a second direction perpendicular to the first direction. A p-type well region meets the n-type well region at a junction, wherein the junction extends between the p-type well region and n-type well region in the second direction. A cathode region includes a plurality of n-type cathode well regions which are formed in the p-type well region. A length of an n-type cathode well region, as measured in the first direction, is greater than a width of the n-type cathode well region, as measured in the second direction.
    • 在可控硅整流器中,阳极区域包括由n型阱区域侧向包围的p型阳极阱区域。 如在第一方向上测量的p型阳极阱区的长度大于在垂直于第一方向的第二方向上测量的p型阳极阱区的宽度。 p型阱区在结处与n型阱区相交,其中该结在第二方向上在p型阱区和n型阱区之间延伸。 阴极区域包括形成在p型阱区域中的多个n型阴极阱区域。 如在第一方向测量的,n型阴极阱区的长度大于在第二方向上测量的n型阴极阱区的宽度。
    • 6. 发明申请
    • SILICON CONTROLLED RECTIFIER FOR HIGH VOLTAGE APPLICATIONS
    • 用于高压应用的硅控制整流器
    • US20150035007A1
    • 2015-02-05
    • US13958901
    • 2013-08-05
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yi-Feng Chang
    • H01L27/02
    • H01L27/0262H01L29/7436
    • In a silicon-controlled rectifier, an anode region includes p-type anode well regions which are laterally surrounded by an n-type well region. A length of a p-type anode well region, as measured in a first direction, is greater than a width of the p-type anode well region, as measured in a second direction perpendicular to the first direction. A p-type well region meets the n-type well region at a junction, wherein the junction extends between the p-type well region and n-type well region in the second direction. A cathode region includes a plurality of n-type cathode well regions which are formed in the p-type well region. A length of an n-type cathode well region, as measured in the first direction, is greater than a width of the n-type cathode well region, as measured in the second direction.
    • 在可控硅整流器中,阳极区域包括由n型阱区域侧向包围的p型阳极阱区域。 如在第一方向上测量的p型阳极阱区的长度大于在垂直于第一方向的第二方向上测量的p型阳极阱区的宽度。 p型阱区在结处与n型阱区相交,其中该结在第二方向上在p型阱区和n型阱区之间延伸。 阴极区域包括形成在p型阱区域中的多个n型阴极阱区域。 如在第一方向测量的,n型阴极阱区的长度大于在第二方向上测量的n型阴极阱区的宽度。
    • 8. 发明授权
    • Electrostatic discharge (ESD) guard ring protective structure
    • 静电放电(ESD)保护环保护结构
    • US08809961B2
    • 2014-08-19
    • US14056034
    • 2013-10-17
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tsung-Che TsaiJam-Wem LeeYi-Feng Chang
    • H01L29/66H01L23/62
    • H01L27/0259H01L21/761H01L27/0277H01L27/0629
    • An electrostatic discharge (ESD) protection circuit structure includes several diffusion regions and a MOS transistor. The circuit structure includes a first diffusion region of a first type (e.g., P-type or N-type) formed in a first well of the first type, a second diffusion region of the first type formed in the first well of the first type, and a first diffusion region of a second type (e.g., N-type or P-type) formed in a first well of the second type. The first well of the second type is formed in the first well of the first type. The MOS transistor is of the second type and includes a drain formed by a second diffusion region of the second type formed in a second well of the second type bordering the first well of the first type.
    • 静电放电(ESD)保护电路结构包括几个扩散区和MOS晶体管。 电路结构包括形成在第一类型的第一阱中的第一类型的第一扩散区(例如,P型或N型),形成在第一类型的第一阱中的第一类型的第二扩散区 以及形成在第二类型的第一阱中的第二类型的第一扩散区域(例如,N型或P型)。 第一类型的第一井的第一井形成在第一类的第一井中。 MOS晶体管是第二类型,并且包括由与第一类型的第一阱接合的第二类型的第二阱中形成的第二类型的第二扩散区形成的漏极。