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1. 发明授权

US11594378B2 Electronic component and electronic component device 有权
公开(公告)号：US11594378B2
公开(公告)日：2023-02-28
申请号：US17523524
申请日：2021-11-10
申请人： TDK CORPORATION
发明人： Shinya Onodera , Koki Ito , Hideki Kaneko
IPC分类号： H01G4/30 , H01G2/06 , H01G4/008 , H01G4/012 , H01G4/12
摘要： An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

2. 发明授权

US10032559B2 Electronic component 有权
公开(公告)号：US10032559B2
公开(公告)日：2018-07-24
申请号：US15389181
申请日：2016-12-22
申请人： TDK CORPORATION
发明人： Norihisa Ando , Atsushi Takeda , Hideki Kaneko
IPC分类号： H01G4/232 , H01G4/30 , H01G4/12
摘要： An electronic component is provided with an element body and terminal electrodes. The terminal electrodes include sintered metal layers and conductive resin layers. A first length, which is a length of the sintered metal layers in a first direction at end portions of a side surface in a second direction, is shorter than a second length, which is a length of the sintered metal layers in the first direction at central portions of the side surface in the second direction. A third length, which is a length of the conductive resin layers in the first direction at the end portions, is shorter than a fourth length, which is a length of the conductive resin layers in the first direction at the central portions. A difference between the fourth length and the third length is larger than a difference between the second length and the first length.

3. 发明授权

US10026556B2 Electronic component 有权
公开(公告)号：US10026556B2
公开(公告)日：2018-07-17
申请号：US15276172
申请日：2016-09-26
申请人： TDK CORPORATION
发明人： Norihisa Ando , Atsushi Takeda , Hideki Kaneko
IPC分类号： H01G4/30 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/12
摘要： An electronic component includes an element body having a pair of end surfaces opposing each other and a side surface adjacent to the pair of end surfaces, and an external electrode disposed on at least the end surface. The external electrode includes a conductive resin layer located on at least the end surface. A first thickness of the conductive resin layer located on a central region of the end surface is greater than a second thickness of the conductive resin layer located on a peripheral region of the end surface.

4. 发明授权

US10707020B2 Electronic component 有权
公开(公告)号：US10707020B2
公开(公告)日：2020-07-07
申请号：US15918188
申请日：2018-03-12
申请人： TDK CORPORATION
发明人： Shinya Onodera , Koki Ito , Hideki Kaneko
IPC分类号： H01G4/30 , H01G4/248 , H01G4/232 , H01G4/012 , H01G4/12 , H01G4/008
摘要： An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.

5. 发明授权

US11264172B2 Electronic component and electronic component device 有权
公开(公告)号：US11264172B2
公开(公告)日：2022-03-01
申请号：US16097175
申请日：2017-09-20
申请人： TDK CORPORATION
发明人： Shinya Onodera , Koki Ito , Hideki Kaneko
IPC分类号： H01G4/30 , H01G2/06 , H01G4/008 , H01G4/012 , H01G4/12
摘要： An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

6. 发明授权

US09892855B2 Electronic component 有权
公开(公告)号：US09892855B2
公开(公告)日：2018-02-13
申请号：US15275953
申请日：2016-09-26
申请人： TDK CORPORATION
发明人： Norihisa Ando , Atsushi Takeda , Hideki Kaneko , Yui Sugiura , Tatsuo Inagaki , Tomomichi Gunji , Kouhei Yamaguchi
IPC分类号： H01G4/30 , H01G4/005 , H01G4/232 , H01G4/248 , H01G4/12
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/248
摘要： An external electrode includes a sintered metal layer disposed on at least an end surface and a conductive resin layer disposed on the sintered metal layer. The sintered metal layer includes a first portion, a second portion, and a third portion. The first portion is disposed at a central region of the end surface. The second portion is disposed at a part of a peripheral region of the end surface, and extends to an edge portion of the end surface from the first portion. The third portion is disposed at a remaining part of the peripheral region of the end surface. The thickness of the second portion is less than that of the first portion. The thickness of the third portion is less than that of the second portion. The first portion, the second portion, and the third portion are covered with the conductive resin layer.

7. 发明授权

US11232910B2 Electronic component and electronic component device 有权
公开(公告)号：US11232910B2
公开(公告)日：2022-01-25
申请号：US16097175
申请日：2017-09-20
申请人： TDK CORPORATION
发明人： Shinya Onodera , Koki Ito , Hideki Kaneko
IPC分类号： H01G4/30 , H01G2/06 , H01G4/008 , H01G4/012 , H01G4/12
摘要： An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

8. 发明授权

US10755861B2 Electronic component 有权
公开(公告)号：US10755861B2
公开(公告)日：2020-08-25
申请号：US15695645
申请日：2017-09-05
申请人： TDK CORPORATION
发明人： Shinya Onodera , Koki Ito , Hideki Kaneko
IPC分类号： H01G4/018 , H01G4/005 , H01G4/232 , H01G4/30 , H01G2/06 , H01G4/12
摘要： An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.

9. 发明授权

US09305708B2 Multilayer ceramic electronic device 有权
标题翻译：多层陶瓷电子器件
公开(公告)号：US09305708B2
公开(公告)日：2016-04-05
申请号：US14445894
申请日：2014-07-29
申请人： TDK Corporation
发明人： Nobutaka Kai , Yasuhiro Okui , Satoru Kindaichi , Hideki Kaneko , Tatsuya Kojima , Akitoshi Yoshii
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/1209 , H01G4/1218 , H01G4/1236 , H01G4/30
摘要： A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer 3 and a dielectric layer 2 are laminated alternatively, wherein the dielectric layer 2 is comprised of a dielectric ceramic composition including a main component represented by a general formula of ABO3 and a rare-earth component R, and segregation phases 5 including the rare-earth component R are present in the dielectric layer 2. When the dielectric layer 2 is separated to six areas by dividing the dielectric layer 2 sandwiched by a pair of the internal dielectric layers 3 in the thickness direction, there are the R segregation phases present in two neighboring areas 2a respectively adjacent to the pair of the internal electrode layers 3 in the dielectric layer 3 at a ratio of double or more compared with the R segregation phases present in two central areas 2b located at a substantially center in the dielectric layer 2.
摘要翻译：一种多层陶瓷电子器件，包括层叠体，其中内部电极层3和电介质层2交替层叠，其中介电层2由包含由通式ABO 3表示的主要成分和稀有金属的介电陶瓷组合物组成 - 电介质层2中存在包含稀土类成分R的偏析相5.当通过将介电层2夹在一对内部电介质层3之间的介电层2分开来将电介质层2分离为6个区域时在厚度方向上，在与介电层3中的一对内部电极层3相邻的两个相邻区域2a中存在R偏析相，其比例为两倍以上，与存在于两个中心的R偏析相比较位于电介质层2中的大致中心的区域2b。

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