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1. 发明授权

US09305708B2 Multilayer ceramic electronic device 有权
标题翻译：多层陶瓷电子器件
公开(公告)号：US09305708B2
公开(公告)日：2016-04-05
申请号：US14445894
申请日：2014-07-29
申请人： TDK Corporation
发明人： Nobutaka Kai , Yasuhiro Okui , Satoru Kindaichi , Hideki Kaneko , Tatsuya Kojima , Akitoshi Yoshii
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/1209 , H01G4/1218 , H01G4/1236 , H01G4/30
摘要： A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer 3 and a dielectric layer 2 are laminated alternatively, wherein the dielectric layer 2 is comprised of a dielectric ceramic composition including a main component represented by a general formula of ABO3 and a rare-earth component R, and segregation phases 5 including the rare-earth component R are present in the dielectric layer 2. When the dielectric layer 2 is separated to six areas by dividing the dielectric layer 2 sandwiched by a pair of the internal dielectric layers 3 in the thickness direction, there are the R segregation phases present in two neighboring areas 2a respectively adjacent to the pair of the internal electrode layers 3 in the dielectric layer 3 at a ratio of double or more compared with the R segregation phases present in two central areas 2b located at a substantially center in the dielectric layer 2.
摘要翻译：一种多层陶瓷电子器件，包括层叠体，其中内部电极层3和电介质层2交替层叠，其中介电层2由包含由通式ABO 3表示的主要成分和稀有金属的介电陶瓷组合物组成 - 电介质层2中存在包含稀土类成分R的偏析相5.当通过将介电层2夹在一对内部电介质层3之间的介电层2分开来将电介质层2分离为6个区域时在厚度方向上，在与介电层3中的一对内部电极层3相邻的两个相邻区域2a中存在R偏析相，其比例为两倍以上，与存在于两个中心的R偏析相比较位于电介质层2中的大致中心的区域2b。

2. 发明授权

US08921248B2 Dielectric ceramic composition and electronic device 有权
标题翻译：介电陶瓷组合物和电子器件
公开(公告)号：US08921248B2
公开(公告)日：2014-12-30
申请号：US13773380
申请日：2013-02-21
申请人： TDK Corporation
发明人： Toshihiro Iguchi , Akitoshi Yoshii , Tatsuya Kojima , Satoshi Takagi
IPC分类号： H01G4/10 , C04B35/495 , C04B35/50 , H01G4/12 , H01G4/30 , C01G33/00 , C01G35/00
CPC分类号： C04B35/50 , C01G33/006 , C01G35/006 , C01P2006/40 , C04B35/495 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3272 , C04B2235/652 , C04B2235/656 , C04B2235/6562 , C04B2235/6582 , C04B2235/6588 , C04B2235/663 , C04B2235/76 , C04B2235/9615 , H01G4/1209 , H01G4/1254 , H01G4/30
摘要： Dielectric ceramic composition comprising a compound shown by a general formula {A1-x(RE)2x/3}y-B2O5+y and has a tungsten bronze-type structure. In the formula, “A” is at least one selected from a group comprising Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said “x” and “y” satisfies 0
摘要翻译：电介质陶瓷组合物，其包含通式{A1-x（RE）2x / 3} y-B2O5 + y所示的化合物，并具有钨青铜型结构。在该式中，“A”为选自Ba，Ca，Sr和Mg的组中的至少一种，“B”为选自Nb和Ta中的至少一种，“RE”为选自Sc，Y， La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu，“x”和“y”分别满足0

3. 发明授权

US08853115B2 Dielectric ceramic composition and electronic device 有权
标题翻译：介电陶瓷组合物和电子器件
公开(公告)号：US08853115B2
公开(公告)日：2014-10-07
申请号：US13773370
申请日：2013-02-21
申请人： TDK Corporation
发明人： Toshihiro Iguchi , Akitoshi Yoshii , Tatsuya Kojima , Satoshi Takagi
IPC分类号： C04B35/495 , C04B35/50 , H01G4/10 , C04B35/626 , H01G4/12 , H01G4/30 , C01G33/00
CPC分类号： C04B35/50 , C01G33/006 , C04B35/495 , C04B35/6263 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3272 , C04B2235/3409 , C04B2235/3418 , C04B2235/656 , C04B2235/6562 , C04B2235/76 , C04B2235/78 , C04B2235/9615 , H01G4/1209 , H01G4/1254 , H01G4/30
摘要： A dielectric ceramic composition comprising a compound shown by a general formula {A1−x(RE)2x/3}y-D2O5+y having tungsten bronze-type structure and an oxide of “M”. “A” is at least one selected from Ba, Ca, Sr and Mg, “D” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, “x” and “y” satisfies 0 0, respectively and said “M” is at least one selected from Al, Si, B and Li. It is preferable to further comprise Mg oxide.
摘要翻译：一种电介质陶瓷组合物，其包含具有钨青铜型结构和“M”氧化物的通式{A1-x（RE）2x / 3} y-D2O5 + y所示的化合物。 “A”为选自Ba，Ca，Sr和Mg中的至少一种，“D”为选自Nb和Ta中的至少一种，“RE”为选自Sc，Y，La，Ce，Pr，Nd ，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu，“x”和“y”分别满足0 0，所述“M” 来自Al，Si，B和Li。优选还包含Mg氧化物。

4. 发明授权

US10943739B2 Electronic component 有权
公开(公告)号：US10943739B2
公开(公告)日：2021-03-09
申请号：US16430858
申请日：2019-06-04
申请人： TDK CORPORATION
发明人： Shinya Ito , Akitoshi Yoshii , Kenichi Inoue , Yoshiki Satou
IPC分类号： H01G4/38 , H01G4/228 , H01G4/224 , H01G2/10 , H01G4/30
摘要： A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.

5. 发明申请

US20150131202A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20150131202A1
公开(公告)日：2015-05-14
申请号：US14536032
申请日：2014-11-07
申请人： TDK Corporation
发明人： Sunao MASUDA , Katsumi Kobayashi , Akitoshi Yoshii
IPC分类号： H01G2/04 , H01G4/012 , H01G4/38 , H01G4/12 , H01G2/10 , H01G4/30 , H01G4/228
CPC分类号： H01G2/106 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3426 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10946 , Y02P70/611
摘要： The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.
摘要翻译：本发明是具有金属端子的陶瓷电子部件，其包括具有一对端子电极的大致平行六面体形状的芯片部件和根据所述端子电极设置的一对金属端子部。端子电极通过从芯片部件的端面缠绕在一部分侧面上而形成。金属端子部分包括连接到端子电极并且包括大致平行于端面延伸的连接面的连接部分，多个连接部分连接到连接部分并且包括沿连接面的不同方向延伸的接合面，以及连接到接合部分的多个安装部件，并且包括安装部分上表面，该安装部分上表面通过采取预定的空间而大致平行于与接合面的不同方向的任何一个侧面延伸。

6. 发明申请

US20130222970A1 DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE 有权
标题翻译：电介质陶瓷组合物和电子器件
公开(公告)号：US20130222970A1
公开(公告)日：2013-08-29
申请号：US13773380
申请日：2013-02-21
申请人： TDK Corporation
发明人： Toshihiro Iguchi , Akitoshi Yoshii , Tatsuya Kojima , Satoshi Takagi
IPC分类号： C04B35/50 , H01G4/12
CPC分类号： C04B35/50 , C01G33/006 , C01G35/006 , C01P2006/40 , C04B35/495 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3272 , C04B2235/652 , C04B2235/656 , C04B2235/6562 , C04B2235/6582 , C04B2235/6588 , C04B2235/663 , C04B2235/76 , C04B2235/9615 , H01G4/1209 , H01G4/1254 , H01G4/30
摘要： Dielectric ceramic composition comprising a compound shown by a general formula {A1-x(RE)2x/3}y-B2O5+y and has a tungsten bronze-type structure. In the formula, “A” is at least one selected from a group comprising Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said “x” and “y” satisfies 0
摘要翻译：电介质陶瓷组合物，其包含通式{A1-x（RE）2x / 3} y-B2O5 + y所示的化合物，并具有钨青铜型结构。在该式中，“A”为选自Ba，Ca，Sr和Mg的组中的至少一种，“B”为选自Nb和Ta中的至少一种，“RE”为选自Sc，Y， La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu，“x”和“y”分别满足0

7. 发明授权

US09640321B2 Ceramic electronic component with metal terminal 有权
公开(公告)号：US09640321B2
公开(公告)日：2017-05-02
申请号：US14536032
申请日：2014-11-07
申请人： TDK Corporation
发明人： Sunao Masuda , Katsumi Kobayashi , Akitoshi Yoshii
IPC分类号： H01G2/10 , H01G4/30 , H01G4/38 , H01G2/06 , H01G4/232 , H01G4/12 , H05K3/34
CPC分类号： H01G2/106 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3426 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10946 , Y02P70/611
摘要： A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

8. 发明授权

US09105405B2 Ceramic electronic component with metal terminals 有权
标题翻译：陶瓷电子元件带金属端子
公开(公告)号：US09105405B2
公开(公告)日：2015-08-11
申请号：US14024398
申请日：2013-09-11
申请人： TDK Corporation
发明人： Sunao Masuda , Katsumi Kobayashi , Takashi Komatsu , Akitoshi Yoshii , Kazuyuki Hasebe , Kayou Kusano , Norihisa Ando
IPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/232 , H01G4/12
CPC分类号： H01G2/06 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
摘要翻译：一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面，通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。

9. 发明申请

US20130222969A1 DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE 有权
标题翻译：电介质陶瓷组合物和电子器件
公开(公告)号：US20130222969A1
公开(公告)日：2013-08-29
申请号：US13773370
申请日：2013-02-21
申请人： TDK Corporation
发明人： Toshihiro Iguchi , Akitoshi Yoshii , Tatsuya Kojima , Satoshi Takagi
IPC分类号： C04B35/50 , H01G4/12
CPC分类号： C04B35/50 , C01G33/006 , C04B35/495 , C04B35/6263 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3272 , C04B2235/3409 , C04B2235/3418 , C04B2235/656 , C04B2235/6562 , C04B2235/76 , C04B2235/78 , C04B2235/9615 , H01G4/1209 , H01G4/1254 , H01G4/30
摘要： A dielectric ceramic composition comprising a compound shown by a general formula {A1−x(RE)2x/3}y-D2O5+y having tungsten bronze-type structure and an oxide of “M”. “A” is at least one selected from Ba, Ca, Sr and Mg, “D” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, “x” and “y” satisfies 0 0, respectively and said “M” is at least one selected from Al, Si, B and Li. It is preferable to further comprise Mg oxide.
摘要翻译：一种电介质陶瓷组合物，其包含具有钨青铜型结构和“M”氧化物的通式{A1-x（RE）2x / 3} y-D2O5 + y所示的化合物。 “A”为选自Ba，Ca，Sr和Mg中的至少一种，“D”为选自Nb和Ta中的至少一种，“RE”为选自Sc，Y，La，Ce，Pr，Nd ，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu，“x”和“y”分别满足0 0，所述“M” 来自Al，Si，B和Li。优选还包含Mg氧化物。

10. 发明授权

US09042079B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US09042079B2
公开(公告)日：2015-05-26
申请号：US13973514
申请日：2013-08-22
申请人： TDK Corporation
发明人： Sunao Masuda , Katsumi Kobayashi , Akitoshi Yoshii , Kazuyuki Hasebe , Takashi Komatsu , Kayou Kusano
IPC分类号： H01G4/228 , H01G4/01 , H01G4/30 , H01G4/38 , H01G2/06 , H01G4/232
CPC分类号： H01G4/01 , H01G2/06 , H01G4/232 , H01G4/30 , H01G4/38
摘要： A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.
摘要翻译：一种陶瓷电子部件，包括：包括大致长方体的芯片部件，具有面向第一端面的第一平板部的第一金属端子部，与第一平板部连接的至少一对第一嵌合臂部，保持第一环绕部分之间的第一环绕部分和连接到第一平板部分并且大致平行于一个侧面延伸的第一安装部分和具有面向第二端面的第二平板部分的第二金属端子部分至少一对连接到第二平板部分的第二装配臂部分，具有与第二包围部分接合的第二接合突起，将第二环绕部分保持在其间，以及大致平行于一个侧面延伸的第二安装部分。

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