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1. 发明授权

US11335508B2 Electronic device 有权
公开(公告)号：US11335508B2
公开(公告)日：2022-05-17
申请号：US16725374
申请日：2019-12-23
申请人： TDK CORPORATION
发明人： Norihisa Ando , Shinya Ito , Kosuke Yazawa , Akihiro Masuda , Yoshiki Satou , Katsumi Kobayashi
IPC分类号： H01G4/30 , H01G4/005 , H01G4/224 , H01G4/248 , H01G4/38
摘要： An electronic device including chip components each having a first terminal electrode and a second terminal electrode formed on both end faces, and a case provided with an accommodation recess in which the chip components are accommodated, and an opening edge face formed around an opening face of the accommodation recess. An individual metal terminal is attached to the case. The individual metal terminal includes an inner electrode part inserted along an inner side wall of the accommodation recess in the case for connecting to the first terminal electrode, an opening edge electrode part formed over the opening edge face to be continuous to the inner electrode part and a side electrode part formed along the outer side face of the case to be continuous to the opening edge electrode part.

2. 发明授权

US10096426B2 Electronic device 有权
公开(公告)号：US10096426B2
公开(公告)日：2018-10-09
申请号：US15391312
申请日：2016-12-27
申请人： TDK CORPORATION
发明人： Sunao Masuda , Katsumi Kobayashi , Masahiro Mori , Kayou Matsunaga , Norihisa Ando
IPC分类号： H01G4/248 , H01G2/06 , H01G4/232 , H01G4/30 , H01G4/12
摘要： An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.

3. 发明授权

US10049805B2 Coil device 有权
公开(公告)号：US10049805B2
公开(公告)日：2018-08-14
申请号：US15447975
申请日：2017-03-02
申请人： TDK CORPORATION
发明人： Katsumi Kobayashi
IPC分类号： H01F27/02 , H01F27/28 , H01F27/32 , H01F5/02 , H01F41/00 , H01Q7/06
摘要： A coil device has a potting resin 60. The potting resin 60 surrounds a bobbin 20 with a coil portion 12. The coil portion 12 is housed in a housing concave portion 42 of an outer case 40. Oblique plate legs 50 arranged obliquely are arranged between an outer peripheral wall 24 of the bobbin 20 and a bottom wall of the housing concave portion 42.

4. 发明授权

US09105405B2 Ceramic electronic component with metal terminals 有权
标题翻译：陶瓷电子元件带金属端子
公开(公告)号：US09105405B2
公开(公告)日：2015-08-11
申请号：US14024398
申请日：2013-09-11
申请人： TDK Corporation
发明人： Sunao Masuda , Katsumi Kobayashi , Takashi Komatsu , Akitoshi Yoshii , Kazuyuki Hasebe , Kayou Kusano , Norihisa Ando
IPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/232 , H01G4/12
CPC分类号： H01G2/06 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
摘要翻译：一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面，通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。

5. 发明授权

US11646163B2 Electronic device 有权
公开(公告)号：US11646163B2
公开(公告)日：2023-05-09
申请号：US17228822
申请日：2021-04-13
申请人： TDK CORPORATION
发明人： Akihiro Masuda , Shinya Ito , Norihisa Ando , Kosuke Yazawa , Yoshiki Satou , Katsumi Kobayashi , Toshihiro Iguchi , Kenya Tamaki , Shinya Saito
IPC分类号： H01F27/28 , H01G4/224 , H01G4/228 , H01G4/38 , H01G4/40
CPC分类号： H01G4/40 , H01F27/28 , H01G4/224 , H01G4/228 , H01G4/38
摘要： An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

6. 发明授权

US11367572B2 Conductive terminal and electronic device 有权
公开(公告)号：US11367572B2
公开(公告)日：2022-06-21
申请号：US16988819
申请日：2020-08-10
申请人： TDK CORPORATION
发明人： Akihiro Masuda , Norihisa Ando , Shinya Ito , Kosuke Yazawa , Yoshiki Satou , Katsumi Kobayashi
IPC分类号： H01G4/228 , H01G4/224 , H01G4/38 , H01G2/02 , H01G4/30
摘要： A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.

7. 发明授权

US10861631B2 Coil device 有权
公开(公告)号：US10861631B2
公开(公告)日：2020-12-08
申请号：US15610966
申请日：2017-06-01
申请人： TDK CORPORATION
发明人： Katsumi Kobayashi , Kouyu Ohi
IPC分类号： H01F17/04 , H01F27/29 , H01F27/28
摘要： A coil device includes a core body having a coil core part and a core bottom face, The coil device further includes a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by a conductive resin electrode.

8. 发明授权

US10607778B2 Ceramic electronic device 有权
公开(公告)号：US10607778B2
公开(公告)日：2020-03-31
申请号：US15819674
申请日：2017-11-21
申请人： TDK CORPORATION
发明人： Norihisa Ando , Katsumi Kobayashi , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
IPC分类号： H01G4/248 , H01G4/38 , H01G4/232 , H01G4/30 , H01G4/12 , H01G2/06 , H01G4/008
摘要： A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.

9. 发明申请

US20150131202A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20150131202A1
公开(公告)日：2015-05-14
申请号：US14536032
申请日：2014-11-07
申请人： TDK Corporation
发明人： Sunao MASUDA , Katsumi Kobayashi , Akitoshi Yoshii
IPC分类号： H01G2/04 , H01G4/012 , H01G4/38 , H01G4/12 , H01G2/10 , H01G4/30 , H01G4/228
CPC分类号： H01G2/106 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3426 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10946 , Y02P70/611
摘要： The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.
摘要翻译：本发明是具有金属端子的陶瓷电子部件，其包括具有一对端子电极的大致平行六面体形状的芯片部件和根据所述端子电极设置的一对金属端子部。端子电极通过从芯片部件的端面缠绕在一部分侧面上而形成。金属端子部分包括连接到端子电极并且包括大致平行于端面延伸的连接面的连接部分，多个连接部分连接到连接部分并且包括沿连接面的不同方向延伸的接合面，以及连接到接合部分的多个安装部件，并且包括安装部分上表面，该安装部分上表面通过采取预定的空间而大致平行于与接合面的不同方向的任何一个侧面延伸。

10. 发明授权

US11798743B2 Electronic device 有权
公开(公告)号：US11798743B2
公开(公告)日：2023-10-24
申请号：US17229393
申请日：2021-04-13
申请人： TDK CORPORATION
发明人： Shinya Saito , Kenya Tamaki , Norihisa Ando , Shinya Ito , Akihiro Masuda , Kosuke Yazawa , Yoshiki Satou , Katsumi Kobayashi , Toshihiro Iguchi
IPC分类号： H01H85/175 , H01G4/224 , H01G4/232 , H01G2/06 , H01H85/08 , H01G4/38
CPC分类号： H01G4/224 , H01G2/065 , H01G4/232 , H01G4/38 , H01H85/08 , H01H85/175
摘要： An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.

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