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    • 1. 发明授权
    • Circuit board apparatus with induced air flow for heat dissipation
    • 具有诱导空气流散热的电路板装置
    • US07787247B2
    • 2010-08-31
    • US11954063
    • 2007-12-11
    • Tai-Sheng Han
    • Tai-Sheng Han
    • H05K7/20
    • H01L23/467G06F1/20H01L2924/0002H01L2924/00
    • A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.
    • 一种用于消散由显卡组件的发热部件产生的热能的冷却机构。 一种装置包括具有固定在其上的至少一个发热部件的电路板。 该装置还包括一个风扇和载体,其中包括散热板,该散热板具有热耦合到发热部件的部分。 散热板包括用于在该部分附近形成至少一个槽的装置。 该风扇适于引导气流穿过该部分。 由发热部件产生的热能传递到风扇载体,并最终通过气流从风扇载体上移除。 气流在操作过程中感应通过槽吸入的二次气流,从而增强热能从发热部件的转移。
    • 2. 发明申请
    • Graphics card apparatus with improved heat dissipating mechanisms
    • 具有改进散热机构的显卡设备
    • US20070133179A1
    • 2007-06-14
    • US11304457
    • 2005-12-14
    • Tai-Sheng Han
    • Tai-Sheng Han
    • H05K7/20
    • H01L23/427G06F1/20H01L23/467H01L2924/0002H01L2924/00
    • A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a heat sink that is thermally coupled to the metal block via a thermal transfer plate. A fan unit of the mechanism generates and directs an air flow toward the radiator, metal block and heat sink, where the air flow removes the thermal energy therefrom.
    • 一种用于消散由显卡组件的主动电子部件产生的热能的冷却机构。 一种机构包括散热器和金属块,其与热电耦合到有源电子部件并且在其中具有管道。 散热器包括连接到管道的管道和挡板,其中管道的一端连接到管道的一端。 连接到管道和管道的另一端的泵将冷却剂循环通过管道和管道,以将热能从金属块传递到散热器。 该机构还包括通过热传递板热耦合到金属块的散热器。 该机构的风扇单元产生并引导朝向散热器,金属块和散热器的空气流,其中空气流从其中去除热能。
    • 10. 发明申请
    • Miniature fan for high energy consuming circuit board devices
    • 用于高能耗电路板设备的微型风扇
    • US20060157231A1
    • 2006-07-20
    • US11314873
    • 2005-12-20
    • Tai-Sheng Han
    • Tai-Sheng Han
    • H05K7/20
    • H05K7/20154F04D17/04F04D29/582H01L23/467H01L2924/0002H01L2924/00
    • A miniature fan including an elongated, generally tubular outer housing member adapted to receive end closure plugs or caps at each end, a miniature electric motor mounted within one of the end caps, and a generally cylindrical shaped rotor/impeller disposed within the tubular housing and extending along the length thereof between the end caps, one end thereof being coupled to the motor. The housing member is provided with openings that extend longitudinally along one side thereof to provide an entrance port, and openings that extend along another side to provide an outlet or exit port. With the exception of the motor, all other parts can be made of an injection molded plastic, metal, or a combination of plastic and metal.
    • 一种微型风扇,包括细长的,大致管状的外部壳体构件,适于在每个端部容纳端部封闭塞子或盖子,安装在端盖之一内的微型电动马达和设置在管状壳体内的大致圆柱形的转子/叶轮, 沿其长度延伸在端盖之间,其一端连接到马达。 壳体构件设置有沿着其一侧纵向延伸的开口以提供入口,以及沿着另一侧延伸以提供出口或出口的开口。 除电动机外,所有其他部件都可以由注塑塑料,金属或塑料和金属的组合制成。