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1. 发明授权

US09396834B2 Metal foil provided with filler-containing resin layer and method for manufacturing metal foil provided with filler-containing resin layer 有权
标题翻译：具有含填料的树脂层的金属箔和具有含填料的树脂层的金属箔的制造方法
公开(公告)号：US09396834B2
公开(公告)日：2016-07-19
申请号：US13814303
申请日：2011-07-29
申请人： Takashi Syoujiguchi
发明人： Takashi Syoujiguchi
IPC分类号： H01B3/00 , H01B17/62 , H05K1/05 , H05K3/02 , H05K1/03
CPC分类号： H01B3/004 , H01B17/62 , H05K1/0373 , H05K1/05 , H05K3/022 , H05K2201/0154 , H05K2201/0209 , H05K2203/0759 , Y10T428/24355 , Y10T428/24372
摘要： A metal foil is provided with a filler-containing resin layer that is thin and has a smooth surface as a metal foil provided with an insulating layer. The filler-containing resin layer having a thickness of 0.1 μm to 3.0 μM, the gloss at the surface of the filler-containing resin layer is 200 or more, and the surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μM on the filler-containing resin layer is 25 nm or less is stacked on the smooth surface of the metal foil having a gloss exceeding 400 and surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μm of 10 nm or less.
摘要翻译：金属箔设置有薄的填充剂树脂层，并且具有作为设置有绝缘层的金属箔的光滑表面。含有填料的树脂层的厚度为0.1μm〜3.0μm，含填料的树脂层的表面的光泽度为200以上，原子力显微镜在测定区域测定的表面粗糙度（Ra）在含有填料的树脂层上的5μm×5μM的光泽度在25nm以下层叠在光泽超过400的金属箔的光滑表面上，并且在原子力显微镜的测量区域中测量的表面粗糙度（Ra） 5μm×5μm为10nm以下。

2. 发明授权

US06903916B2 Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection 失效
标题翻译：用于耐电压检查的电容器层的层压板和用于耐电压检查的用于电容器层的层压板的耐电压测量方法
公开(公告)号：US06903916B2
公开(公告)日：2005-06-07
申请号：US10717639
申请日：2003-11-21
申请人： Kazuhiro Yamazaki , Takashi Syoujiguchi
发明人： Kazuhiro Yamazaki , Takashi Syoujiguchi
IPC分类号： B32B1/08 , B32B15/08 , H01G2/20 , H05K1/02 , H05K1/16 , H05K3/00 , H01G4/30
CPC分类号： H01G2/20 , G01R31/20 , H05K1/0256 , H05K1/162 , H05K2201/0761 , H05K2201/09309 , H05K2203/0143 , H05K2203/162
摘要： The present invention provides a technique which permits the withstand voltage measurement of a laminate web for capacitor layer manufactured by a continuous laminating method in a roll state wound around a core tube. The invention provides a roll of laminate for capacitor layer which is obtained by manufacturing a laminate web for capacitor layer by laminating a first electrically conductive layer, a dielectric layer and a second electrically conductive layer and winding this laminate web for capacitor layer from a start end side to a terminal end side thereof around a core tube. In the laminate web for capacitor layer 1a to be wound around the core tube 2, the in-plane laminating arrangement of the first electrically conductive layer 3, the second electrically conductive layer 5 and the dielectric layer 4 is contrived, and by superposing an insulating resin film F on one side of this laminate web for capacitor layer and simultaneously winding this insulating resin film to make the laminate web for capacitor layer in a roll state, whereby a roll of laminate web for capacitor layer for withstand voltage inspection in which electrical insulation between layers overlapping each other is formed. The invention also provides a method of performing withstand voltage inspection which involves partially removing interlayer dielectric means of the laminate web for capacitor layer 1a positioned in the periphery of the roll of laminate web for withstand voltage inspection and performing the inspection using the exposed first and second electrically conductive layers.
摘要翻译：本发明提供了一种技术，其允许通过卷绕在芯管周围的卷状连续层压法制造的用于电容器层的层叠幅材的耐压测量。本发明提供了一种用于电容器层的层叠体，其通过层压第一导电层，电介质层和第二导电层而制造用于电容器层的层叠幅材而获得，并且从起始端卷绕用于电容器层的层叠幅材一侧到其末端侧围绕芯管。在用于电容器层1a的层叠网中，缠绕在芯管2上，设计第一导电层3，第二导电层5和电介质层4的面内层叠布置，并且通过将绝缘树脂膜F在用于电容器层的该层叠纤维网的一侧上，并同时卷绕该绝缘树脂膜，以使卷绕状态的电容器层的层叠幅材成为卷状状的电容器层用层叠纤维网，形成彼此重叠的层之间的绝缘。本发明还提供了一种执行耐电压检查的方法，该方法包括部分去除位于层叠幅材卷的周边的电容器层1a的叠层网状物的层间绝缘装置，用于耐电压检查，并使用暴露的第一和第第二导电层。

3. 发明授权

US06652993B2 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer 有权
标题翻译：具有铜镀层电路层的Cooper覆层压板以及使用具有镀敷电路层的覆铜层压板制造印刷电路板的方法
公开(公告)号：US06652993B2
公开(公告)日：2003-11-25
申请号：US10131222
申请日：2002-04-25
申请人： Takuya Yamamoto , Takashi Syoujiguchi
发明人： Takuya Yamamoto , Takashi Syoujiguchi
IPC分类号： B32B1501
CPC分类号： H05K3/108 , H05K1/09 , H05K3/067 , H05K2201/0355 , Y10S428/901 , Y10T428/12535 , Y10T428/1291 , Y10T428/24917 , Y10T428/24942 , Y10T428/24983
摘要： The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.
摘要翻译：本发明的目的是提供一种具有镀铜电路层的覆铜层压板，以及一种制造印刷线路板的方法，该印刷线路板在加工成印刷线路板时的电路图形的纵横比优于常规印刷电路板包括精细间距电路。本发明的目的是通过使用铜镀层压板制造印刷电路板，其特征在于镀铜电路层，其特征在于镀铜电路层和外层铜箔层，其满足以下关系：使用特定蚀刻剂的情况，作为构成所述镀铜电路层的铜的溶解速度（Vsp）与铜的溶解速度（Vsc）的比的R v值（Vsc / Vsp）构成所述外层铜箔层的面积为1.0以上。

4. 发明申请

US20130177739A1 METAL FOIL PROVIDED WITH FILLER-CONTAINING RESIN LAYER AND METHOD FOR MANUFACTURING METAL FOIL PROVIDED WITH FILLER-CONTAINING RESIN LAYER 有权
标题翻译：含有填料树脂层的金属箔和用于填充含有填料的树脂层制造金属箔的方法
公开(公告)号：US20130177739A1
公开(公告)日：2013-07-11
申请号：US13814303
申请日：2011-07-29
申请人： Takashi Syoujiguchi
发明人： Takashi Syoujiguchi
IPC分类号： H01B3/00
CPC分类号： H01B3/004 , H01B17/62 , H05K1/0373 , H05K1/05 , H05K3/022 , H05K2201/0154 , H05K2201/0209 , H05K2203/0759 , Y10T428/24355 , Y10T428/24372
摘要： A metal foil is provided with a filler-containing resin layer that is thin and has a smooth surface as a metal foil provided with an insulating layer. The filler-containing resin layer having a thickness of 0.1 μm to 3.0 μM, the gloss at the surface of the filler-containing resin layer is 200 or more, and the surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μM on the filler-containing resin layer is 25 nm or less is stacked on the smooth surface of the metal foil having a gloss exceeding 400 and surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μm of 10 nm or less.
摘要翻译：金属箔设置有薄的填充剂树脂层，并且具有作为设置有绝缘层的金属箔的光滑表面。含有填料的树脂层的厚度为0.1μm〜3.0μm，含填料的树脂层表面的光泽度为200以上，原子力显微镜在测定区域测定的表面粗糙度（Ra）在含有填料的树脂层上的5mum×5μmM的厚度为25nm以下层叠在光泽超过400的金属箔的光滑表面上，并且在原子力显微镜的测量区域中测量的表面粗糙度（Ra） 5mum×5mum为10nm以下。

5. 发明授权

US06986937B2 Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer 失效
标题翻译：用于形成电容器层的双面覆铜层压板及其制造方法以及使用用于形成电容器层的双面覆铜层压板获得的印刷线路板
公开(公告)号：US06986937B2
公开(公告)日：2006-01-17
申请号：US10778215
申请日：2004-02-17
申请人： Kazuhiro Yamazaki , Takashi Syoujiguchi
发明人： Kazuhiro Yamazaki , Takashi Syoujiguchi
IPC分类号： B32B9/00 , H01G4/08
CPC分类号： H05K1/162 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2201/09309 , H05K2203/025 , H05K2203/0307 , H05K2203/0723 , Y10S428/901 , Y10T428/12472 , Y10T428/12569 , Y10T428/12993 , Y10T428/24917
摘要： The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 μm or less, and the object of the present invention is to secure good voltage resistant proprieties.For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 μm to 3.0 μm, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.
摘要翻译：本发明涉及一种用于形成电容器层的双面覆铜层压板，其通过将电沉积铜箔粘附在厚度为10um或更小的电介质层的两侧上而形成，并且本发明的目的是以确保良好的耐电压性能。对于本发明的双面覆铜层压板，使用具有无光泽面的电解铜箔与通过将通过电解法得到的未处理电解铜箔的粗糙表面物理研磨的电介质层接合到表面粗糙度（Rz）为0.5〜3.0μm，根据需要进行结节处理，钝化，硅烷偶联剂处理等。作为其制造方法，其中粘附有两个具有彼此面对的电沉积铜箔的树脂层的表面等的制造方法。

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