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1. 发明授权

US09184064B1 System and method for metallization and reinforcement of glass substrates 有权
标题翻译：用于玻璃基板的金属化和增强的系统和方法
公开(公告)号：US09184064B1
公开(公告)日：2015-11-10
申请号：US14568977
申请日：2014-12-12
申请人： Triton Microtechnologies
发明人： Tim Mobley , Roupen Leon Keusseyan , Charles Tucker
IPC分类号： H01L21/48 , C23C18/16 , C23C18/32 , C23C28/02 , C23C2/04 , H01L23/538 , H01L23/15
CPC分类号： H01L21/486 , C23C2/04 , C23C18/165 , C23C18/32 , C23C28/023 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L21/6835 , H01L23/15 , H01L23/49816 , H01L23/49827 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/48 , H01L2221/68331 , H01L2221/68345 , H01L2221/68381 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13138 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/2929 , H01L2224/48227 , H01L2924/00014 , H01L2924/0002 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401 , H01L2224/11009 , H01L2224/45099 , H01L2924/01014
摘要： A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.
摘要翻译：一种用于玻璃基板的背面金属化和增强的方法，以在玻璃基板的处理和加工期间提供支撑和保护。在玻璃基板中形成通孔，并填充导电型材料。将背面金属化焊盘施加到玻璃基板并用凸块下金属化（UBM）焊盘封闭。牺牲基板可移除地附接到玻璃基板。牺牲衬底包括牺牲层，不透明膜和粘合剂。牺牲衬底保护背面金属化焊盘和凸块下金属化（UBM）焊盘，并加强玻璃衬底。

2. 发明授权

US09337060B1 Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components 有权
标题翻译：填充材料和填充孔的方法，以提高玻璃基板和其他电子部件的粘合性和密封性
公开(公告)号：US09337060B1
公开(公告)日：2016-05-10
申请号：US14568879
申请日：2014-12-12
申请人： Triton Microtechnologies
发明人： Tim Mobley , Roupen Leon Keusseyan
IPC分类号： H01L21/48 , H05K3/40 , H01L23/08 , H01L23/15 , H05K1/03
CPC分类号： H01L21/486 , H01L21/4803 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L2924/0002 , H01L2924/14 , H05K1/0306 , H05K3/4038 , H01L2924/00
摘要： A glass substrate and method of processing the glass substrate for use in semi-conductor packaging applications. The glass substrate has top surface and a bottom surface. At least one through-hole extends from the top surface to the bottom surface of the glass substrate. At least one interior layer is disposed inside the through-hole. At least one external layer is disposed on the top surface and at least one external layer is disposed on the bottom surface. The through holes of the glass substrate are filled with a metallized paste material using thick film technology. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.
摘要翻译：玻璃基板和用于半导体封装应用的玻璃基板的加工方法。玻璃基板具有顶表面和底表面。至少一个通孔从玻璃基板的顶表面延伸到底表面。至少一个内层设置在通孔的内部。至少一个外层设置在顶表面上，并且至少一个外层设置在底表面上。使用厚膜技术，用金属化的糊料填充玻璃基板的通孔。在金属化之后，玻璃基板被平坦化，以清洁和平坦化玻璃基板的表面。玻璃基板的表面涂覆有金属，金属氧化物，合金，聚合物或其组合的至少一个再分配层。糊料材料具有改善的对通孔的粘附性。填充的通孔是密封的并且具有低电阻率。

3. 发明授权

US09374892B1 Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components 有权
标题翻译：填充材料和填充孔的方法，以提高玻璃基板和其他电子部件的粘合性和密封性
公开(公告)号：US09374892B1
公开(公告)日：2016-06-21
申请号：US14568917
申请日：2014-12-12
申请人： Triton Microtechnologies
发明人： Tim Mobley , Roupen Leon Keusseyan
IPC分类号： H05K1/03 , H01L21/48 , B22F1/00 , C09D5/24 , H01L23/15 , H01L23/498
CPC分类号： H05K1/0306 , B22F1/0003 , B22F2301/10 , B22F2304/10 , C09D5/24 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K3/4061 , H01L2924/00
摘要： A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.
摘要翻译：用于填充通孔的糊状材料，用于提高玻璃基板的粘合性和气密性。在一些实施方案中，糊状材料包括金属，玻璃料组合物，溶剂，树脂，导电或非导电惰性添加剂或其混合物。糊料材料具有改善的对通孔的粘附性。填充的通孔是密封的并且具有低电阻率。

4. 发明授权

US09236274B1 Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components 有权
标题翻译：填充材料和填充孔的方法，以提高玻璃基板和其他电子部件的粘合性和密封性
公开(公告)号：US09236274B1
公开(公告)日：2016-01-12
申请号：US14568842
申请日：2014-12-12
申请人： Triton Microtechnologies
发明人： Tim Mobley , Roupen Leon Keusseyan
IPC分类号： H01L21/48 , H05K3/40 , C03B25/02 , C03C15/00 , C03C17/32 , C03C17/30 , C03C17/06 , C03C23/00 , C03C17/38 , H01L23/15 , H05K1/03
CPC分类号： H01L21/486 , C03B25/025 , C03C15/00 , C03C17/06 , C03C17/30 , C03C17/32 , C03C17/38 , C03C23/0025 , C03C2217/25 , C03C2217/70 , C03C2218/31 , C03C2218/32 , H01L23/15 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K1/095 , H05K3/4038 , H05K3/4061 , H01L2924/00
摘要： A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.
摘要翻译：一种处理用于半导体封装应用的玻璃基板的方法。在玻璃基板中形成通孔，随后填充有金属化的糊料。在金属化之后，玻璃基板被平坦化，以清洁和平坦化玻璃基板的表面。玻璃基板的表面涂覆有金属，金属氧化物，合金，聚合物或其组合的至少一个再分配层。糊料材料具有改善的对通孔的粘附性。填充的通孔是密封的并且具有低电阻率。

5. 发明授权

US09111917B2 Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits 有权
标题翻译：晶片与插入件的低成本和高性能结合以及形成通孔和电路的方法
公开(公告)号：US09111917B2
公开(公告)日：2015-08-18
申请号：US13666089
申请日：2012-11-01
申请人： TRITON MICROTECHNOLOGIES
发明人： Tim Mobley
IPC分类号： H01L21/48 , H01L23/15
CPC分类号： H01L21/486 , H01L23/15 , H01L2924/0002 , H01L2924/00
摘要： A low cost and high performance method for bonding a wafer to an interposer is provided. The technology provides designs and metallization techniques for through via glass applications that is thermal coefficient expansion matched to the glass or synthetic fused quartz substrates. An off-the-shelf glass, such as borosilicate based or Fused Synthetic Quartz, is used with a thick film Cu or Ag and/or a Sodium Ion Enriched (SIE) coating or glass, which may be applied or fired onto the substrate or wafer. Polymer based coatings can be applied in a sequential build-up process for purposes of redistribution of signals from a silicon integrated circuit to the opposite side of the substrate or wafer. Additionally, metallizations can be applied on top of the polymers and patterned to create a multilayer circuit.
摘要翻译：提供了一种用于将晶片接合到插入件的低成本和高性能的方法。该技术提供了通过玻璃应用的设计和金属化技术，其是与玻璃或合成熔凝石英基板匹配的热系数膨胀。使用诸如硼硅酸盐或熔融合成石英的现成玻璃与厚膜Cu或Ag和/或钠离子富集（SIE）涂层或玻璃一起使用，其可以施加或烧制到基底上，或晶圆。基于聚合物的涂层可以以顺序建立过程施加，用于将信号从硅集成电路重新分配到衬底或晶片的相对侧。另外，金属化可以施加在聚合物的顶部并被图案化以产生多层电路。

6. 发明授权

US09184135B1 System and method for metallization and reinforcement of glass substrates 有权
标题翻译：用于玻璃基板的金属化和增强的系统和方法
公开(公告)号：US09184135B1
公开(公告)日：2015-11-10
申请号：US14569010
申请日：2014-12-12
申请人： Triton Microtechnologies
发明人： Tim Mobley , Roupen Leon Keusseyan , Charles Tucker
IPC分类号： H01L23/538 , H05K3/00 , H05K1/03 , H05K1/09 , H01L21/48 , H01L23/15
CPC分类号： H01L23/5384 , H01L21/486 , H01L21/6835 , H01L23/15 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/48 , H01L2221/68331 , H01L2221/68345 , H01L2221/68381 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13138 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/2929 , H01L2224/48227 , H01L2924/00014 , H01L2924/0002 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H05K1/0306 , H05K1/09 , H05K3/007 , H05K2201/0344 , H05K2201/09481 , H05K2201/09563 , H01L2924/00 , H01L2224/0401 , H01L2224/11009 , H01L2924/014 , H01L2924/01014 , H01L2224/45099
摘要： A system for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. A sacrificial substrate is removeably attached to a glass substrate comprising through-holes, backside metallized pads, and under-bump metallization (UBM) pads enclosing the backside metallized pads. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and UBM pads, and reinforces the glass substrate.
摘要翻译：用于玻璃基板的背面金属化和增强的系统，以在玻璃基板的处理和加工期间提供支撑和保护。牺牲衬底可移除地附接到包括通孔，背面金属化焊盘和包围背面金属化焊盘的凸起下金属化（UBM）焊盘的玻璃衬底。牺牲衬底包括牺牲层，不透明膜和粘合剂。牺牲基板保护背面金属化焊盘和UBM焊盘，并加强玻璃基板。

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