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1. 发明授权

US09175710B2 Contained ceramic fastener 有权
标题翻译：包含陶瓷紧固件
公开(公告)号：US09175710B2
公开(公告)日：2015-11-03
申请号：US14134154
申请日：2013-12-19
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Michael A. Schrameyer , Jeffrey E. Krampert
IPC分类号： F16B37/00 , F16B33/02 , F16B37/12
CPC分类号： F16B33/02 , F16B33/006 , F16B37/00 , F16B37/12
摘要： A ceramic fastener includes a ceramic body portion, and a containment layer disposed around the ceramic body portion. The containment layer retains pieces of the ceramic body portion when the ceramic body portion is subjected to a torque sufficient to fracture the ceramic body portion. The fastener can be a nut, and the containment layer can be disposed around one or more of the top, bottom and side surfaces of the nut. The containment layer can be a metal shroud having a thickness from 0.01 to 0.125 inches. The ceramic body portion can be alumina or zirconia. A thread insert may be disposed within a fastener bore of the ceramic body portion.
摘要翻译：陶瓷紧固件包括陶瓷主体部分和围绕陶瓷主体部分设置的容纳层。当陶瓷体部分受到足以使陶瓷体部分断裂的扭矩时，容纳层保持陶瓷体部分的部分。紧固件可以是螺母，并且容纳层可以设置在螺母的顶部，底部和侧面的一个或多个上。容纳层可以是厚度为0.01至0.125英寸的金属护罩。陶瓷体部分可以是氧化铝或氧化锆。螺纹插入件可以设置在陶瓷体部分的紧固件孔内。

2. 发明授权

US10974276B2 Hydrophobic shafts for use in process chambers 有权
公开(公告)号：US10974276B2
公开(公告)日：2021-04-13
申请号：US16737383
申请日：2020-01-08
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Ernest E. Allen, Jr. , Jonathan David Fischer , Jeffrey E. Krampert
IPC分类号： B05D5/08 , B05D1/28 , C23C14/00
摘要： A system that reduces the amount of water that enters a process chamber via a movable shaft is disclosed. The surface of the shaft is made hydrophobic. Any water droplets that are collected on the hydrophobic shaft are disposed at a high contact angle, making it more likely that these water droplets fall from the shaft. Further, any water that enters the process chamber is more readily removed from the shaft due to the lower energy of liberation. Reducing the amount of water in a process chamber may improve the lifetime of the components in the process chamber and may improve the yield of the workpieces being processed. This may be especially relevant when process gasses that contain halogens are employed.

3. 发明申请

US20150176625A1 CONTAINED CERAMIC FASTENER 有权
标题翻译：含陶瓷紧固件
公开(公告)号：US20150176625A1
公开(公告)日：2015-06-25
申请号：US14134154
申请日：2013-12-19
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Michael A. Schrameyer , Jeffrey E. Krampert
IPC分类号： F16B33/02 , F16B37/12 , F16B37/00
CPC分类号： F16B33/02 , F16B33/006 , F16B37/00 , F16B37/12
摘要： A ceramic fastener includes a ceramic body portion, and a containment layer disposed around the ceramic body portion. The containment layer retains pieces of the ceramic body portion when the ceramic body portion is subjected to a torque sufficient to fracture the ceramic body portion. The fastener can be a nut, and the containment layer can be disposed around one or more of the top, bottom and side surfaces of the nut. The containment layer can be a metal shroud having a thickness from 0.01 to 0.125 inches. The ceramic body portion can be alumina or zirconia. A thread insert may be disposed within a fastener bore of the ceramic body portion.
摘要翻译：陶瓷紧固件包括陶瓷主体部分和围绕陶瓷主体部分设置的容纳层。当陶瓷体部分受到足以使陶瓷体部分断裂的扭矩时，容纳层保持陶瓷体部分的部分。紧固件可以是螺母，并且容纳层可以设置在螺母的顶部，底部和侧面的一个或多个上。容纳层可以是厚度为0.01至0.125英寸的金属护罩。陶瓷体部分可以是氧化铝或氧化锆。螺纹插入件可以设置在陶瓷体部分的紧固件孔内。

4. 发明授权

US10569299B2 Hydrophobic shafts for use in process chambers 有权
公开(公告)号：US10569299B2
公开(公告)日：2020-02-25
申请号：US15941084
申请日：2018-03-30
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Ernest E. Allen, Jr. , Jonathan David Fischer , Jeffrey E. Krampert
IPC分类号： B05D5/08 , B05D1/28 , C23C14/00
摘要： A system that reduces the amount of water that enters a process chamber via a movable shaft is disclosed. The surface of the shaft is made hydrophobic. Any water droplets that are collected on the hydrophobic shaft are disposed at a high contact angle, making it more likely that these water droplets fall from the shaft. Further, any water that enters the process chamber is more readily removed from the shaft due to the lower energy of liberation. Reducing the amount of water in a process chamber may improve the lifetime of the components in the process chamber and may improve the yield of the workpieces being processed. This may be especially relevant when process gasses that contain halogens are employed.

5. 发明申请

US20190299249A1 Hydrophobic Shafts For Use In Process Chambers 审中-公开
公开(公告)号：US20190299249A1
公开(公告)日：2019-10-03
申请号：US15941084
申请日：2018-03-30
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Ernest E. Allen, JR. , Jonathan David Fischer , Jeffrey E. Krampert
IPC分类号： B05D5/08 , B05D1/28
摘要： A system that reduces the amount of water that enters a process chamber via a movable shaft is disclosed. The surface of the shaft is made hydrophobic. Any water droplets that are collected on the hydrophobic shaft are disposed at a high contact angle, making it more likely that these water droplets fall from the shaft. Further, any water that enters the process chamber is more readily removed from the shaft due to the lower energy of liberation. Reducing the amount of water in a process chamber may improve the lifetime of the components in the process chamber and may improve the yield of the workpieces being processed. This may be especially relevant when process gasses that contain halogens are employed.

6. 发明授权

US09212949B2 Technique for temperature measurement and calibration of semiconductor workpieces using infrared 有权
标题翻译：使用红外线测量和校准半导体工件的技术
公开(公告)号：US09212949B2
公开(公告)日：2015-12-15
申请号：US14228802
申请日：2014-03-28
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jeffrey E. Krampert , Roger B. Fish
IPC分类号： G01J5/02 , G01K15/00 , G01J5/00
CPC分类号： G01J5/02 , G01J5/0007 , G01J5/522 , G01J2005/0051 , G01K15/005 , H01J37/20 , H01J37/3171 , H01J2237/2065 , H01J2237/31701 , H01L21/67248
摘要： An improved system and method of measuring the temperature of a workpiece in a processing chamber is disclosed. Because silicon has very low emissivity in the infrared band, a coating is disposed on at least a portion of the workpiece. This coating may be graphite or any other material that can be readily applied, and has a relatively constant emissivity over temperature in the infrared spectrum. In one embodiment, a coating of graphite is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. This technique can be used to calibrate a processing chamber, validate operating conditions within the processing chamber, or to develop a manufacturing process.
摘要翻译：公开了一种在处理室中测量工件的温度的改进的系统和方法。由于硅在红外波段具有非常低的发射率，所以在工件的至少一部分上设置涂层。该涂层可以是石墨或可以容易地施加的任何其它材料，并且在红外光谱中具有相对恒定的发射率。在一个实施例中，将石墨涂层施加到工件的一部分上，通过观察涂层的温度来测量工件的温度。该技术可用于校准处理室，验证处理室内的操作条件或开发制造过程。

7. 发明申请

US20150276487A1 Technique For Temperature Measurement And Calibration Of Semiconductor Workpieces Using Infrared 有权
标题翻译：使用红外线测量和校准半导体工件的技术
公开(公告)号：US20150276487A1
公开(公告)日：2015-10-01
申请号：US14228802
申请日：2014-03-28
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jeffrey E. Krampert , Roger B. Fish
IPC分类号： G01J5/02 , H01J37/317
CPC分类号： G01J5/02 , G01J5/0007 , G01J5/522 , G01J2005/0051 , G01K15/005 , H01J37/20 , H01J37/3171 , H01J2237/2065 , H01J2237/31701 , H01L21/67248
摘要： An improved system and method of measuring the temperature of a workpiece in a processing chamber is disclosed. Because silicon has very low emissivity in the infrared band, a coating is disposed on at least a portion of the workpiece. This coating may be graphite or any other material that can be readily applied, and has a relatively constant emissivity over temperature in the infrared spectrum. In one embodiment, a coating of graphite is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. This technique can be used to calibrate a processing chamber, validate operating conditions within the processing chamber, or to develop a manufacturing process.
摘要翻译：公开了一种在处理室中测量工件的温度的改进的系统和方法。由于硅在红外波段具有非常低的发射率，所以在工件的至少一部分上设置涂层。该涂层可以是石墨或可以容易地施加的任何其它材料，并且在红外光谱中具有相对恒定的发射率。在一个实施例中，将石墨涂层施加到工件的一部分上，通过观察涂层的温度来测量工件的温度。该技术可用于校准处理室，验证处理室内的操作条件或开发制造过程。

8. 发明申请

US20150071327A1 GAS COUPLED PROBE FOR SUBSTRATE TEMPERATURE MEASUREMENT 有权
标题翻译：用于基板温度测量的气体耦合探头
公开(公告)号：US20150071327A1
公开(公告)日：2015-03-12
申请号：US14022682
申请日：2013-09-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jeffrey E. Krampert , Roger B. Fish
IPC分类号： G01K13/00 , G01K1/14
CPC分类号： G01K13/00 , G01K1/143
摘要： A low pressure temperature sensor for measuring the temperature of a substrate during semiconductor device manufacturing is generally described. Various embodiments describe a gas chamber having an opening disposed within a dielectric plate of a platen with a seal disposed around the opening in the gas chamber such that the opening in the gas chamber may be sealed against the substrate. Furthermore, a temperature sensor and a spring are disposed in the gas chamber, the spring biased to place the temperature sensor in contact with the substrate. Additionally, a gas source configured to pressurize the gas chamber with a low pressure gas in order to increase thermal conductivity between the substrate and the temperature sensor is provided.
摘要翻译：通常描述用于在半导体器件制造期间测量衬底的温度的低压温度传感器。各种实施例描述了一种气室，其具有设置在压板的电介质板内的开口，其具有围绕气室中的开口设置的密封件，使得气体室中的开口可以密封抵靠衬底。此外，温度传感器和弹簧设置在气室中，弹簧被偏压以使温度传感器与基板接触。此外，提供一种气源，其被配置为利用低压气体对气室进行加压，以增加基板和温度传感器之间的导热性。

9. 发明授权

US09865433B1 Gas injection system for ion beam device 有权
公开(公告)号：US09865433B1
公开(公告)日：2018-01-09
申请号：US15489182
申请日：2017-04-17
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jay Wallace , Ernest E. Allen , Richard J. Hertel , Alexander C. Kontos , Shurong Liang , Jeffrey E. Krampert , Tyler Rockwell
IPC分类号： H01J37/32 , H01J37/305
CPC分类号： H01J37/32449 , H01J37/3056 , H01J2237/006 , H01J2237/3174 , H01J2237/31749
摘要： A gas injection system, including an extraction plate having an extraction aperture for allowing passage of an ion beam through the extraction plate, the extraction plate further having a gas slot for expulsion of a residue removal gas from the extraction plate. The gas injection system may include a gas conduit extending through the extraction plate between the gas slot and a gas manifold, a gas source connected in fluid communication with the gas manifold, the gas source containing the residue removal gas. The gas manifold may include a valve adjustable between a first position, wherein the residue removal gas is allowed to flow into the extraction plate, and a second portion, wherein the residue removal gas can be vented from the extraction plate. The gas injection system may further include a manifold cover coupled to the gas manifold.

10. 发明授权

US09417138B2 Gas coupled probe for substrate temperature measurement 有权
标题翻译：用于衬底温度测量的气体耦合探头
公开(公告)号：US09417138B2
公开(公告)日：2016-08-16
申请号：US14022682
申请日：2013-09-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jeffrey E. Krampert , Roger B. Fish
IPC分类号： G01K13/00 , G01K1/14
CPC分类号： G01K13/00 , G01K1/143
摘要： A low pressure temperature sensor for measuring the temperature of a substrate during semiconductor device manufacturing is generally described. Various embodiments describe a gas chamber having an opening disposed within a dielectric plate of a platen with a seal disposed around the opening in the gas chamber such that the opening in the gas chamber may be sealed against the substrate. Furthermore, a temperature sensor and a spring are disposed in the gas chamber, the spring biased to place the temperature sensor in contact with the substrate. Additionally, a gas source configured to pressurize the gas chamber with a low pressure gas in order to increase thermal conductivity between the substrate and the temperature sensor is provided.
摘要翻译：通常描述用于在半导体器件制造期间测量衬底的温度的低压温度传感器。各种实施例描述了一种气室，其具有设置在压板的电介质板内的开口，其具有围绕气室中的开口设置的密封件，使得气体室中的开口可以密封抵靠衬底。此外，温度传感器和弹簧设置在气室中，弹簧被偏压以使温度传感器与基板接触。此外，提供一种气源，其被配置为利用低压气体对气室进行加压，以增加基板和温度传感器之间的导热性。

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