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    • 2. 发明授权
    • Method of increasing the lubricant retention of magnetic disks
    • 增加磁盘润滑剂保留的方法
    • US4940606A
    • 1990-07-10
    • US456758
    • 1989-12-26
    • Heinz HilgersRainer MorbitzerJohannes Windeln
    • Heinz HilgersRainer MorbitzerJohannes Windeln
    • G11B5/702G11B5/84G11B5/842
    • G11B5/84G11B5/7028Y10S428/90
    • The invention concerns a method of increasing the lubricant retention of a magnetic layer, wherein a magnetic layer, containing magnetic particles dispersed in a curable organic binder system and organic solvents and an additive, is cured in a two-step process, wherein the magnetic layer, in a first step, is heated in an inert gas for a given time to a given temperature and, in a second step, in an inert gas to which oxygen has been added, for a given time to a given temperature. According to a preferred embodiment of the invention, the magnetic layer with polyvinyl methyl ether (PVME) as an additive is heated in nitrogen for 2.5 hours to 234.degree. C. and, after cooling down, in a nitrogen atmosphere containing 30 vol % oxygen for 60 minutes to 234.degree. C. In the first step, this kind of curing leads to polymerization of the binder and phase separation of PVME and in the second step of oxidation of PVME, forming a plurality of pores in the magnetic layer.
    • 本发明涉及增加磁性层的润滑剂保留性的方法,其中包含分散在可固化有机粘合剂体系中的磁性颗粒的磁性层和有机溶剂和添加剂在两步法中固化,其中磁性层 在第一步骤中,在惰性气体中加热给定时间至给定温度,并且在第二步骤中,在已加入氧气的惰性气体中给定给定温度的给定时间。 根据本发明的优选实施方案,将具有聚乙烯基甲基醚(PVME)作为添加剂的磁性层在氮气中加热2.5小时至234℃,并在冷却后在含有30体积%氧气的氮气氛中 60分钟至234℃。在第一步中,这种固化导致粘合剂的聚合和PVME的相分离,以及PVME氧化的第二步骤,在磁性层中形成多个孔。
    • 7. 发明申请
    • PACKAGING A SEMICONDUCTOR WAFER
    • 包装半导体波形
    • US20090096589A1
    • 2009-04-16
    • US12248193
    • 2008-10-09
    • Hartmut KuehlJoerg WeyerhaeuserJohannes Windeln
    • Hartmut KuehlJoerg WeyerhaeuserJohannes Windeln
    • H04Q5/22
    • H01L21/67248G06K2017/0087H01L21/67294H01L23/544H01L2223/54446H01L2924/0002H04Q2213/13095H01L2924/00
    • Embodiments embed at least one Radio Frequency Identification (RFID) tag into the mold. The mold may comprise a cavity adapted to the geometrical form of the RFID tag. In some embodiments, the cavity is marginally bigger than the RFID tag. In many embodiments, the cavity with the embedded the RFID tag is covered by glue. Thus, the mold, the RFID tag and the glue may be suitable for temperatures up to, e.g., 400° C. Further the mold and the glue may be resistant to concentrated sulfuric acid and formic acid. The serial number of the mold may be stored in the RFID tag. The RFID tag may detect characteristic data during the transfer of the solder from the mold to the wafer. In one embodiment, the RFID tag may detect the temperature. In another embodiment, a plurality of RFID tags may detect various temperatures for controlling the packaging process.
    • 实施例将至少一个射频识别(RFID)标签嵌入到模具中。 模具可以包括适于RFID标签的几何形状的空腔。 在一些实施例中,空腔比RFID标签略大。 在许多实施例中,嵌入有RFID标签的空腔被胶水覆盖。 因此,模具,RFID标签和胶可以适用于高达例如400℃的温度。此外,模具和胶可以耐浓硫酸和甲酸。 模具的序列号可以存储在RFID标签中。 RFID标签可以在将焊料从模具转移到晶片期间检测特征数据。 在一个实施例中,RFID标签可以检测温度。 在另一个实施例中,多个RFID标签可以检测用于控制包装过程的各种温度。