会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Relay method of transport bearer, apparatus and communication system
    • 传输承载,设备和通信系统的中继方法
    • US08792410B2
    • 2014-07-29
    • US13370732
    • 2012-02-10
    • Weimin ChenGauquan Lin
    • Weimin ChenGauquan Lin
    • H04B7/14H04W28/06H04W84/04
    • H04W28/06H04W84/047
    • Embodiments of the present invention disclose a relay method of a transport bearer, an apparatus and a communication system. According to the technical solutions in the present invention, when receiving information encapsulated by a source device and sent by the source device, a relay base station first decapsulates the information, encapsulates the information again, and then sends the encapsulated information to a host device, thus ensuring that the information has only a layer of encapsulation in the transport procedure, so as to avoid a case that a high overhead caused by two layers of encapsulation occurs in the transport procedure. Compared with the prior art, the overhead in the transport procedure may be reduced, and the transport efficiency may be increased.
    • 本发明的实施例公开了传输承载的中继方法,装置和通信系统。 根据本发明的技术方案,当接收到由源设备封装并由源设备发送的信息时,中继基站首先对信息进行解封装,再次封装信息,然后将封装的信息发送到主机设备, 从而确保信息在传输过程中仅具有一层封装,以避免在传输过程中发生由两层封装引起的高开销的情况。 与现有技术相比,可以降低运输过程中的开销,并且可以提高运输效率。
    • 2. 发明授权
    • Thin semiconductor package and method for manufacturing same
    • 薄半导体封装及其制造方法
    • US08354739B2
    • 2013-01-15
    • US13092159
    • 2011-04-22
    • Yeqing SuZhigang BaiWeimin ChenWei ShenJianhong WangBaoguan YinWanming Yu
    • Yeqing SuZhigang BaiWeimin ChenWei ShenJianhong WangBaoguan YinWanming Yu
    • H01L23/495H01L21/28
    • H01L21/6835H01L21/568H01L23/3107H01L23/49541H01L24/48H01L24/85H01L2224/05554H01L2224/48091H01L2224/48247H01L2224/8501H01L2924/00014H01L2924/18165H01L2224/45099
    • A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
    • 一种用于制造薄半导体封装的方法,包括:提供具有可移除基板的引线框架,该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成,并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面,其上具有焊盘,并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装,使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面,然后将管芯焊盘电连接到相应的引线。 然后,管芯和引线框架用第二密封剂封装,使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。
    • 3. 发明授权
    • Method for realizing data forwarding, network system, and device
    • 实现数据转发,网络系统和设备的方法
    • US08761076B2
    • 2014-06-24
    • US13246965
    • 2011-09-28
    • Weimin ChenGaoquan LinSaixiang Fu
    • Weimin ChenGaoquan LinSaixiang Fu
    • H04N7/14H04W84/04H04L1/18H04W28/06
    • H04W84/047H04L1/1887H04W28/06
    • A method for realizing data forwarding, a network system, and a related device are provided. The method includes: receiving data sent from an external device; and judging whether the data is from or to a backhaul terminal, and directly forwarding the data if the data is from or to the backhaul terminal. A Base Station (BS) device includes: a receiving module, configured to receive data sent from an external device; a backhaul judging module, configured to judge whether the data is from or to a backhaul terminal; and a sending module, configured to directly forward the data after the backhaul judging module judges that the data is from or to the backhaul terminal. A backhaul terminal and a network system are further correspondingly provided. Accordingly, transmission bandwidth is saved through the provided technical solutions.
    • 提供了实现数据转发的方法,网络系统和相关设备。 该方法包括:接收从外部设备发送的数据; 并且判断数据是来自还是回传终端,以及如果数据来自或者回程终端,则直接转发数据。 基站(BS)装置包括:接收模块,用于接收从外部设备发送的数据; 回程判断模块,被配置为判断所述数据是来自还是回传终端; 以及发送模块,被配置为在所述回程判断模块判断所述数据来自所述回程终端或者回程终端之后直接转发所述数据。 进一步相应地提供回程终端和网络系统。 因此,通过提供的技术方案节省了传输带宽。
    • 7. 发明申请
    • METHOD FOR REALIZING DATA FORWARDING, NETWORK SYSTEM, AND DEVICE
    • 用于实现数据转发的方法,网络系统和设备
    • US20120014314A1
    • 2012-01-19
    • US13246965
    • 2011-09-28
    • Weimin ChenGaoquan LinSaixiang Fu
    • Weimin ChenGaoquan LinSaixiang Fu
    • H04W40/00H04L12/54
    • H04W84/047H04L1/1887H04W28/06
    • A method for realizing data forwarding, a network system, and a related device are provided. The method includes: receiving data sent from an external device; and judging whether the data is from or to a backhaul terminal, and directly forwarding the data if the data is from or to the backhaul terminal. A Base Station (BS) device includes: a receiving module, configured to receive data sent from an external device; a backhaul judging module, configured to judge whether the data is from or to a backhaul terminal; and a sending module, configured to directly forward the data after the backhaul judging module judges that the data is from or to the backhaul terminal. A backhaul terminal and a network system are further correspondingly provided. Accordingly, transmission bandwidth is saved through the provided technical solutions.
    • 提供了实现数据转发的方法,网络系统和相关设备。 该方法包括:接收从外部设备发送的数据; 并且判断数据是来自还是回传终端,以及如果数据来自或者回程终端,则直接转发数据。 基站(BS)装置包括:接收模块,用于接收从外部设备发送的数据; 回程判断模块,被配置为判断所述数据是来自还是回传终端; 以及发送模块,被配置为在所述回程判断模块判断所述数据来自所述回程终端或者回程终端之后直接转发所述数据。 进一步相应地提供回程终端和网络系统。 因此,通过提供的技术方案节省了传输带宽。
    • 8. 发明申请
    • THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
    • 薄半导体封装及其制造方法
    • US20110316130A1
    • 2011-12-29
    • US13092159
    • 2011-04-22
    • Yeqing SuZhigang BaiWeimin ChenWei ShenJianhong WangBaoguan YinWanming Yu
    • Yeqing SuZhigang BaiWeimin ChenWei ShenJianhong WangBaoguan YinWanming Yu
    • H01L23/495H01L21/28
    • H01L21/6835H01L21/568H01L23/3107H01L23/49541H01L24/48H01L24/85H01L2224/05554H01L2224/48091H01L2224/48247H01L2224/8501H01L2924/00014H01L2924/18165H01L2224/45099
    • A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
    • 一种用于制造薄半导体封装的方法,包括:提供具有可移除基板的引线框架,该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成,并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面,其上具有焊盘,并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装,使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面,然后将管芯焊盘电连接到相应的引线。 然后,管芯和引线框架用第二密封剂封装,使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。
    • 10. 发明授权
    • Suspending hydraulic pillar
    • 悬挂液压柱
    • US07717649B2
    • 2010-05-18
    • US12083744
    • 2005-12-31
    • Bingwen LiJiyun ZhaoQiguang WangShiqi ChenJianwu WangWeimin Chen
    • Bingwen LiJiyun ZhaoQiguang WangShiqi ChenJianwu WangWeimin Chen
    • E21D15/44
    • E21D15/44
    • A suspending hydraulic pillar includes an oil cylinder, a movable prop, a handle-valve body, a reset spring, a top cover, a bottom seat, a three-way valve, a position-limiting steel wire, and a guide ring. The handle-valve body is provided between a port of the oil cylinder port and the moveable prop. Position-limiting steel wire, a guiding ring, and an oil inlet is located on a lower part of the moveable prop. The three-way valve is provided in the handle-valve body. A dust-prevention ring and a sealing ring are provided between the handle-valve body, the movable prop, and the oil cylinder. The handle-valve body is fixed on the oil cylinder by means of a connecting steel wire. The handle-valve body does not move up and down as the movable prop telescopically extends or contracts. The suspending hydraulic has good stability, high strength and supporting force, good sealing, and high anti-erosive capability.
    • 悬挂液压柱包括油缸,可动支柱,手柄阀体,复位弹簧,顶盖,底座,三通阀,限位钢丝和导向环。 手柄阀体设置在油缸端口和可移动支架之间。 位置限制钢丝,导向环和进油口位于可移动支柱的下部。 三通阀设在手柄阀体内。 手柄阀体,可动支柱和油缸之间设有防尘圈和密封圈。 手柄阀体通过连接钢丝固定在油缸上。 当可移动支柱可伸缩地伸展或收缩时,手柄阀体不会上下移动。 悬挂液压稳定性好,强度高,支撑力大,密封性好,抗腐蚀能力强。