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    • 7. 发明申请
    • DEFECT OBSERVATION METHOD AND DEVICE THEREFOR
    • 缺陷观察方法及其设备
    • US20140204194A1
    • 2014-07-24
    • US14116132
    • 2012-04-27
    • Yuko OtaniToshifumi HondaYuta Urano
    • Yuko OtaniToshifumi HondaYuta Urano
    • G01N21/95G02B26/00
    • G01N21/9505G01B11/00G01B11/02G01B15/00G01N21/47G01N21/9501G01N2021/4711G01N2021/8822G01N2021/8867G02B26/008H01L22/12H01L2924/0002H01L2924/00
    • This invention relates to a method for performing an analysis of defective material and the refractive index, and a three-dimensional analysis of very small pattern shapes including the steps of imaging by a scanning electron microscope to acquire an image of the position of a defect under observation using information of inspection results obtained by an optical inspection device, creating a model of the defect by using the acquired image of the defect under observation, calculating the values detected by the detector when reflected and scattered light emitted from a defect model is received by the detector when light is irradiated onto the defect model thus created, comparing the detection values thus calculated and the values detected by the detector, which has received light actually reflected and scattered from the sample, to obtain information relating to the height of the defect under observation, the material, or the refractive index.
    • 本发明涉及一种用于对缺陷物质进行分析的方法和折射率,以及非常小的图案形状的三维分析,包括以下步骤:通过扫描电子显微镜成像以获得缺陷位置的图像 观察使用由光学检查装置获得的检查结果的信息,通过使用获取的观察缺陷图像来产生缺陷的模型,计算当从缺陷模型发射的反射和散射光被反射和检测到的值时检测到的值被接收到 当将光照射到如此产生的缺陷模型上时,将检测器与这样计算的检测值进行比较,并将接收到从样品实际反射和散射的光的检测器检测到的值进行比较,以获得与缺陷的高度有关的信息 观察,材料或折射率。
    • 8. 发明申请
    • METHOD AND APPARATUS FOR OBSERVING DEFECTS
    • 用于观察缺陷的方法和装置
    • US20130277553A1
    • 2013-10-24
    • US13993838
    • 2011-11-10
    • Yuko OtaniYuta UranoToshifumi Honda
    • Yuko OtaniYuta UranoToshifumi Honda
    • H01J37/26
    • H01J37/261G01N21/8806G01N21/9501
    • Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.
    • 公开了通过使用SEM观察缺陷的方法和装置,其中为了以高速和高灵敏度观察晶片上的缺陷,通过其他检查被光学检查和检测的样品上的缺陷的位置信息 获取了由其他检查装置执行的光学检查条件的信息,并根据所获得的信息,基于检测到的信息光学地检测放置在工作台上的样品上的缺陷 对放置在工作台上的样品上的缺陷的位置信息进行校正,由其他检查装置检查和检测的缺陷的位置信息被校正,然后通过SEM观察放置在工作台上的样品上的缺陷, 校正了缺陷的位置信息。