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1. 发明授权

US08010212B2 Fuzzy control method for adjusting a semiconductor machine 有权
标题翻译：用于调整半导体机器的模糊控制方法
公开(公告)号：US08010212B2
公开(公告)日：2011-08-30
申请号：US12241568
申请日：2008-09-30
申请人： Yi Feng Lee , Tzu-Cheng Lin , Chun Chi Chen , Yun-Zong Tian
发明人： Yi Feng Lee , Tzu-Cheng Lin , Chun Chi Chen , Yun-Zong Tian
IPC分类号： G05B13/02
CPC分类号： G05B13/0275 , G06N99/005 , Y10S706/904
摘要： A method of fuzzy control for adjusting a semiconductor machine comprising: providing measurement values from first the “parameter of a pre-semiconductor manufacturing process”, second the “parameter of the semiconductor manufacturing process”, and third the “operation parameter of the semiconductor manufacturing process”; performing a fuzzy control to define two inputs and one output corresponding to the measurement values, wherein the difference between the first and third values, and the difference between the second and third values, forms the two inputs, then from the two inputs one target output is calculated by fuzzy inference; finally, determining if the target output is in or out of an acceptable range. Whereby the target output is the “machine control parameter of the semiconductor manufacturing process” and when within an acceptable range is used for adjusting the semiconductor machine.
摘要翻译：一种用于调整半导体机器的模糊控制方法，包括：首先从“半导体制造工艺的参数”提供测量值，第二个“半导体制造工艺的参数”，第三个“半导体制造的操作参数处理”; 执行模糊控制以定义对应于测量值的两个输入和一个输出，其中第一和第三值之间的差异以及第二和第三值之间的差异形成两个输入，然后从两个输入一个目标输出通过模糊推理计算; 最后，确定目标输出是否在可接受的范围之内。由此，目标输出是“半导体制造工序的机器控制参数”，并且在可接受范围内用于调整半导体机器时。

2. 发明申请

US20090197354A1 SYSTEM AND METHOD FOR MONITORING MANUFACTURING PROCESS 审中-公开
标题翻译：用于监测制造过程的系统和方法
公开(公告)号：US20090197354A1
公开(公告)日：2009-08-06
申请号：US12144488
申请日：2008-06-23
申请人： Tzu-Cheng Lin , Yun-Zong Tian , Chun-Chi Chen , Yi-Feng Lee
发明人： Tzu-Cheng Lin , Yun-Zong Tian , Chun-Chi Chen , Yi-Feng Lee
IPC分类号： H01L21/66 , G06T11/20
CPC分类号： G05B19/41875 , G05B2219/32196 , G05B2219/45031 , Y02P90/22
摘要： A system and method for monitoring a manufacturing process are provided. A wafer is provided. Process parameters of a manufacturing machine are in-situ measured and recorded if the wafer is processed in the manufacturing machine. A wafer measured value of the wafer is measured after the wafer has been processed. The process parameters are transformed into a process summary value. A two dimensional orthogonal chart with a first axis representing the wafer measured value and a second axis representing the process summary value is provided. The two dimensional orthogonal chart includes a close-loop control limit. A visualized point representing the wafer measured value and the process summary value is displayed on the two dimensional orthogonal chart.
摘要翻译：提供了一种用于监视制造过程的系统和方法。提供晶片。如果在制造机器中处理晶片，则原位测量和记录制造机器的工艺参数。在晶片处理后测量晶片的晶圆测量值。过程参数被转换为过程摘要值。提供具有表示晶片测量值的第一轴的二维正交图和表示处理总结值的第二轴。二维正交图包括闭环控制极限。表示晶圆测量值和过程总结值的可视化点显示在二维正交图上。

3. 发明授权

US08090668B2 Method for predicting cycle time 有权
标题翻译：预测周期时间的方法
公开(公告)号：US08090668B2
公开(公告)日：2012-01-03
申请号：US12243301
申请日：2008-10-01
申请人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Tsung-Wei Lin
发明人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Tsung-Wei Lin
IPC分类号： G06F15/18 , G06E1/00
CPC分类号： G06F17/30598 , G06Q10/06
摘要： A method for predicting cycle time comprises the steps of: collecting a plurality of known sets of data; using a clustering method to classify the known sets of data into a plurality of clusters; using a decision tree method to build a classification rule of the clusters; building a prediction model of each cluster; preparing data predicted set of data; using the classification rule to determine that to which clusters the predicted set of data belongs; and using the prediction model of the cluster to estimate the objective cycle time of the predicted set of data. Therefore, engineers can beforehand know the cycle time that one lot of wafers spend in the forward fabrication process, which helps engineers to properly arrange the following fabrication process of the lot of wafer.
摘要翻译：一种用于预测周期时间的方法包括以下步骤：收集多个已知的数据集; 使用聚类方法将已知的数据集合分类成多个聚类; 使用决策树方法构建集群的分类规则; 构建每个群集的预测模型; 准备数据预测数据集; 使用分类规则来确定预测的数据集合属于哪个集群; 并使用群集的预测模型来估计预测数据集的目标周期时间。因此，工程师可以事先知道大量晶圆在正向制造过程中花费的周期时间，这有助于工程师正确布置晶圆批次的以下制造工艺。

4. 发明申请

US20100234978A1 METHOD FOR FINDING THE CORRELATION BETWEEN THE TOOL PM AND THE PRODUCT YIELD 有权
标题翻译：发现工具PM与产品之间的相关性的方法
公开(公告)号：US20100234978A1
公开(公告)日：2010-09-16
申请号：US12507396
申请日：2009-07-22
申请人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
发明人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
IPC分类号： G06F17/00
CPC分类号： G06Q10/06
摘要： A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.
摘要翻译：公开了一种用于找到工具PM（防止维护）与工具的产品收益之间的相关性的方法。该方法使用移动平均法来放大由PM和PM之后的预定日期捕获的产品产量数据形成的曲线趋势。放大曲线趋势由累积和图表示。分析累积总和图，通知相关工作者工具PM与产品产量之间的影响，以准确估计PM定时。因此，通过该方法，可以确定工具PM和产品产量之间的效果，其作为工人进一步执行PM的重要参考。

5. 发明授权

US07855086B2 Method for monitoring fabrication parameter 有权
标题翻译：监测制造参数的方法
公开(公告)号：US07855086B2
公开(公告)日：2010-12-21
申请号：US12469051
申请日：2009-05-20
申请人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen
发明人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen
IPC分类号： H01L21/00
CPC分类号： G05B19/41875 , G05B2219/31483 , G05B2219/32191 , G05B2219/45031 , H01L22/20 , Y02P90/22
摘要： A method for monitoring fabrication parameters comprises steps of: obtaining a normal parameter variance curve and a comparing parameter variance curve; defining a plurality of normal parameter points on the normal parameter variance curve; defining a plurality of comparing parameter points on the comparing parameter variance curve; finding out the corresponding comparing parameter points nearest to the normal parameter points; calculating the distances between the normal parameter points and the corresponding comparing parameter points thereof; summing up the distances so as to receive a total distance; and determining whether or not the total distance exceeds a limit. Via this arrangement, when fabrication parameter of tool is abnormal, it can be efficiently and immediately determined.
摘要翻译：一种用于监测制造参数的方法包括以下步骤：获得正常参数方差曲线和比较参数方差曲线; 在正常参数方差曲线上定义多个正常参数点; 在比较参数方差曲线上定义多个比较参数点; 找出最接近正常参数点的相应比较参数点; 计算正常参数点与其对应的比较参数点之间的距离; 总结距离，以获得总距离; 并确定总距离是否超过限制。通过这种布置，当工具的制造参数异常时，可以有效且立即确定。

6. 发明授权

US08244500B2 Method of adjusting wafer processing sequence 有权
标题翻译：调整晶圆加工顺序的方法
公开(公告)号：US08244500B2
公开(公告)日：2012-08-14
申请号：US12476559
申请日：2009-06-02
申请人： Yun-Zong Tian , Chun Chi Chen , Yi Feng Lee , Wei Jun Chen , Shih Chang Kao , Yij Chieh Chu , Cheng-Hao Chen
发明人： Yun-Zong Tian , Chun Chi Chen , Yi Feng Lee , Wei Jun Chen , Shih Chang Kao , Yij Chieh Chu , Cheng-Hao Chen
IPC分类号： G06F11/30 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32015 , G05B2219/32016 , G05B2219/32019 , G05B2219/45031 , Y02P90/20
摘要： A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.
摘要翻译：调整晶片工艺顺序的方法包括收集多个批次的生产参数的步骤; 从所述生产参数中选择多个关键参数，其中所述关键参数至少包括处理序列; 定义公式以获得ε值; 通过使用基于密度的噪声空间聚类（DBSCAN），根据ε值和最小点数将批次分组成组。并调整组中批次的处理顺序。因此，具有相同处理配方的批次可以连续或同时发送到机器中，从而减少过程配方的更换或缩短机器空闲时间。

7. 发明授权

US08195431B2 Method for evaluating efficacy of prevention maintenance for a tool 有权
标题翻译：评估工具预防维护功效的方法
公开(公告)号：US08195431B2
公开(公告)日：2012-06-05
申请号：US12566974
申请日：2009-09-25
申请人： Yi Feng Lee , Chun Chi Chen , Shih Chang Kao , Yun-Zong Tian , Wei Jun Chen
发明人： Yi Feng Lee , Chun Chi Chen , Shih Chang Kao , Yun-Zong Tian , Wei Jun Chen
IPC分类号： G06F15/00 , G06F19/00
CPC分类号： G06Q10/00
摘要： A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.
摘要翻译：一种用于评估工具的预防维护功效的方法包括以下步骤：选择已预先维护的工具并选择工具的生产参数; 在用于构建生产参数对时间的变化曲线的时间范围内收集从工具产生的生产参数的值，以移动平均法修改变化曲线; 将变化曲线转换为累计总和图; 并且根据累计总和图来判断在防止维护之后从工具生成的生产参数的值是否比预防维护之前从工具产生的生产参数的值更稳定。因此，如果防止维护后的生产参数的值的变化不稳定，则对该工具的该防止维护的功效被判断为不好。

8. 发明授权

US08170964B2 Method for planning a semiconductor manufacturing process based on users' demands using a fuzzy system and a genetic algorithm model 有权
标题翻译：使用模糊系统和遗传算法模型根据用户需求规划半导体制造过程的方法
公开(公告)号：US08170964B2
公开(公告)日：2012-05-01
申请号：US12471711
申请日：2009-05-26
申请人： Wei Jun Chen , Chun Chi Chen , Yun-Zong Tian , Yi Feng Lee , Tsung-Wei Lin
发明人： Wei Jun Chen , Chun Chi Chen , Yun-Zong Tian , Yi Feng Lee , Tsung-Wei Lin
IPC分类号： G07B15/00
CPC分类号： G06N3/126 , G06N7/02
摘要： A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the optimum semiconductor manufacturing process for users.
摘要翻译：一种基于用户需求的半导体制造过程规划方法，包括以下步骤：建立遗传算法模型并输入数据; 建立一个模糊系统，并设置一个输出参数，代表相邻代的每个成本函数的百分比差; 设置为具有对应于每个输入参数的调制参数，用于调整输出参数的模糊集合; 执行遗传算法动作; 执行模糊推理动作; 消除产生小于规定下限的输出参数的染色体，将产生最大输出参数的剩余染色体定义为最佳染色体，其中遗传算法动作停止在最佳染色体上执行; 然后确定是否已经达到定义数量的世代，如果是，则执行最后一代的最佳染色体; 如果否，继续执行遗传算法动作，从而为用户找到最佳的半导体制造过程。

9. 发明授权

US08032248B2 Method for finding the correlation between the tool PM and the product yield 有权
标题翻译：找出工具PM与产品产量之间的相关性的方法
公开(公告)号：US08032248B2
公开(公告)日：2011-10-04
申请号：US12507396
申请日：2009-07-22
申请人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
发明人： Yi Feng Lee , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
IPC分类号： G06F19/00 , G06F11/30 , G21C17/00 , H03F1/36 , H04B15/00
CPC分类号： G06Q10/06
摘要： A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.
摘要翻译：公开了一种用于找到工具PM（防止维护）与工具的产品收益之间的相关性的方法。该方法使用移动平均法来放大在PM和PM之后的预定日期内捕获的产品产量数据形成的曲线趋势。放大曲线趋势由累积和图表示。分析累积总和图，通知相关工作者工具PM与产品产量之间的影响，以准确估计PM定时。因此，通过该方法，可以确定工具PM和产品产量之间的效果，其作为工人进一步执行PM的重要参考。

10. 发明授权

US08649990B2 Method for detecting variance in semiconductor processes 有权
标题翻译：检测半导体工艺方差的方法
公开(公告)号：US08649990B2
公开(公告)日：2014-02-11
申请号：US13170229
申请日：2011-06-28
申请人： Yij Chieh Chu , Chun Chi Chen , Yun-Zong Tian
发明人： Yij Chieh Chu , Chun Chi Chen , Yun-Zong Tian
IPC分类号： G06F19/00
CPC分类号： G05B23/0221 , G05B2219/37224
摘要： A method of detecting variance by regression model has the following steps. Step 1 is preparing the FDC data and WAT data for analysis. Step 2 is figuring out what latent variable effect of WAT data by Factor Analysis Step 3 is utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components. Step 4 is demonstrating how the tools and FDC data affect WAT data by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.
摘要翻译：通过回归模型检测方差的方法具有以下步骤。步骤1正在准备FDC数据和WAT数据进行分析。第2步是通过因子分析步骤3来确定WAT数据的潜在变量效应是否利用主成分分析将FDC变量的数量减少到少数独立的主成分。第4步演示了工具和FDC数据如何通过分析协方差模型影响WAT数据，并构建FDC，WAT和工具之间的相互关系。相互关系可以显着地指出哪个参数效应WAT。通过这种方法，当WAT异常情况发生时，工程师更容易追踪问题的位置。

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