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1. 发明申请

US20080017877A1 LED packaging structure 有权
标题翻译： LED封装结构
公开(公告)号：US20080017877A1
公开(公告)日：2008-01-24
申请号：US11878252
申请日：2007-07-23
申请人： Hsiao-Chiao Li , Yi-Tsuo Wu
发明人： Hsiao-Chiao Li , Yi-Tsuo Wu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
摘要翻译：发光二极体封装结构包括封装体，红色LED芯片，蓝色LED芯片，绿色LED芯片，封装材料和黄色荧光体。三个LED芯片设置在主体包装的容纳室内并被包装材料覆盖。黄色荧光体与包装材料均匀混合。通过来自LED芯片的三种类型的光的混合形成白光。此外，由黄色荧光粉与蓝色光的激发产生的黄色光与蓝色光的一部分混合，以进一步形成白色光。

2. 发明申请

US20070165417A1 Light-emitting diode backlight module 失效
标题翻译：发光二极管背光模组
公开(公告)号：US20070165417A1
公开(公告)日：2007-07-19
申请号：US11432379
申请日：2006-05-12
申请人： Yi-Tsuo Wu , Robert Yeh
发明人： Yi-Tsuo Wu , Robert Yeh
IPC分类号： H01L33/00 , G09G3/36 , F21V7/04
CPC分类号： G02F1/133606 , G02F1/133603 , G02F1/133609
摘要： An LED backlight module includes a substrate. An LED array, composed of a plurality of red, blue and green lamp LEDs, is mounted on the substrate. A light-mixing chamber is mounted on the substrate and is used to seal the LED array inside. A diffusion sheet is secured inside the light-mixing chamber and is disposed parallel to the substrate. A first prism sheet is secured inside the light-mixing chamber and is disposed parallel to the diffusion sheet. A second prism sheet is secured inside the light-mixing chamber and is disposed parallel to the first prism sheet.
摘要翻译： LED背光模块包括基板。由多个红色，蓝色和绿色LED LED组成的LED阵列安装在基板上。光混合室安装在基板上，用于将LED阵列密封在内部。漫射片被固定在光混合室内并且平行于衬底设置。第一棱镜片被固定在光混合室内并且平行于漫射片设置。第二棱镜片被固定在光混合室内并平行于第一棱镜片设置。

3. 发明申请

US20130215613A1 LED PACKAGING STRUCTURE HAVING IMPROVED THERMAL DISSIPATION AND MECHANICAL STRENGTH 有权
标题翻译：具有改进的热释放和机械强度的LED包装结构
公开(公告)号：US20130215613A1
公开(公告)日：2013-08-22
申请号：US13399027
申请日：2012-02-17
申请人： Yi-Tsuo Wu
发明人： Yi-Tsuo Wu
IPC分类号： F21V29/00 , F21V17/12 , F21V25/00 , F21V21/00
CPC分类号： F21V29/70 , F21K9/20 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/00014
摘要： The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
摘要翻译：本公开涉及一种照明装置。照明装置包括导热基板。导热基板可以包括基板。照明装置还包括印刷电路板（PCB）。 PCB位于导热基板之外。 PCB和导热基板具有不同的材料组成。照明装置还包括位于导热基板上方的光子装置。光子器件可以包括发光二极管（LED）裸片。光子器件热耦合到导热衬底。光子器件电耦合到印刷电路板。照明装置还包括散热结构。散热结构热耦合到导热基板。

4. 发明授权

US08093600B2 LED packaging structure 有权
标题翻译： LED封装结构
公开(公告)号：US08093600B2
公开(公告)日：2012-01-10
申请号：US12615963
申请日：2009-11-10
申请人： Hsiao-Chiao Li , Yi-Tsuo Wu
发明人： Hsiao-Chiao Li , Yi-Tsuo Wu
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
摘要翻译：发光二极体封装结构包括封装体，红色LED芯片，蓝色LED芯片，绿色LED芯片，封装材料和黄色荧光体。三个LED芯片设置在主体包装的容纳室内并被包装材料覆盖。黄色荧光体与包装材料均匀混合。通过来自LED芯片的三种类型的光的混合形成白光。此外，由黄色荧光粉与蓝色光的激发产生的黄色光与蓝色光的一部分混合，以进一步形成白色光。

5. 发明授权

US06993055B2 Resonant cavity device array for WDM application and the fabrication method of the same 失效
标题翻译：用于WDM应用的谐振腔器件阵列及其制造方法
公开(公告)号：US06993055B2
公开(公告)日：2006-01-31
申请号：US10395240
申请日：2003-03-25
申请人： Jyh-Shyang Wang , Yi-Tsuo Wu , Nikolai A. Maleev , Alexey V. Sakharov , Alexey R. Kovsh
发明人： Jyh-Shyang Wang , Yi-Tsuo Wu , Nikolai A. Maleev , Alexey V. Sakharov , Alexey R. Kovsh
IPC分类号： H01S5/00
CPC分类号： B82Y20/00 , H01S5/18311 , H01S5/18313 , H01S5/1833 , H01S5/18372 , H01S5/3432 , H01S5/4087 , H01S5/423
摘要： The specification discloses a resonant cavity device array for wavelength division multiplexing and the method for fabricating it. The structure of the resonant cavity device is selectively formed with an oxide structure, which contains more than one AlxGa1-xAs oxide tuning layer. After the oxidation of AlGaAs, AlGaO is formed to change the refractive index and the thickness, thereby changing and controlling the wavelength of the resonant cavity device. The wavelength variant of each resonant cavity device is determined by the number of layers, thicknesses and compositions of the AlxGa1-xAs oxide tuning layer contained in the selective oxide structure.
摘要翻译：本说明书公开了一种用于波分复用的谐振腔装置阵列及其制造方法。谐振腔装置的结构选择性地形成有包含多于一个Al x Ga 1-x As As氧化物调谐层的氧化物结构。在AlGaAs氧化之后，形成AlGaO以改变折射率和厚度，从而改变和控制谐振腔装置的波长。每个谐振腔装置的波长变化由包含在选择性氧化物中的Al x Ga 1-x As As氧化物调谐层的层数，厚度和组成数量决定结构体。

6. 发明授权

US08783911B2 LED packaging structure having improved thermal dissipation and mechanical strength 有权
标题翻译： LED封装结构具有改善的散热和机械强度
公开(公告)号：US08783911B2
公开(公告)日：2014-07-22
申请号：US13399027
申请日：2012-02-17
申请人： Yi-Tsuo Wu
发明人： Yi-Tsuo Wu
IPC分类号： F21V29/00
CPC分类号： F21V29/70 , F21K9/20 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/00014
摘要： The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
摘要翻译：本公开涉及一种照明装置。照明装置包括导热基板。导热基板可以包括基板。照明装置还包括印刷电路板（PCB）。 PCB位于导热基板之外。 PCB和导热基板具有不同的材料组成。照明装置还包括位于导热基板上的光子器件。光子器件可以包括发光二极管（LED）裸片。光子器件热耦合到导热基底。光子器件电耦合到印刷电路板。照明装置还包括散热结构。散热结构热耦合到导热基板。

7. 发明授权

US08496353B2 Light-emitting diode (LED) module with light sensor configurations for optical feedback 有权
标题翻译：具有光传感器配置的发光二极管（LED）模块，用于光学反馈
公开(公告)号：US08496353B2
公开(公告)日：2013-07-30
申请号：US12881566
申请日：2010-09-14
申请人： Yu-Sheng Tang , Yi-Tsuo Wu
发明人： Yu-Sheng Tang , Yi-Tsuo Wu
IPC分类号： F21V33/00 , F21V9/00 , H05B37/02
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/1305 , H01L2924/13091 , H05B33/0869 , H01L2924/00014 , H01L2924/00
摘要： An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.
摘要翻译：本公开的实施例包括LED模块。提供基板。光传感器位于基板中。 LED芯片附着在基板上。 LED芯片具有第一面和第二面。第二面被具有开口的不透明层覆盖。开口基本上与光传感器对准。光传感器通过开口接收从LED芯片发出的光输出。

8. 发明申请

US20100118532A1 ILLUMINATION DEVICE AND LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：发光装置和发光二极管模块
公开(公告)号：US20100118532A1
公开(公告)日：2010-05-13
申请号：US12615253
申请日：2009-11-09
申请人： Chia-Hao Liang , Chien-Chang Pei , Yi-Tsuo Wu
发明人： Chia-Hao Liang , Chien-Chang Pei , Yi-Tsuo Wu
IPC分类号： F21V5/00 , F21S4/00
CPC分类号： F21S2/005 , F21K9/20 , F21V5/04 , F21V21/005 , F21V21/096 , F21V23/06 , F21Y2113/13 , F21Y2115/10
摘要： A light emitting diode (LED) module including a carrier, a first connector, a plurality of second connectors and a plurality of LEDs is provided. The carrier has a first edge and a plurality of second edges. The first connector is disposed on the first edge of the carrier and electrically connected to the carrier. The second connectors are disposed on the second edges and electrically connected to the carrier respectively. Each of the second connectors may correspond and be electrically connected to the first connector of the other LED module. The LEDs are disposed on the carrier and electrically connected to the carrier.
摘要翻译：提供了包括载体，第一连接器，多个第二连接器和多个LED的发光二极管（LED）模块。载体具有第一边缘和多个第二边缘。第一连接器设置在载体的第一边缘上并电连接至载体。第二连接器设置在第二边缘上并分别电连接至载体。每个第二连接器可以对应并且电连接到另一个LED模块的第一连接器。 LED布置在载体上并电连接到载体上。

9. 发明申请

US20090168403A1 LATERAL LIGHT-EMITTING DIODE BACKLIGHT MODULE 有权
标题翻译：侧向发光二极管背光模块
公开(公告)号：US20090168403A1
公开(公告)日：2009-07-02
申请号：US12344108
申请日：2008-12-24
申请人： Chia-Hsien CHANG , Yi-Tsuo Wu , Hsiao-Chiao Li
发明人： Chia-Hsien CHANG , Yi-Tsuo Wu , Hsiao-Chiao Li
IPC分类号： G09F13/08
CPC分类号： H05K1/021 , F21K9/68 , F21V29/505 , F21V29/70 , F21V29/86 , F21V29/87 , F21V29/89 , H05K1/182 , H05K3/0061 , H05K2201/10106 , H05K2201/10446 , Y10S257/918
摘要： A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.
摘要翻译：侧面发光二极管背光模块包括基座，电路板和至少一个发光二极管，其中基座具有热导体，该电路板具有形成在其表面上的导电焊盘，并且电路板设置在热导体并连接到导热体上。每个发光二极管包括衬底，固定到衬底并连接到热导体的散热器，布置在散热器上的LED芯片并且侧向发射光;以及安装在衬底上并延伸到衬底的导电焊盘的引脚电路板。

10. 发明申请

US20080254393A1 Phosphor coating process for light emitting diode 失效
标题翻译：发光二极管荧光粉涂层工艺
公开(公告)号：US20080254393A1
公开(公告)日：2008-10-16
申请号：US11892002
申请日：2007-08-17
申请人： Tzu-Hao Chao , Yi-Tsuo Wu
发明人： Tzu-Hao Chao , Yi-Tsuo Wu
IPC分类号： G03C5/00
CPC分类号： H01L33/508 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A phosphor coating process for a light-emitting device is described. A light-emitting diode chip is bonded on a substrate. A light-sensitive layer is formed over the light-emitting diode and the substrate. The light-sensitive layer is patterned by a photolithography process to expose an area of the light-emitting diode chip, on which desires a phosphor coating. A phosphor-adhesive material is filled on the area of the light-emitting diode chip.
摘要翻译：描述了用于发光器件的荧光体涂覆方法。发光二极管芯片接合在基板上。在发光二极管和基板上形成感光层。通过光刻工艺来对感光层进行图案化，以暴露需要荧光体涂层的发光二极管芯片的区域。在发光二极管芯片的区域上填充有磷光体粘合剂材料。

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