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1. 发明授权

US07157666B2 Systems for producing semiconductors and members therefor 有权
标题翻译：半导体制造系统及其成员
公开(公告)号：US07157666B2
公开(公告)日：2007-01-02
申请号：US10753583
申请日：2004-01-08
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： C23C16/00 , F27B5/08 , F27B5/16
CPC分类号： F27B17/0025 , F27D11/02 , H01L21/67109
摘要： A member provided around a susceptor for mounting a semiconductor in a chamber of a semiconductor production system. The member has a face opposing the susceptor and a center line average surface roughness of the face opposing the susceptor is 0.5 μm or less. Alternatively, the face opposing the susceptor has a thermal emissivity ε of 0.5 or lower. The member can also be a liner [4] having a supported face [4] whose area is not more than 20 percent of that of the face [4] opposing the susceptor.
摘要翻译：设置在基座周围的构件，用于将半导体安装在半导体生产系统的腔室中。该构件具有与基座相对的面，并且与基座相对的面的中心线平均表面粗糙度为0.5μm以下。或者，与感受器相对的面的热发射率ε为0.5以下。该构件还可以是具有支撑面[4]的衬垫[4]，其面积不大于与感受器相对的面部[4]面积的20％。

2. 发明授权

US07044399B2 Heating systems 有权
标题翻译：加热系统
公开(公告)号：US07044399B2
公开(公告)日：2006-05-16
申请号：US10702131
申请日：2003-11-05
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： F24H3/00
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , C23C16/46
摘要： A heating system 1 has a ceramic substrate 2 having a mounting face 2a for mounting an object W, a back face 2b and a side face 2c; a heating means 3 for generating heat from the mounting face 2a of the ceramic substrate 2; and a plate-shaped supporting metal member 4 for supporting the back face 2b of the ceramic substrate 2. According to the system, the thermal deformation of the mounting face upon heating over time may be reduced and the flatness of the object may be maintained at a low value. It is further possible to impart a mechanical strength to the heater sufficient for its handling and to reduce the production cost.
摘要翻译：加热系统1具有陶瓷基板2，陶瓷基板2具有用于安装物体W的安装面2a，背面2b和侧面2c; 用于从陶瓷基板2的安装面2a产生热量的加热装置3; 以及用于支撑陶瓷基板2的背面2b的板状支撑金属构件4。根据该系统，随着时间的推移，安装面的加热变形可能降低，并且物体的平坦度可以维持在较低的值。进一步可能赋予加热器机械强度足以使其处理并降低生产成本。

3. 发明授权

US07022947B2 Systems for supporting ceramic susceptors 有权
标题翻译：支撑陶瓷感受体的系统
公开(公告)号：US07022947B2
公开(公告)日：2006-04-04
申请号：US10884294
申请日：2004-07-02
申请人： Kazuaki Yamaguchi , Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Kazuaki Yamaguchi , Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： F27B5/14
CPC分类号： H01L21/67103 , F27B17/0025 , F27D5/0037 , H05B3/143
摘要： A support structure for supporting a ceramic susceptor in a chamber is provided. The support structure includes a supporting portion joined with a back face of the ceramic susceptor. The supporting portion includes an inner space that is separated from the atmosphere of the chamber. A cooling system is provided below the supporting portion 6. At least one thermal control portion is provided between the cooling system and the supporting portion for reducing thermal conduction from the susceptor to the cooling system.
摘要翻译：提供了用于在腔室中支撑陶瓷基座的支撑结构。支撑结构包括与陶瓷基座的后表面连接的支撑部分。支撑部分包括与腔室的气氛分离的内部空间。冷却系统设置在支撑部分6的下方。至少一个热控制部分设置在冷却系统和支撑部分之间，用于减少从基座到冷却系统的热传导。

4. 发明授权

US07525071B2 Power-supplying member and heating apparatus using the same 有权
标题翻译：供电部件及使用其的加热装置
公开(公告)号：US07525071B2
公开(公告)日：2009-04-28
申请号：US11406084
申请日：2006-04-18
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/16 , C23C16/00
CPC分类号： H01L21/67103 , H05B3/143
摘要： A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.
摘要翻译：供电构件包括：连接到供电物体的第一杆状构件; 连接到电源的第二杆状构件; 以及热膨胀吸收构件，其设置在所述第一杆状构件和所述第二杆状构件之间，并且响应于所述第一杆状构件和所述第二杆状构件的形状的变化而沿纵向收缩由于热膨胀而在纵向上形成。

5. 发明申请

US20060237442A1 Power-supplying member and heating apparatus using the same 有权
标题翻译：供电部件及使用其的加热装置
公开(公告)号：US20060237442A1
公开(公告)日：2006-10-26
申请号：US11406900
申请日：2006-04-19
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/16 , C23C16/00
CPC分类号： H01L21/67103 , H01L21/68792
摘要： The power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.
摘要翻译：所述供电构件包括：连接到电力供应对象的第一杆状构件; 连接到电源的第二杆状构件; 以及热功能部件，其设置在所述第一杆状部件和所述第二杆状部件之间，并且与所述第一和第二杆状部件相比具有较小的轴向截面面积和较大的表面积。

6. 发明申请

US20060011611A1 Substrate heating apparatus 有权
标题翻译：基板加热装置
公开(公告)号：US20060011611A1
公开(公告)日：2006-01-19
申请号：US11159820
申请日：2005-06-23
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/68
CPC分类号： H01L21/67103 , H05B3/143
摘要： A substrate heating apparatus, comprises a base group including a plurality of bases, which are arranged into substantially a plate with a gap interposed between the bases and form a substrate mounting surface, and a resistance heating element provided for at least one of the bases.
摘要翻译：一种基板加热装置，包括：基部，其包括多个基部，所述基部布置成基本上具有插入在所述基部之间的间隙的板，并形成基板安装表面;以及电阻加热元件，设置在所述基部中的至少一个上。

7. 发明申请

US20050258160A1 Substrate heating device 有权
标题翻译：基板加热装置
公开(公告)号：US20050258160A1
公开(公告)日：2005-11-24
申请号：US11102462
申请日：2005-04-08
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/20 , F23Q7/22 , H01L21/00 , H01L21/02 , H01L21/68 , H01L21/683 , H05B3/02 , H05B3/10 , H05B3/12 , H05B3/74
CPC分类号： H01L21/67103
摘要： A substrate heating device comprises a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate for respective zones into which the heating surface is divided, terminals connected to the resistance heating elements respectively, and lead wires connected to the terminals respectively and wired on an outer surface of the ceramic base plate other than the heating surface.
摘要翻译：基板加热装置包括：陶瓷基板，其具有放置基板的加热面，电阻加热元件，其埋置在陶瓷基板中，用于分别加热面的各个区域，分别与电阻加热元件连接的端子;以及引线分别连接到端子并且接合在除了加热表面之外的陶瓷基板的外表面上。

8. 发明授权

US07247819B2 Substrate heating apparatus 有权
标题翻译：基板加热装置
公开(公告)号：US07247819B2
公开(公告)日：2007-07-24
申请号：US11159820
申请日：2005-06-23
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/68 , H05B3/08
CPC分类号： H01L21/67103 , H05B3/143
摘要： A substrate heating apparatus is provided, including a base group including a plurality of bases, which are arranged substantially into a plate with a gap interposed between the bases, and which form a substrate mounting surface. A resistance heating element provided for at least one of the bases.
摘要翻译：提供了一种基板加热装置，其包括基本上包括多个基座的基体，该基部基本上被布置在板之间，间隙插入在基板之间，并且形成基板安装表面。设置在至少一个基座上的电阻加热元件。

9. 发明授权

US07220320B2 Systems for producing semiconductors and members therefor 有权
标题翻译：半导体制造系统及其成员
公开(公告)号：US07220320B2
公开(公告)日：2007-05-22
申请号：US10753625
申请日：2004-01-08
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H01L21/00 , C23C16/00 , C23C14/00
CPC分类号： C23C16/46 , H01L21/67103 , H01L21/67109 , H01L21/67115
摘要： The present invention provides members that are provided around a susceptor for mounting a semiconductor in a chamber for a semiconductor production system. Each member has a function of independently generating heat to heat the semiconductor, at least by radiation, and preferably, a heat generating element is embedded in each member.
摘要翻译：本发明提供了一种用于将半导体安装在用于半导体生产系统的腔室中的基座周围的构件。每个构件至少通过辐射具有独立产生热量以加热半导体的功能，并且优选地，每个构件中嵌入发热元件。

10. 发明申请

US20060231034A1 Power-supplying member and heating apparatus using the same 有权
公开(公告)号：US20060231034A1
公开(公告)日：2006-10-19
申请号：US11406084
申请日：2006-04-18
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： C23C16/00 , H05B3/16
CPC分类号： H01L21/67103 , H05B3/143
摘要： A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.

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