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    • 1. 发明授权
    • Microphonics suppression in high-speed communications systems
    • 高速通信系统中的麦克风抑制
    • US08644028B2
    • 2014-02-04
    • US12795438
    • 2010-06-07
    • Youming QinFrank S. MatsumotoEric Tiongson
    • Youming QinFrank S. MatsumotoEric Tiongson
    • H05K5/00
    • H05K5/0217H05K7/142H05K13/00Y10T29/49002
    • One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    • 诸如通信系统的电子系统中的一个设计方面是噪声抑制。 更具体地说,这涉及在诸如微波无线电系统的高速通信系统中的麦克风抑制。 本发明考虑了用于基本上消除由诸如振动和鼓效应的机械刺激产生的麦克风行为的系统设计。 优选的方法包括将主板与其安装线束(机械互连)隔离,并将回波阻尼和减震垫添加到外壳盖的下侧,以在保持其重量的同时加强外壳盖。 优选地,这种方法隔离整个母板而不是特定的部件。 使用这种方法的设计在分体式微波无线电系统的室外单元(ODU)中特别有用。
    • 2. 发明申请
    • MICROPHONICS SUPPRESSION IN HIGH-SPEED COMMUNICATIONS SYSTEMS
    • 高速通信系统中的麦克风抑制
    • US20080117614A1
    • 2008-05-22
    • US11560453
    • 2006-11-16
    • Youming QinFrank S. MatsumotoEric Tiongson
    • Youming QinFrank S. MatsumotoEric Tiongson
    • H05K7/02H03K5/00
    • H05K5/0217H05K7/142H05K13/00Y10T29/49002
    • One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    • 诸如通信系统的电子系统中的一个设计方面是噪声抑制。 更具体地说,这涉及在诸如微波无线电系统的高速通信系统中的麦克风抑制。 本发明考虑了用于基本上消除由诸如振动和鼓效应的机械刺激产生的麦克风行为的系统设计。 优选的方法包括将主板与其安装线束(机械互连)隔离,并将回波阻尼和减震垫添加到外壳盖的下侧,以在保持其重量的同时加强外壳盖。 优选地,这种方法隔离整个母板而不是特定的部件。 使用这种方法的设计在分体式微波无线电系统的室外单元(ODU)中特别有用。
    • 3. 发明申请
    • Microphonics Suppression in High-Speed Communications Systems
    • 高速通信系统中的麦克风抑制
    • US20100246147A1
    • 2010-09-30
    • US12795438
    • 2010-06-07
    • Youming QinFrank S. MatsumotoEric Tiongson
    • Youming QinFrank S. MatsumotoEric Tiongson
    • H05K7/14
    • H05K5/0217H05K7/142H05K13/00Y10T29/49002
    • One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    • 诸如通信系统的电子系统中的一个设计方面是噪声抑制。 更具体地说,这涉及在诸如微波无线电系统的高速通信系统中的麦克风抑制。 本发明考虑了用于基本上消除由诸如振动和鼓效应的机械刺激产生的麦克风行为的系统设计。 优选的方法包括将主板与其安装线束(机械互连)隔离,并将回波阻尼和减震垫添加到外壳盖的下侧,以在保持其重量的同时加强外壳盖。 优选地,这种方法隔离整个母板而不是特定的部件。 使用这种方法的设计在分体式微波无线电系统的室外单元(ODU)中特别有用。
    • 4. 发明授权
    • Microphonics suppression in high-speed communications systems
    • 高速通信系统中的麦克风抑制
    • US07733667B2
    • 2010-06-08
    • US11560453
    • 2006-11-16
    • Youming QinFrank S. MatsumotoEric Tiongson
    • Youming QinFrank S. MatsumotoEric Tiongson
    • H05K7/14H05K9/00
    • H05K5/0217H05K7/142H05K13/00Y10T29/49002
    • One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    • 诸如通信系统的电子系统中的一个设计方面是噪声抑制。 更具体地说,这涉及在诸如微波无线电系统的高速通信系统中的麦克风抑制。 本发明考虑了用于基本上消除由诸如振动和鼓效应的机械刺激产生的麦克风行为的系统设计。 优选的方法包括将主板与其安装线束(机械互连)隔离,并将回波阻尼和减震垫添加到外壳盖的下侧,以在保持其重量的同时加强外壳盖。 优选地,这种方法隔离整个母板而不是特定的部件。 使用这种方法的设计在分体式微波无线电系统的室外单元(ODU)中特别有用。
    • 7. 发明申请
    • System and method for compensation of phase hits
    • 相位补偿的系统和方法
    • US20080102761A1
    • 2008-05-01
    • US11588681
    • 2006-10-27
    • David C.M. PhamFrank S. MatsumotoYouming Qin
    • David C.M. PhamFrank S. MatsumotoYouming Qin
    • H04B1/40
    • H03L1/04G07F9/105G07F17/0078H03L7/06
    • A frequency synthesizer module with phase hits compensation, comprises an enclosure; a frequency synthesizer within the enclosure; and a heater module including a heater element in thermal communication with the frequency synthesizer for producing heat to adaptively adjust frequency synthesizer temperature. The frequency synthesizer module may be in an ODU and electrically isolated from the heater module. The heater module may include a posistor that varies based on temperature; and a voltage regulator having an input pin for receiving a varying input voltage, an output pin for providing a modifiable output voltage to the heater element for adaptively adjusting the heat generated thereby, and an adjust pin coupled to the posistor for maintaining a substantially constant voltage at the adjust pin. The heater module may heat when below room temperature, heat at less than maximum power when between room temperature and a threshold, and deactivate when above the threshold.
    • 具有相位匹配补偿的频率合成器模块,包括外壳; 外壳内的频率合成器; 以及加热器模块,其包括与频率合成器热连接的加热器元件,用于产生热量以自适应地调节频率合成器温度。 频率合成器模块可以在ODU中并且与加热器模块电隔离。 加热器模块可以包括基于温度变化的晶体管; 以及具有用于接收变化的输入电压的输入引脚的电压调节器,用于向加热器元件提供可修改的输出电压以便自适应地调节由此产生的热的输出引脚以及耦合到晶体管的调节引脚,用于维持基本恒定的电压 在调节销。 加热器模块在低于室温时可能会加热,当室温和阈值之间以小于最大功率的热量加热时,加热器模块可能在阈值以上时停用。