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    • 10. 发明申请
    • Methods for fabricating thin film transistors
    • 制造薄膜晶体管的方法
    • US20060111244A1
    • 2006-05-25
    • US11143698
    • 2005-06-02
    • Feng-Yuan GanHan-Tu Lin
    • Feng-Yuan GanHan-Tu Lin
    • H01L39/14
    • H01L29/66765H01L29/4908
    • A fabrication method of thin film transistor. A patterned gate is formed on an insulator substrate. A buffer layer is formed on the insulating substrate. The patterned gate is formed by plasma enhanced chemical vapor deposition (PECVD) using a mixture of silane, argon, nitrogen to serve as reactants at a temperature of approximately 20-200° C. A gate insulating layer is formed on the buffer layer. A semiconductor layer is formed on the gate insulating layer. A source/drain layer is formed on the semiconductor layer. The buffer layer protects the metal gate from damage during subsequent plasma enhanced chemical vapor deposition.
    • 薄膜晶体管的制造方法。 图案化栅极形成在绝缘体基板上。 在绝缘基板上形成缓冲层。 图案化的栅极通过使用硅烷,氩,氮的混合物的等离子体增强化学气相沉积(PECVD)形成,以在约20-200℃的温度下用作反应物。在缓冲层上形成栅极绝缘层。 在栅极绝缘层上形成半导体层。 源极/漏极层形成在半导体层上。 缓冲层在随后的等离子体增强化学气相沉积期间保护金属栅极免受损坏。